JPS56133852A - Improvement in device for sealing ultrahigh frequency part in case - Google Patents

Improvement in device for sealing ultrahigh frequency part in case

Info

Publication number
JPS56133852A
JPS56133852A JP2556681A JP2556681A JPS56133852A JP S56133852 A JPS56133852 A JP S56133852A JP 2556681 A JP2556681 A JP 2556681A JP 2556681 A JP2556681 A JP 2556681A JP S56133852 A JPS56133852 A JP S56133852A
Authority
JP
Japan
Prior art keywords
improvement
case
frequency part
ultrahigh frequency
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2556681A
Other languages
English (en)
Japanese (ja)
Inventor
Kuroodo Resuneoo Jiin
Doien Jiin
Ribieru Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of JPS56133852A publication Critical patent/JPS56133852A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
JP2556681A 1980-02-26 1981-02-25 Improvement in device for sealing ultrahigh frequency part in case Pending JPS56133852A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8004208A FR2476960A1 (fr) 1980-02-26 1980-02-26 Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede

Publications (1)

Publication Number Publication Date
JPS56133852A true JPS56133852A (en) 1981-10-20

Family

ID=9238986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2556681A Pending JPS56133852A (en) 1980-02-26 1981-02-25 Improvement in device for sealing ultrahigh frequency part in case

Country Status (5)

Country Link
US (1) US4404745A (enExample)
EP (1) EP0035438B1 (enExample)
JP (1) JPS56133852A (enExample)
DE (1) DE3160993D1 (enExample)
FR (1) FR2476960A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2564826B1 (fr) * 1984-05-25 1986-08-22 Thomson Csf Procede d'assemblage d'au moins deux pieces en ceramique, presentant chacune au moins une surface plane
US4651415A (en) * 1985-03-22 1987-03-24 Diacon, Inc. Leaded chip carrier
US4914812A (en) * 1987-12-04 1990-04-10 General Electric Company Method of self-packaging an IC chip
US5661900A (en) * 1994-03-07 1997-09-02 Texas Instruments Incorporated Method of fabricating an ultrasonically welded plastic support ring
US6138349A (en) 1997-12-18 2000-10-31 Vlt Corporation Protective coating for an electronic device
KR101686745B1 (ko) 2015-08-07 2016-12-15 재단법인 다차원 스마트 아이티 융합시스템 연구단 파워 앰프 모듈 패키지 및 그 패키징 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404213A (en) * 1962-07-26 1968-10-01 Owens Illinois Inc Hermetic packages for electronic components
GB1369627A (en) 1970-12-18 1974-10-09 Hitachi Ltd Method for manufacturing a printed ceramic substrate
US3676569A (en) * 1971-01-04 1972-07-11 Sylvania Electric Prod Integrated circuit package
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package
GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
GB1474902A (en) * 1973-08-30 1977-05-25 Post Office Semiconductor devices
JPS5382170A (en) * 1976-12-28 1978-07-20 Ngk Insulators Ltd Method of producing coupled type ic ceramic package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置

Also Published As

Publication number Publication date
EP0035438B1 (fr) 1983-09-28
US4404745A (en) 1983-09-20
EP0035438A2 (fr) 1981-09-09
DE3160993D1 (en) 1983-11-03
FR2476960B1 (enExample) 1983-10-14
EP0035438A3 (en) 1981-09-23
FR2476960A1 (fr) 1981-08-28

Similar Documents

Publication Publication Date Title
DE3168278D1 (en) Bag closure
JPS57116886A (en) Sealing apparatus
AU81633S (en) sealing device
GB2124439B (en) Method and device for sealing
JPS5761823A (en) Sealing device
DE3373931D1 (en) Sealing device between movable parts
DE3380869D1 (en) Radio-wave sealing device
DE3376823D1 (en) Method and device for closing bags
JPS5779716A (en) Ultrahigh frequency hybrid mixer
JPS579362A (en) Seal device
JPS5742900A (en) Waste sealing device
DE3167811D1 (en) Sealing device
DE3165341D1 (en) Improved ultrahigh pressure apparatus
JPS57103885A (en) Sealing device for commodity
JPS56133852A (en) Improvement in device for sealing ultrahigh frequency part in case
DE3162928D1 (en) Magnetostatic volume wave device
GB8301182D0 (en) Apparatus for evacuating and sealing bags
YU190281A (en) Device for tightening filter bags
JPS56145667A (en) Sealing device
GB2120592B (en) Device for compressing cans
GB2130485B (en) Sealing device
GB2088824B (en) Bag closure
GB8312786D0 (en) Device for sealing
JPS56147985A (en) Sealing device
GB8327129D0 (en) Sealing and distribution device