FR2460347A1 - Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation - Google Patents

Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation Download PDF

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Publication number
FR2460347A1
FR2460347A1 FR7916900A FR7916900A FR2460347A1 FR 2460347 A1 FR2460347 A1 FR 2460347A1 FR 7916900 A FR7916900 A FR 7916900A FR 7916900 A FR7916900 A FR 7916900A FR 2460347 A1 FR2460347 A1 FR 2460347A1
Authority
FR
France
Prior art keywords
metallization
bath
metallization layer
deposition
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7916900A
Other languages
English (en)
French (fr)
Other versions
FR2460347B1 (enExample
Inventor
Andre Morteyrol
Jean-Pierre Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7916900A priority Critical patent/FR2460347A1/fr
Publication of FR2460347A1 publication Critical patent/FR2460347A1/fr
Application granted granted Critical
Publication of FR2460347B1 publication Critical patent/FR2460347B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7916900A 1979-06-29 1979-06-29 Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation Granted FR2460347A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7916900A FR2460347A1 (fr) 1979-06-29 1979-06-29 Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7916900A FR2460347A1 (fr) 1979-06-29 1979-06-29 Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation

Publications (2)

Publication Number Publication Date
FR2460347A1 true FR2460347A1 (fr) 1981-01-23
FR2460347B1 FR2460347B1 (enExample) 1983-10-07

Family

ID=9227309

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7916900A Granted FR2460347A1 (fr) 1979-06-29 1979-06-29 Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation

Country Status (1)

Country Link
FR (1) FR2460347A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855251A (en) * 1986-06-26 1989-08-08 Kabushiki Kaisha Toshiba Method of manufacturing electronic parts including transfer of bumps of larger particle sizes
EP0352721A3 (de) * 1988-07-29 1991-02-06 Nokia Unterhaltungselektronik (Deutschland) GmbH Verfahren zum galvanischem Metallisieren eines Substrats
US5006917A (en) * 1989-08-25 1991-04-09 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5120418A (en) * 1989-08-25 1992-06-09 International Business Machines Corporation Lead frame plating apparatus for thermocompression bonding
US5135155A (en) * 1989-08-25 1992-08-04 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5148261A (en) * 1989-08-25 1992-09-15 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
EP0538081A1 (fr) * 1991-10-16 1993-04-21 Sollac Procédé perfectionné de galvanoplastie d'une bande métallique
US5242569A (en) * 1989-08-25 1993-09-07 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990926A (en) * 1971-08-30 1976-11-09 Perstorp Ab Method for the production of material for printed circuits
FR2307890A1 (fr) * 1975-04-18 1976-11-12 Stauffer Chemical Co Procede de placage d'un substrat metallique comprenant une enduction intermediaire et une liaison par diffusion
JPS5235128A (en) * 1975-09-12 1977-03-17 Noge Denki Kogyo Kk Method of silver plating

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3990926A (en) * 1971-08-30 1976-11-09 Perstorp Ab Method for the production of material for printed circuits
FR2307890A1 (fr) * 1975-04-18 1976-11-12 Stauffer Chemical Co Procede de placage d'un substrat metallique comprenant une enduction intermediaire et une liaison par diffusion
JPS5235128A (en) * 1975-09-12 1977-03-17 Noge Denki Kogyo Kk Method of silver plating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CA1977 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855251A (en) * 1986-06-26 1989-08-08 Kabushiki Kaisha Toshiba Method of manufacturing electronic parts including transfer of bumps of larger particle sizes
EP0352721A3 (de) * 1988-07-29 1991-02-06 Nokia Unterhaltungselektronik (Deutschland) GmbH Verfahren zum galvanischem Metallisieren eines Substrats
US5006917A (en) * 1989-08-25 1991-04-09 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5120418A (en) * 1989-08-25 1992-06-09 International Business Machines Corporation Lead frame plating apparatus for thermocompression bonding
US5135155A (en) * 1989-08-25 1992-08-04 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5148261A (en) * 1989-08-25 1992-09-15 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
US5242569A (en) * 1989-08-25 1993-09-07 International Business Machines Corporation Thermocompression bonding in integrated circuit packaging
EP0538081A1 (fr) * 1991-10-16 1993-04-21 Sollac Procédé perfectionné de galvanoplastie d'une bande métallique
FR2682691A1 (fr) * 1991-10-16 1993-04-23 Lorraine Laminage Procede perfectionne de galvanoplastie d'une bande metallique.
US5344552A (en) * 1991-10-16 1994-09-06 Sollac Process for electroplating a metal strip

Also Published As

Publication number Publication date
FR2460347B1 (enExample) 1983-10-07

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