FR2484702B1 - Procede pour la fabrication de jonction pn de semi-conducteurs - Google Patents

Procede pour la fabrication de jonction pn de semi-conducteurs

Info

Publication number
FR2484702B1
FR2484702B1 FR8111863A FR8111863A FR2484702B1 FR 2484702 B1 FR2484702 B1 FR 2484702B1 FR 8111863 A FR8111863 A FR 8111863A FR 8111863 A FR8111863 A FR 8111863A FR 2484702 B1 FR2484702 B1 FR 2484702B1
Authority
FR
France
Prior art keywords
semiconductors
junction
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8111863A
Other languages
English (en)
French (fr)
Other versions
FR2484702A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR2484702A1 publication Critical patent/FR2484702A1/fr
Application granted granted Critical
Publication of FR2484702B1 publication Critical patent/FR2484702B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/012—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group II-IV materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/46—Sulfur-, selenium- or tellurium-containing compounds
    • C30B29/48—AIIBVI compounds wherein A is Zn, Cd or Hg, and B is S, Se or Te
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/04—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion materials in the liquid state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/86—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO
    • H10D62/864—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group II-VI materials, e.g. ZnO further characterised by the dopants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
    • H10P14/263—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using melted materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
    • H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2913—Materials being Group IIB-VIA materials
    • H10P14/2916—Selenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
    • H10P14/3431—Selenides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3444—P-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3446—Transition metal elements; Rare earth elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/12—Diffusion of dopants within, into or out of semiconductor bodies or layers between a solid phase and a gaseous phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14—Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10—Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17—Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Led Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
FR8111863A 1980-06-16 1981-06-16 Procede pour la fabrication de jonction pn de semi-conducteurs Expired FR2484702B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8121380A JPS577131A (en) 1980-06-16 1980-06-16 Manufacture of p-n junction

Publications (2)

Publication Number Publication Date
FR2484702A1 FR2484702A1 (fr) 1981-12-18
FR2484702B1 true FR2484702B1 (fr) 1985-07-05

Family

ID=13740199

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8111863A Expired FR2484702B1 (fr) 1980-06-16 1981-06-16 Procede pour la fabrication de jonction pn de semi-conducteurs

Country Status (5)

Country Link
US (1) US4526632A (OSRAM)
JP (1) JPS577131A (OSRAM)
DE (1) DE3123234C2 (OSRAM)
FR (1) FR2484702B1 (OSRAM)
GB (1) GB2081013B (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS575325A (en) * 1980-06-12 1982-01-12 Junichi Nishizawa Semicondoctor p-n junction device and manufacture thereof
JPS5863183A (ja) * 1981-10-09 1983-04-14 Semiconductor Res Found ２−６族間化合物の結晶成長法
JPS596583A (ja) * 1982-07-02 1984-01-13 Semiconductor Res Found ＺｎＳｅ青色発光ダイオ−ド
JPS6037077B2 (ja) * 1982-07-02 1985-08-23 財団法人 半導体研究振興会 ＺｎＳｅの結晶成長法
JPS598383A (ja) * 1982-07-06 1984-01-17 Semiconductor Res Found ＺｎＳｅ緑色発光ダイオ−ド
CA1203921A (en) * 1984-05-18 1986-04-29 Laszlo Szolgyemy Diffusion method to produce semiconductor devices
JPS60251631A (ja) * 1984-05-28 1985-12-12 Semiconductor Res Found 不均一不純物密度分布を有する半導体装置の製造方法
US5140385A (en) * 1987-03-27 1992-08-18 Misawa Co., Ltd. Light emitting element and method of manufacture
US4960721A (en) * 1987-11-10 1990-10-02 Kabushiki Kaisha Toshiba Method for purifying group II-IV compound semiconductors
US5169799A (en) * 1988-03-16 1992-12-08 Sumitomo Electric Industries, Ltd. Method for forming a doped ZnSe single crystal
JP2717256B2 (ja) * 1988-03-16 1998-02-18 社団法人生産技術振興協会 半導体結晶
US4904618A (en) * 1988-08-22 1990-02-27 Neumark Gertrude F Process for doping crystals of wide band gap semiconductors
US5252499A (en) * 1988-08-15 1993-10-12 Rothschild G F Neumark Wide band-gap semiconductors having low bipolar resistivity and method of formation
JP2525930B2 (ja) * 1990-05-15 1996-08-21 スタンレー電気株式会社 ▲ｉｉ▼―▲ｖｉ▼族化合物半導体の結晶成長方法
US5940163A (en) * 1994-07-19 1999-08-17 Electro Plasma Inc. Photon coupled color flat panel display and method of manufacture
US5861528A (en) * 1996-01-22 1999-01-19 Mitsui Chemicals, Inc. Process for preparing diels-alder addition product from conjugated diolefin and acrylonitrile
DE19918647A1 (de) * 1999-04-16 2000-10-26 Forschungsverbund Berlin Ev Verfahren zur Herstellung eines ZnSe-Volumeneinkristalls und lichtemittierendes Halbleiterbauelement mit einem solchen ZnSe-Volumeneinkristall
GB2361480B (en) * 2000-04-19 2002-06-19 Murata Manufacturing Co Method for forming p-type semiconductor film and light emitting device using the same
FR2816755B1 (fr) * 2000-11-13 2002-12-20 Commissariat Energie Atomique Procede de croissance d'un materiau semi-conducteur massif de type ii-vi
TWI513040B (zh) * 2010-02-09 2015-12-11 Epistar Corp 光電元件及其製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL111118C (OSRAM) * 1954-04-01
NL256342A (OSRAM) * 1959-09-29
US3070467A (en) * 1960-03-30 1962-12-25 Bell Telephone Labor Inc Treatment of gallium arsenide
US3568306A (en) * 1965-09-25 1971-03-09 Matsushita Electric Industrial Co Ltd Method of making photovoltaic device by electroplating
US3496429A (en) * 1967-08-21 1970-02-17 Zenith Radio Corp Solid state light sources
US3549434A (en) * 1968-09-19 1970-12-22 Gen Electric Low resisitivity group iib-vib compounds and method of formation
BE756471A (fr) * 1969-09-24 1971-03-01 Intel Corp Procede et appareil pour traiter les matieres semi-conductrices
US3551117A (en) * 1969-12-08 1970-12-29 Matsushita Electric Industrial Co Ltd Method for growing single crystals of iib-vib compounds
US3745073A (en) * 1971-02-26 1973-07-10 Zenith Radio Corp Single-step process for making p-n junctions in zinc selenide
US3670220A (en) * 1971-02-26 1972-06-13 Zenith Radio Corp Pn junctions in znse, zns, or zns/znse and semiconductor devices comprising such junctions
US4190486A (en) * 1973-10-04 1980-02-26 Hughes Aircraft Company Method for obtaining optically clear, high resistivity II-VI, III-V, and IV-VI compounds by heat treatment
US3940847A (en) * 1974-07-26 1976-03-02 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating ion implanted znse p-n junction devices
JPS5121777A (ja) * 1974-08-17 1976-02-21 Handotai Kenkyu Shinkokai Handotaisochi
JPS6037076B2 (ja) * 1980-06-11 1985-08-23 潤一 西澤 ３−６族化合物半導体の温度液相成長法
JPS577171A (en) * 1980-06-16 1982-01-14 Junichi Nishizawa Manufacture of znsepn junction

Also Published As

Publication number Publication date
JPS6333294B2 (OSRAM) 1988-07-05
JPS577131A (en) 1982-01-14
FR2484702A1 (fr) 1981-12-18
DE3123234C2 (de) 1986-02-13
US4526632A (en) 1985-07-02
GB2081013A (en) 1982-02-10
GB2081013B (en) 1984-08-22
DE3123234A1 (de) 1982-06-16

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