FR2439242A1 - Installation de revetement par pulverisation sous vide - Google Patents

Installation de revetement par pulverisation sous vide

Info

Publication number
FR2439242A1
FR2439242A1 FR7908918A FR7908918A FR2439242A1 FR 2439242 A1 FR2439242 A1 FR 2439242A1 FR 7908918 A FR7908918 A FR 7908918A FR 7908918 A FR7908918 A FR 7908918A FR 2439242 A1 FR2439242 A1 FR 2439242A1
Authority
FR
France
Prior art keywords
input
output
sas
carriers
valves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7908918A
Other languages
English (en)
Other versions
FR2439242B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of FR2439242A1 publication Critical patent/FR2439242A1/fr
Application granted granted Critical
Publication of FR2439242B1 publication Critical patent/FR2439242B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Abstract

CETTE INSTALLATION A HAUTE CADENCE POUR TRAITEMENT SOUS VIDE COMPREND UNE CHAMBRE DE TRAITEMENT 12 QUI COMPREND ELLE-MEME UNE PARTIE D'ENTREE 24, UNE PARTIE DE SORTIE 26 ET UNE PARTIE DE TRAITEMENT 25, DES ORIFICES D'ENTREE ET DE SORTIE FERMES PAR DES VANNES 17 ET 18 ET DES SAS D'ENTREE ET DE SORTIE 13 ET 14 FERMES A LEUR AUTRE EXTREMITE PAR DES VANNES 17 ET 19, DES TRANSPORTEURS ELEMENTAIRES, CHACUN A DEUX COURROIES, RESPECTIVEMENT DISPOSES DANS LES SAS, DANS LES PARTIES DE TRANSFERT D'ENTREE ET DE SORTIE, ET DANS LA PARTIE DE TRAITEMENT, LES TRANSPORTEURS 51 ET 52 DES PARTIES DE TRANSFERT POUVANT TRAVAILLER DANS LE MODE RAPIDE ET DANS LE MODE LENT TANDIS QUE LE TRANSPORTEUR 53 DE LA PARTIE DE TRAITEMENT PEUT TRAVAILLER UNIQUEMENT DANS LE MODE LENT, AINSI QUE DES TRANSPORTEURS 46, 47, 48 ET 49 QUI RELIENT UN POSTE DE CHARGEMENT ET DECHARGEMENT 41 AUX ENTREES DES SAS. CETTE INSTALLATION EST NOTAMMENT APPLICABLE A LA METALLISATION PAR PULVERISATION DE PIECES DE GRANDE LARGEUR POSEES SUR DES PLATEAUX 22.
FR7908918A 1978-04-07 1979-04-09 Installation de revetement par pulverisation sous vide Granted FR2439242A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/894,287 US4313815A (en) 1978-04-07 1978-04-07 Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor

Publications (2)

Publication Number Publication Date
FR2439242A1 true FR2439242A1 (fr) 1980-05-16
FR2439242B1 FR2439242B1 (fr) 1984-01-06

Family

ID=25402861

Family Applications (3)

Application Number Title Priority Date Filing Date
FR7908918A Granted FR2439242A1 (fr) 1978-04-07 1979-04-09 Installation de revetement par pulverisation sous vide
FR7932014A Granted FR2439243A1 (fr) 1978-04-07 1979-12-28 Installation de transport de pieces a travers une chambre de traitement sous vide et vanne d'isolement correspondante
FR7932015A Expired FR2439244B1 (fr) 1978-04-07 1979-12-28

Family Applications After (2)

Application Number Title Priority Date Filing Date
FR7932014A Granted FR2439243A1 (fr) 1978-04-07 1979-12-28 Installation de transport de pieces a travers une chambre de traitement sous vide et vanne d'isolement correspondante
FR7932015A Expired FR2439244B1 (fr) 1978-04-07 1979-12-28

Country Status (5)

