FR2485265A1 - Dispositif semiconducteur programmable et son procede de fabrication - Google Patents

Dispositif semiconducteur programmable et son procede de fabrication Download PDF

Info

Publication number
FR2485265A1
FR2485265A1 FR8109005A FR8109005A FR2485265A1 FR 2485265 A1 FR2485265 A1 FR 2485265A1 FR 8109005 A FR8109005 A FR 8109005A FR 8109005 A FR8109005 A FR 8109005A FR 2485265 A1 FR2485265 A1 FR 2485265A1
Authority
FR
France
Prior art keywords
strip
conductor
semiconductor
programmable
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8109005A
Other languages
English (en)
French (fr)
Other versions
FR2485265B1 (OSRAM
Inventor
Ties Siebolt Te Velde
Aris Slob
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2485265A1 publication Critical patent/FR2485265A1/fr
Application granted granted Critical
Publication of FR2485265B1 publication Critical patent/FR2485265B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/0036Switches making use of microelectromechanical systems [MEMS]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Weting (AREA)
FR8109005A 1980-05-08 1981-05-06 Dispositif semiconducteur programmable et son procede de fabrication Granted FR2485265A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8002635A NL8002635A (nl) 1980-05-08 1980-05-08 Programmeerbare halfgeleiderinrichting en werkwijze ter vervaardiging daarvan.

Publications (2)

Publication Number Publication Date
FR2485265A1 true FR2485265A1 (fr) 1981-12-24
FR2485265B1 FR2485265B1 (OSRAM) 1984-10-19

Family

ID=19835256

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8109005A Granted FR2485265A1 (fr) 1980-05-08 1981-05-06 Dispositif semiconducteur programmable et son procede de fabrication

Country Status (7)

Country Link
US (1) US4528583A (OSRAM)
JP (1) JPS5829630B2 (OSRAM)
AU (1) AU7014381A (OSRAM)
DE (1) DE3116324A1 (OSRAM)
FR (1) FR2485265A1 (OSRAM)
GB (1) GB2075750B (OSRAM)
NL (1) NL8002635A (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4356730A (en) * 1981-01-08 1982-11-02 International Business Machines Corporation Electrostatically deformographic switches
US4879587A (en) * 1986-11-13 1989-11-07 Transensory Devices, Inc. Apparatus and method for forming fusible links
US5121089A (en) * 1990-11-01 1992-06-09 Hughes Aircraft Company Micro-machined switch and method of fabrication
EP0852337A1 (en) * 1996-12-24 1998-07-08 STMicroelectronics S.r.l. A hermetically sealed semiconductor inertial sensor
US6288437B1 (en) * 1999-02-26 2001-09-11 Micron Technology, Inc. Antifuse structures methods and applications
EP1093143A1 (en) * 1999-10-15 2001-04-18 Lucent Technologies Inc. Flip-chip bonded micro-relay on integrated circuit chip
JP3775276B2 (ja) * 2001-10-24 2006-05-17 株式会社デンソー 静電アクチュエータ
US7196369B2 (en) * 2002-07-15 2007-03-27 Macronix International Co., Ltd. Plasma damage protection circuit for a semiconductor device
US7170816B2 (en) * 2004-12-16 2007-01-30 Macronix International Co., Ltd. Method and apparatus for passing charge from word lines during manufacture
US9490249B2 (en) 2014-04-30 2016-11-08 Macronix International Co., Ltd. Antenna effect discharge circuit and manufacturing method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2009775A1 (OSRAM) * 1968-05-31 1970-02-06 Westinghouse Electric Corp
FR2088515A1 (OSRAM) * 1970-05-12 1972-01-07 Siemens Ag
US3672985A (en) * 1970-05-05 1972-06-27 Westinghouse Electric Corp Conductor elements spaced from microelectronic component surface and methods of making the same
GB1311178A (en) * 1970-09-19 1973-03-21 Ferranti Ltd Semiconductor devices
FR2189869A1 (OSRAM) * 1972-06-20 1974-01-25 Western Electric Co
US4054484A (en) * 1975-10-23 1977-10-18 Bell Telephone Laboratories, Incorporated Method of forming crossover connections
US4089734A (en) * 1974-09-16 1978-05-16 Raytheon Company Integrated circuit fusing technique
FR2441923A1 (fr) * 1978-11-14 1980-06-13 Philips Nv Systeme de cablage, son procede de fabrication et dispositif semi-conducteur muni d'un tel systeme

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1154679A (en) * 1967-03-13 1969-06-11 Ncr Co Magnetic Field Sensing Device.
US3564354A (en) * 1968-12-11 1971-02-16 Signetics Corp Semiconductor structure with fusible link and method
US3575645A (en) * 1969-07-17 1971-04-20 Gen Motors Corp Power zener package
JPS5240081A (en) * 1975-09-26 1977-03-28 Hitachi Ltd Bi-polar rom
US4222062A (en) * 1976-05-04 1980-09-09 American Microsystems, Inc. VMOS Floating gate memory device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2009775A1 (OSRAM) * 1968-05-31 1970-02-06 Westinghouse Electric Corp
US3539705A (en) * 1968-05-31 1970-11-10 Westinghouse Electric Corp Microelectronic conductor configurations and method of making the same
US3672985A (en) * 1970-05-05 1972-06-27 Westinghouse Electric Corp Conductor elements spaced from microelectronic component surface and methods of making the same
FR2088515A1 (OSRAM) * 1970-05-12 1972-01-07 Siemens Ag
GB1311178A (en) * 1970-09-19 1973-03-21 Ferranti Ltd Semiconductor devices
US3781977A (en) * 1970-09-19 1974-01-01 Ferrant Ltd Semiconductor devices
FR2189869A1 (OSRAM) * 1972-06-20 1974-01-25 Western Electric Co
US4089734A (en) * 1974-09-16 1978-05-16 Raytheon Company Integrated circuit fusing technique
US4054484A (en) * 1975-10-23 1977-10-18 Bell Telephone Laboratories, Incorporated Method of forming crossover connections
FR2441923A1 (fr) * 1978-11-14 1980-06-13 Philips Nv Systeme de cablage, son procede de fabrication et dispositif semi-conducteur muni d'un tel systeme

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/ *

Also Published As

Publication number Publication date
NL8002635A (nl) 1981-12-01
JPS574154A (en) 1982-01-09
AU7014381A (en) 1981-11-12
GB2075750B (en) 1983-12-21
GB2075750A (en) 1981-11-18
DE3116324A1 (de) 1982-03-04
US4528583A (en) 1985-07-09
JPS5829630B2 (ja) 1983-06-23
FR2485265B1 (OSRAM) 1984-10-19

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