IT1126816B - Lega preformata per saldature - Google Patents

Lega preformata per saldature

Info

Publication number
IT1126816B
IT1126816B IT50617/79A IT5061779A IT1126816B IT 1126816 B IT1126816 B IT 1126816B IT 50617/79 A IT50617/79 A IT 50617/79A IT 5061779 A IT5061779 A IT 5061779A IT 1126816 B IT1126816 B IT 1126816B
Authority
IT
Italy
Prior art keywords
welding
preformed alloy
preformed
alloy
Prior art date
Application number
IT50617/79A
Other languages
English (en)
Other versions
IT7950617A0 (it
Inventor
Norman Hascoe
Original Assignee
Semi Alloys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semi Alloys Inc filed Critical Semi Alloys Inc
Publication of IT7950617A0 publication Critical patent/IT7950617A0/it
Application granted granted Critical
Publication of IT1126816B publication Critical patent/IT1126816B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Coating With Molten Metal (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
IT50617/79A 1978-11-28 1979-10-19 Lega preformata per saldature IT1126816B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96436578A 1978-11-28 1978-11-28

Publications (2)

Publication Number Publication Date
IT7950617A0 IT7950617A0 (it) 1979-10-19
IT1126816B true IT1126816B (it) 1986-05-21

Family

ID=25508461

Family Applications (1)

Application Number Title Priority Date Filing Date
IT50617/79A IT1126816B (it) 1978-11-28 1979-10-19 Lega preformata per saldature

Country Status (7)

Country Link
JP (1) JPS5573497A (it)
CA (1) CA1099994A (it)
DE (1) DE2943603C2 (it)
FR (1) FR2442690A1 (it)
GB (1) GB2036794A (it)
IT (1) IT1126816B (it)
NL (1) NL180811C (it)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178683A (en) * 1985-07-11 1987-02-18 Nat Semiconductor Corp Improved semiconductor die-attach method and product
GB8817192D0 (en) * 1988-07-19 1988-08-24 Raychem Pontoise Sa Solder & connection device incorporating solder
GB8903311D0 (en) * 1989-02-14 1989-04-05 Raychem Pontoise Sa Composite solder article
US5881945A (en) * 1997-04-30 1999-03-16 International Business Machines Corporation Multi-layer solder seal band for semiconductor substrates and process
KR19990029741A (ko) 1997-09-29 1999-04-26 갈라스 윌리엄 이 금 도금되는 땜납 재료와 땜납을 이용하여 플럭스 없이 납땜하는 방법
US6958446B2 (en) 2002-04-17 2005-10-25 Agilent Technologies, Inc. Compliant and hermetic solder seal
CN103157920A (zh) * 2013-04-16 2013-06-19 昆山市圣翰锡业有限公司 新型环保无铅低温波峰锡焊条
CN114883274A (zh) * 2022-04-06 2022-08-09 合肥圣达电子科技实业有限公司 一种预制金锡焊料环的气密性封装盖板及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2362893A (en) * 1942-04-04 1944-11-14 Metals & Controls Corp Solder
US4020987A (en) * 1975-09-22 1977-05-03 Norman Hascoe Solder preform for use in hermetically sealing a container

Also Published As

Publication number Publication date
FR2442690B1 (it) 1984-04-27
DE2943603C2 (de) 1982-05-19
NL180811B (nl) 1986-12-01
JPS5573497A (en) 1980-06-03
IT7950617A0 (it) 1979-10-19
NL180811C (nl) 1987-05-04
CA1099994A (en) 1981-04-28
DE2943603A1 (de) 1980-05-29
FR2442690A1 (fr) 1980-06-27
NL7907537A (nl) 1980-05-30
GB2036794A (en) 1980-07-02

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