FR2476960A1 - Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede - Google Patents

Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede Download PDF

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Publication number
FR2476960A1
FR2476960A1 FR8004208A FR8004208A FR2476960A1 FR 2476960 A1 FR2476960 A1 FR 2476960A1 FR 8004208 A FR8004208 A FR 8004208A FR 8004208 A FR8004208 A FR 8004208A FR 2476960 A1 FR2476960 A1 FR 2476960A1
Authority
FR
France
Prior art keywords
parts
ceramic
intended
hermetic encapsulation
alumina
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8004208A
Other languages
English (en)
French (fr)
Other versions
FR2476960B1 (enExample
Inventor
Jean-Claude Resnau
Jean Doyen
Robert Ribier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8004208A priority Critical patent/FR2476960A1/fr
Priority to DE8181400285T priority patent/DE3160993D1/de
Priority to EP81400285A priority patent/EP0035438B1/fr
Priority to JP2556681A priority patent/JPS56133852A/ja
Priority to US06/238,600 priority patent/US4404745A/en
Publication of FR2476960A1 publication Critical patent/FR2476960A1/fr
Application granted granted Critical
Publication of FR2476960B1 publication Critical patent/FR2476960B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Ceramic Products (AREA)
  • Casings For Electric Apparatus (AREA)
FR8004208A 1980-02-26 1980-02-26 Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede Granted FR2476960A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8004208A FR2476960A1 (fr) 1980-02-26 1980-02-26 Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
DE8181400285T DE3160993D1 (en) 1980-02-26 1981-02-24 Method for the hermetic encapsulation of very high frequency electronic components comprising the making of metallic traverses, and device made by such a method
EP81400285A EP0035438B1 (fr) 1980-02-26 1981-02-24 Procédé d'encapsulation hermétique de composants électroniques à très haute fréquence comportant la pose de traversées métalliques, dispositif réalisé par un tel procédé
JP2556681A JPS56133852A (en) 1980-02-26 1981-02-25 Improvement in device for sealing ultrahigh frequency part in case
US06/238,600 US4404745A (en) 1980-02-26 1981-02-26 Process for sealing VHF component in case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8004208A FR2476960A1 (fr) 1980-02-26 1980-02-26 Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede

Publications (2)

Publication Number Publication Date
FR2476960A1 true FR2476960A1 (fr) 1981-08-28
FR2476960B1 FR2476960B1 (enExample) 1983-10-14

Family

ID=9238986

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8004208A Granted FR2476960A1 (fr) 1980-02-26 1980-02-26 Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede

Country Status (5)

Country Link
US (1) US4404745A (enExample)
EP (1) EP0035438B1 (enExample)
JP (1) JPS56133852A (enExample)
DE (1) DE3160993D1 (enExample)
FR (1) FR2476960A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2564826B1 (fr) * 1984-05-25 1986-08-22 Thomson Csf Procede d'assemblage d'au moins deux pieces en ceramique, presentant chacune au moins une surface plane
US4651415A (en) * 1985-03-22 1987-03-24 Diacon, Inc. Leaded chip carrier
US4914812A (en) * 1987-12-04 1990-04-10 General Electric Company Method of self-packaging an IC chip
US5661900A (en) * 1994-03-07 1997-09-02 Texas Instruments Incorporated Method of fabricating an ultrasonically welded plastic support ring
US6138349A (en) 1997-12-18 2000-10-31 Vlt Corporation Protective coating for an electronic device
KR101686745B1 (ko) 2015-08-07 2016-12-15 재단법인 다차원 스마트 아이티 융합시스템 연구단 파워 앰프 모듈 패키지 및 그 패키징 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404213A (en) * 1962-07-26 1968-10-01 Owens Illinois Inc Hermetic packages for electronic components
GB1369627A (en) 1970-12-18 1974-10-09 Hitachi Ltd Method for manufacturing a printed ceramic substrate
US3676569A (en) * 1971-01-04 1972-07-11 Sylvania Electric Prod Integrated circuit package
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
GB1474902A (en) * 1973-08-30 1977-05-25 Post Office Semiconductor devices
JPS5382170A (en) * 1976-12-28 1978-07-20 Ngk Insulators Ltd Method of producing coupled type ic ceramic package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置

Also Published As

Publication number Publication date
EP0035438B1 (fr) 1983-09-28
JPS56133852A (en) 1981-10-20
US4404745A (en) 1983-09-20
EP0035438A2 (fr) 1981-09-09
DE3160993D1 (en) 1983-11-03
FR2476960B1 (enExample) 1983-10-14
EP0035438A3 (en) 1981-09-23

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