FR2444692A1 - Procede pour attaquer la surface d'un substrat de caprolactame en vue de la formation d'un depot chimique - Google Patents
Procede pour attaquer la surface d'un substrat de caprolactame en vue de la formation d'un depot chimiqueInfo
- Publication number
- FR2444692A1 FR2444692A1 FR7930962A FR7930962A FR2444692A1 FR 2444692 A1 FR2444692 A1 FR 2444692A1 FR 7930962 A FR7930962 A FR 7930962A FR 7930962 A FR7930962 A FR 7930962A FR 2444692 A1 FR2444692 A1 FR 2444692A1
- Authority
- FR
- France
- Prior art keywords
- caprolactam
- formation
- substrate
- chemical deposit
- attacking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 title abstract 6
- 230000015572 biosynthetic process Effects 0.000 title abstract 3
- 239000000126 substance Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 238000005234 chemical deposition Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000001143 conditioned effect Effects 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/14—Chemical modification with acids, their salts or anhydrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
- C08J2377/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97092978A | 1978-12-19 | 1978-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2444692A1 true FR2444692A1 (fr) | 1980-07-18 |
| FR2444692B1 FR2444692B1 (OSRAM) | 1984-08-24 |
Family
ID=25517722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7930962A Granted FR2444692A1 (fr) | 1978-12-19 | 1979-12-18 | Procede pour attaquer la surface d'un substrat de caprolactame en vue de la formation d'un depot chimique |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS55100972A (OSRAM) |
| CA (1) | CA1125630A (OSRAM) |
| DE (1) | DE2948133A1 (OSRAM) |
| FR (1) | FR2444692A1 (OSRAM) |
| GB (1) | GB2040970B (OSRAM) |
| IT (1) | IT1193252B (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2645048A1 (fr) * | 1989-04-04 | 1990-10-05 | Ppg Ind France Sa | Procede de traitement de surface de substrats en polyamide pour ameliorer l'adherence des revetements organiques |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4325991A (en) * | 1981-01-05 | 1982-04-20 | Crown City Plating Co. | Electroless plating of polyesters |
| DE3137587A1 (de) * | 1981-09-22 | 1983-04-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur vorbehandlung von formteilen aus polyamiden fuer das aufbringen haftfester, chemisch abgeschiedener metallbeschichtungen |
| JP2763776B2 (ja) * | 1988-05-27 | 1998-06-11 | 日本原子力研究所 | 細孔化コンタクトレンズの製造法 |
| WO2000015695A1 (en) * | 1998-09-14 | 2000-03-23 | H.B. Fuller Licensing & Financing, Inc. | Primer composition and method of use thereof |
| US7666471B2 (en) * | 2006-03-22 | 2010-02-23 | Mark Wojtaszek | Polyimide substrate and method of manufacturing printed wiring board using the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2239539A1 (OSRAM) * | 1973-08-01 | 1975-02-28 | Rhone Poulenc Textile |
-
1979
- 1979-11-07 GB GB7938565A patent/GB2040970B/en not_active Expired
- 1979-11-29 DE DE19792948133 patent/DE2948133A1/de not_active Ceased
- 1979-12-12 CA CA342,111A patent/CA1125630A/en not_active Expired
- 1979-12-17 IT IT28066/79A patent/IT1193252B/it active
- 1979-12-18 FR FR7930962A patent/FR2444692A1/fr active Granted
- 1979-12-19 JP JP16548279A patent/JPS55100972A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2239539A1 (OSRAM) * | 1973-08-01 | 1975-02-28 | Rhone Poulenc Textile |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2645048A1 (fr) * | 1989-04-04 | 1990-10-05 | Ppg Ind France Sa | Procede de traitement de surface de substrats en polyamide pour ameliorer l'adherence des revetements organiques |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2948133A1 (de) | 1980-06-26 |
| CA1125630A (en) | 1982-06-15 |
| FR2444692B1 (OSRAM) | 1984-08-24 |
| JPS55100972A (en) | 1980-08-01 |
| GB2040970A (en) | 1980-09-03 |
| IT7928066A0 (it) | 1979-12-17 |
| JPS639019B2 (OSRAM) | 1988-02-25 |
| GB2040970B (en) | 1983-07-20 |
| IT1193252B (it) | 1988-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |