FR2460347B1 - - Google Patents
Info
- Publication number
- FR2460347B1 FR2460347B1 FR7916900A FR7916900A FR2460347B1 FR 2460347 B1 FR2460347 B1 FR 2460347B1 FR 7916900 A FR7916900 A FR 7916900A FR 7916900 A FR7916900 A FR 7916900A FR 2460347 B1 FR2460347 B1 FR 2460347B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7916900A FR2460347A1 (fr) | 1979-06-29 | 1979-06-29 | Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7916900A FR2460347A1 (fr) | 1979-06-29 | 1979-06-29 | Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2460347A1 FR2460347A1 (fr) | 1981-01-23 |
| FR2460347B1 true FR2460347B1 (enExample) | 1983-10-07 |
Family
ID=9227309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7916900A Granted FR2460347A1 (fr) | 1979-06-29 | 1979-06-29 | Procede de metallisation directe d'un substrat conducteur par galvanoplastie et substrat conducteur comportant une telle metallisation |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2460347A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS636850A (ja) * | 1986-06-26 | 1988-01-12 | Toshiba Corp | 電子部品の製造方法 |
| DE3825845A1 (de) * | 1988-07-29 | 1990-02-01 | Nokia Unterhaltungselektronik | Verfahren zum galvanischen metallisieren eines substrats |
| US5135155A (en) * | 1989-08-25 | 1992-08-04 | International Business Machines Corporation | Thermocompression bonding in integrated circuit packaging |
| US5120418A (en) * | 1989-08-25 | 1992-06-09 | International Business Machines Corporation | Lead frame plating apparatus for thermocompression bonding |
| US5148261A (en) * | 1989-08-25 | 1992-09-15 | International Business Machines Corporation | Thermocompression bonding in integrated circuit packaging |
| US5006917A (en) * | 1989-08-25 | 1991-04-09 | International Business Machines Corporation | Thermocompression bonding in integrated circuit packaging |
| US5242569A (en) * | 1989-08-25 | 1993-09-07 | International Business Machines Corporation | Thermocompression bonding in integrated circuit packaging |
| FR2682691B1 (fr) * | 1991-10-16 | 1994-01-14 | Sollac | Procede perfectionne de galvanoplastie d'une bande metallique. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE788117A (fr) * | 1971-08-30 | 1973-02-28 | Perstorp Ab | Procede de production d'elements pour circuits imprimes |
| SE7601702L (sv) * | 1975-04-18 | 1976-10-19 | Stauffer Chemical Co | Forfarande for pletering av metaller |
| JPS5235128A (en) * | 1975-09-12 | 1977-03-17 | Noge Denki Kogyo Kk | Method of silver plating |
-
1979
- 1979-06-29 FR FR7916900A patent/FR2460347A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2460347A1 (fr) | 1981-01-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |