FR2442690A1 - Metal de soudure prefaconne - Google Patents

Metal de soudure prefaconne

Info

Publication number
FR2442690A1
FR2442690A1 FR7926776A FR7926776A FR2442690A1 FR 2442690 A1 FR2442690 A1 FR 2442690A1 FR 7926776 A FR7926776 A FR 7926776A FR 7926776 A FR7926776 A FR 7926776A FR 2442690 A1 FR2442690 A1 FR 2442690A1
Authority
FR
France
Prior art keywords
alloy
ring
prefaconed
tin
essentially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7926776A
Other languages
English (en)
Other versions
FR2442690B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of FR2442690A1 publication Critical patent/FR2442690A1/fr
Application granted granted Critical
Publication of FR2442690B1 publication Critical patent/FR2442690B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Die Bonding (AREA)

Abstract

Un métal de soudure préfaçonné destiné au scellement hermétique d'un couvercle à un conteneur de conditionnement pour semi-conducteur comprend une bague plate relativement épaisse 15 d'un alliage comprenant essentiellement 63 % d'étain et 37 % de plomb et ayant la caractéristique de se solidifier depuis l'état fluide sous forme d'un mélange homogène. Chaque surface de cette bague porte un revêtement 16, 17 relativement fin consistant en un alliage résistant à l'oxydation comprenant essentiellement 96,5 % d'étain et 3,5 % d'argent. L'épaisseur de la bague est de l'ordre de 0,045 mm et l'épaisseur des revêtements d'alliage est de l'ordre de 0,0025 mm.
FR7926776A 1978-11-28 1979-10-29 Metal de soudure prefaconne Granted FR2442690A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96436578A 1978-11-28 1978-11-28

Publications (2)

Publication Number Publication Date
FR2442690A1 true FR2442690A1 (fr) 1980-06-27
FR2442690B1 FR2442690B1 (fr) 1984-04-27

Family

ID=25508461

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7926776A Granted FR2442690A1 (fr) 1978-11-28 1979-10-29 Metal de soudure prefaconne

Country Status (7)

Country Link
JP (1) JPS5573497A (fr)
CA (1) CA1099994A (fr)
DE (1) DE2943603C2 (fr)
FR (1) FR2442690A1 (fr)
GB (1) GB2036794A (fr)
IT (1) IT1126816B (fr)
NL (1) NL180811C (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178683A (en) * 1985-07-11 1987-02-18 Nat Semiconductor Corp Improved semiconductor die-attach method and product
GB8817192D0 (en) * 1988-07-19 1988-08-24 Raychem Pontoise Sa Solder & connection device incorporating solder
GB8903311D0 (en) * 1989-02-14 1989-04-05 Raychem Pontoise Sa Composite solder article
US5881945A (en) * 1997-04-30 1999-03-16 International Business Machines Corporation Multi-layer solder seal band for semiconductor substrates and process
KR19990029741A (ko) * 1997-09-29 1999-04-26 갈라스 윌리엄 이 금 도금되는 땜납 재료와 땜납을 이용하여 플럭스 없이 납땜하는 방법
US6958446B2 (en) * 2002-04-17 2005-10-25 Agilent Technologies, Inc. Compliant and hermetic solder seal
CN103157920A (zh) * 2013-04-16 2013-06-19 昆山市圣翰锡业有限公司 新型环保无铅低温波峰锡焊条

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2362893A (en) * 1942-04-04 1944-11-14 Metals & Controls Corp Solder

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4020987A (en) * 1975-09-22 1977-05-03 Norman Hascoe Solder preform for use in hermetically sealing a container

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2362893A (en) * 1942-04-04 1944-11-14 Metals & Controls Corp Solder

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/75 *

Also Published As

Publication number Publication date
GB2036794A (en) 1980-07-02
NL180811C (nl) 1987-05-04
IT1126816B (it) 1986-05-21
DE2943603A1 (de) 1980-05-29
NL7907537A (nl) 1980-05-30
NL180811B (nl) 1986-12-01
CA1099994A (fr) 1981-04-28
DE2943603C2 (de) 1982-05-19
IT7950617A0 (it) 1979-10-19
FR2442690B1 (fr) 1984-04-27
JPS5573497A (en) 1980-06-03

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse