FR2453500A1 - Dispositif redresseur pour alternateur de vehicule automobile - Google Patents

Dispositif redresseur pour alternateur de vehicule automobile

Info

Publication number
FR2453500A1
FR2453500A1 FR7908465A FR7908465A FR2453500A1 FR 2453500 A1 FR2453500 A1 FR 2453500A1 FR 7908465 A FR7908465 A FR 7908465A FR 7908465 A FR7908465 A FR 7908465A FR 2453500 A1 FR2453500 A1 FR 2453500A1
Authority
FR
France
Prior art keywords
support plate
soldered
section
sockets
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7908465A
Other languages
English (en)
Other versions
FR2453500B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEV ALTERNATEURS
Original Assignee
SEV ALTERNATEURS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEV ALTERNATEURS filed Critical SEV ALTERNATEURS
Priority to FR7908465A priority Critical patent/FR2453500A1/fr
Priority to DE19803011491 priority patent/DE3011491A1/de
Priority to JP4367480A priority patent/JPS55134950A/ja
Publication of FR2453500A1 publication Critical patent/FR2453500A1/fr
Application granted granted Critical
Publication of FR2453500B1 publication Critical patent/FR2453500B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

Abstract

Dispositif redresseur. Les éléments semi-conducteurs du dispositif redresseur sont soudés sur des socles prévus en relief sur une plaque-support en métal conducteur, chaque socle ayant une section transversale qui croît depuis sa zone de raccordement sur la plaque-support jusqu'à sa face d'extrémité où est soudé l'élément semi-conducteur ; chaque élément semi-conducteur est au moins partiellement enrobé d'une résine électriquement isolante qui est traversée par un conducteur filiforme soudé audit élément semi-conducteur. Destiné en particulier à équiper un alternateur pour véhicule automobile.
FR7908465A 1979-04-04 1979-04-04 Dispositif redresseur pour alternateur de vehicule automobile Granted FR2453500A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR7908465A FR2453500A1 (fr) 1979-04-04 1979-04-04 Dispositif redresseur pour alternateur de vehicule automobile
DE19803011491 DE3011491A1 (de) 1979-04-04 1980-03-25 Gleichrichter und verfahren zu dessen herstellung
JP4367480A JPS55134950A (en) 1979-04-04 1980-04-04 Rectifier unit and method of manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7908465A FR2453500A1 (fr) 1979-04-04 1979-04-04 Dispositif redresseur pour alternateur de vehicule automobile

Publications (2)

Publication Number Publication Date
FR2453500A1 true FR2453500A1 (fr) 1980-10-31
FR2453500B1 FR2453500B1 (fr) 1982-08-13

Family

ID=9223942

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7908465A Granted FR2453500A1 (fr) 1979-04-04 1979-04-04 Dispositif redresseur pour alternateur de vehicule automobile

Country Status (3)

Country Link
JP (1) JPS55134950A (fr)
DE (1) DE3011491A1 (fr)
FR (1) FR2453500A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8350378B2 (en) 2003-11-10 2013-01-08 Robert Bosch Gmbh Press-fit power diode

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19549202B4 (de) * 1995-12-30 2006-05-04 Robert Bosch Gmbh Gleichrichterdiode
DE10219762A1 (de) * 2002-05-02 2003-11-13 Vacuumschmelze Gmbh & Co Kg Vergussgehäuse für elektrische und elektronische Bauelemente, Vorrichtung daraus und Verfahren zum Herstellen

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3125709A (en) * 1960-10-17 1964-03-17 Housing assembly
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
FR1518374A (fr) * 1966-04-14 1968-03-22 Int Rectifier Corp Dispositif semi-conducteur
DE1564749A1 (de) * 1966-10-27 1970-01-08 Semikron Gleichrichterbau Halbleiteranordnung
FR1588451A (fr) * 1967-04-03 1970-04-17
FR2283552A1 (fr) * 1973-07-25 1976-03-26 Semikron Gleichrichterbau Dispositif redresseur a semi-conducteurs a refroidissement par fluide

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
DE1764795A1 (de) * 1968-01-12 1971-11-11 Siemens Ag Gleichrichteranordnung
JPS4713688U (fr) * 1971-03-15 1972-10-18
DE2727178A1 (de) * 1977-06-16 1979-01-04 Bosch Gmbh Robert Gleichrichteranordnung

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3125709A (en) * 1960-10-17 1964-03-17 Housing assembly
GB975573A (en) * 1961-05-26 1964-11-18 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
FR1518374A (fr) * 1966-04-14 1968-03-22 Int Rectifier Corp Dispositif semi-conducteur
DE1564749A1 (de) * 1966-10-27 1970-01-08 Semikron Gleichrichterbau Halbleiteranordnung
FR1588451A (fr) * 1967-04-03 1970-04-17
FR2283552A1 (fr) * 1973-07-25 1976-03-26 Semikron Gleichrichterbau Dispositif redresseur a semi-conducteurs a refroidissement par fluide

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8350378B2 (en) 2003-11-10 2013-01-08 Robert Bosch Gmbh Press-fit power diode

Also Published As

Publication number Publication date
FR2453500B1 (fr) 1982-08-13
DE3011491A1 (de) 1980-10-16
JPS55134950A (en) 1980-10-21

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Legal Events

Date Code Title Description
ST Notification of lapse