Country Link
US (1) US4313815A (fr)
JP (1) JPS5511083A (fr)
DE (1) DE2913724A1 (fr)
FR (3) FR2439242A1 (fr)
IT (1) IT1166732B (fr)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
JPS5794338A (en) * 1980-12-04 1982-06-11 Tdk Corp Vapor deposition device
EP0122092A3 (fr) * 1983-04-06 1985-07-10 General Engineering Radcliffe Limited Dispositif de revêtement sous vide
US4534921A (en) * 1984-03-06 1985-08-13 Asm Fico Tooling, B.V. Method and apparatus for mold cleaning by reverse sputtering
US4533449A (en) * 1984-04-16 1985-08-06 The Perkin-Elmer Corporation Rapid surface figuring by selective deposition
US4606806A (en) * 1984-05-17 1986-08-19 Varian Associates, Inc. Magnetron sputter device having planar and curved targets
US4661228A (en) * 1984-05-17 1987-04-28 Varian Associates, Inc. Apparatus and method for manufacturing planarized aluminum films
US4761218A (en) * 1984-05-17 1988-08-02 Varian Associates, Inc. Sputter coating source having plural target rings
US5021138A (en) * 1985-01-17 1991-06-04 Babu Suryadevara V Side source center sink plasma reactor
US4663009A (en) * 1985-02-08 1987-05-05 Hewlett-Packard Company System and method for depositing plural thin film layers on a substrate
JPS62502846A (ja) * 1985-05-09 1987-11-12 シ−ゲイト・テクノロジ− 直列型ディスク・スパッタリング体系
US4749465A (en) * 1985-05-09 1988-06-07 Seagate Technology In-line disk sputtering system
US4894133A (en) * 1985-11-12 1990-01-16 Virgle L. Hedgcoth Method and apparatus making magnetic recording disk
US5082747A (en) * 1985-11-12 1992-01-21 Hedgcoth Virgle L Magnetic recording disk and sputtering process and apparatus for producing same
US4670126A (en) * 1986-04-28 1987-06-02 Varian Associates, Inc. Sputter module for modular wafer processing system
DE3634710A1 (de) * 1986-10-11 1988-04-21 Ver Glaswerke Gmbh Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung
US4795299A (en) * 1987-04-15 1989-01-03 Genus, Inc. Dial deposition and processing apparatus
US5591267A (en) * 1988-01-11 1997-01-07 Ohmi; Tadahiro Reduced pressure device
US5906688A (en) * 1989-01-11 1999-05-25 Ohmi; Tadahiro Method of forming a passivation film
US5225057A (en) * 1988-02-08 1993-07-06 Optical Coating Laboratory, Inc. Process for depositing optical films on both planar and non-planar substrates
US5618388A (en) * 1988-02-08 1997-04-08 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
US5798027A (en) * 1988-02-08 1998-08-25 Optical Coating Laboratory, Inc. Process for depositing optical thin films on both planar and non-planar substrates
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US5683072A (en) * 1988-11-01 1997-11-04 Tadahiro Ohmi Thin film forming equipment
US5789086A (en) * 1990-03-05 1998-08-04 Ohmi; Tadahiro Stainless steel surface having passivation film
DE3912295C2 (de) * 1989-04-14 1997-05-28 Leybold Ag Katodenzerstäubungsanlage
US6024843A (en) * 1989-05-22 2000-02-15 Novellus Systems, Inc. Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile
JPH03234979A (ja) * 1990-02-09 1991-10-18 Canon Inc 仕切り弁
DE4010495C2 (de) * 1990-03-31 1997-07-31 Leybold Ag Vorrichtung zum Beschichten eines Substrats mit Werkstoffen, beispielweise mit Metallen
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
USRE39824E1 (en) 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
EP0837491A3 (fr) * 1996-10-21 2000-11-15 Nihon Shinku Gijutsu Kabushiki Kaisha Dispositif de cathode composite de pulvérisation, et appareil de pulvérisation comportant une telle cathode composite
JP5026631B2 (ja) 1999-06-24 2012-09-12 株式会社アルバック スパッタリング装置
US6605195B2 (en) 2000-04-14 2003-08-12 Seagate Technology Llc Multi-layer deposition process using four ring sputter sources
CN102234784A (zh) * 2010-04-29 2011-11-09 鸿富锦精密工业（深圳）有限公司 镀膜系统
CN102021576B (zh) * 2010-09-30 2012-06-27 深圳市信诺泰创业投资企业(普通合伙) 一种连续生产挠性覆铜板的方法
CN103538894B (zh) * 2013-10-25 2015-08-05 山东开泰工业科技有限公司 一种360抛丸器制造生产线
JP2019052371A (ja) * 2017-09-14 2019-04-04 エフ・ハー・エル・アンラーゲンバウ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング ３ｄサブストレートを均一にコーティングするための方法及び装置
WO2019212512A1 (fr) * 2018-04-30 2019-11-07 Hewlett-Packard Development Company, L.P. Dépôt physique en phase vapeur multidirectionnel (pvd)
DE102019134546A1 (de) 2019-12-16 2021-06-17 VON ARDENNE Asset GmbH & Co. KG Verfahren, Steuervorrichtung und Vakuumanordnung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB747580A (en) * 1952-12-05 1956-04-11 Standard Telephones Cables Ltd Method of making thin metal layers by cathodic sputtering
FR1562286A (fr) * 1968-01-11 1969-04-04
FR2009759A1 (fr) * 1968-05-31 1970-02-06 Western Electric Co
FR1595037A (fr) * 1968-02-12 1970-06-08
FR2131390A5 (en) * 1971-03-25 1972-11-10 Delog Detag Flachglas Ag Conveyor belt cathode sputtering installation - - with lock and antechambers

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2350322A (en) * 1939-12-04 1944-06-06 Berl Ernst Process of making ammonium salts of aromatic compounds
US3968018A (en) * 1969-09-29 1976-07-06 Warner-Lambert Company Sputter coating method
US3641973A (en) * 1970-11-25 1972-02-15 Air Reduction Vacuum coating apparatus
JPS4715202U (fr) * 1971-03-20 1972-10-23
AU485283B2 (en) * 1971-05-18 1974-10-03 Warner-Lambert Company Method of making a razorblade
US3714925A (en) * 1971-07-30 1973-02-06 Gen Motors Corp Vacuum processing machine
JPS5322861B1 (fr) * 1972-07-12 1978-07-11
US3904506A (en) * 1972-11-13 1975-09-09 Shatterproof Glass Corp Apparatus for continuous production of sputter-coated glass products
CH573985A5 (fr) * 1973-11-22 1976-03-31 Balzers Patent Beteilig Ag
US3973753A (en) * 1974-03-18 1976-08-10 Varian Associates High vacuum gate valve
JPS51131461A (en) * 1975-05-13 1976-11-15 Ulvac Corp A vacuum treatment chamber apparatus
US4047624A (en) * 1975-10-21 1977-09-13 Airco, Inc. Workpiece handling system for vacuum processing
DE2606847C2 (de) * 1976-02-20 1982-11-25 Geissinger, Franz Absperrschieber
US4100055A (en) * 1977-06-10 1978-07-11 Varian Associates, Inc. Target profile for sputtering apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB747580A (en) * 1952-12-05 1956-04-11 Standard Telephones Cables Ltd Method of making thin metal layers by cathodic sputtering
FR1562286A (fr) * 1968-01-11 1969-04-04
FR1595037A (fr) * 1968-02-12 1970-06-08
FR2009759A1 (fr) * 1968-05-31 1970-02-06 Western Electric Co
FR2131390A5 (en) * 1971-03-25 1972-11-10 Delog Detag Flachglas Ag Conveyor belt cathode sputtering installation - - with lock and antechambers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/66 *

Also Published As

Publication number Publication date
DE2913724A1 (de) 1979-10-11
IT7921645A0 (it) 1979-04-06
JPS5511083A (en) 1980-01-25
FR2439243A1 (fr) 1980-05-16
FR2439243B1 (fr) 1983-04-15
FR2439244A1 (fr) 1980-05-16
IT1166732B (it) 1987-05-06
FR2439244B1 (fr) 1983-01-28
US4313815A (en) 1982-02-02
FR2439242B1 (fr) 1984-01-06

Similar Documents

Publication Publication Date Title
FR2439242A1 (fr) Installation de revetement par pulverisation sous vide
JPS5363851A (en) Push-pull pulse amplifier circuit
FR2345346A1 (fr) Ejecteur permettant l'emport de charges sous avion, qu'elles soient equipees d'anneaux ou de pieces dites selles
JPS57148363A (en) Gate array
NL168797C (nl) Werkwijze voor het neerslaan van complexen van ionen van zware metalen en polycarboxylaten uit oplossingen.
GB1295984A (fr)
JPS5711589A (en) Semiconductor device
EP0211441A3 (fr) Dispositif de ligne à retard à charge couplée
JPS5488553A (en) Method of and device for sorting row of articles
GB2118621B (en) Two stage i.c. engine supercharging
EP0349028A3 (fr) Circuit semiconducteur intégré comprenant une paire différentielle de transistors à effet de champ
JPS5511305A (en) Charge-coupling device for analog signal processing
JPS51130292A (en) Collection method of sample pieces such as ore
JPS5378177A (en) Field effect transistor
EP0307831A3 (fr) Additionneur haute vitesse
JPS5355815A (en) Powder transport vehicle
JPS53112640A (en) Driving method for charge transfer type semiconductor substrate
Turner et al. Individual Wafer Metallizing System-- a Case History
JPS57134594A (en) Surface treatment of loop-like wire rod
JPS54138281A (en) Joining and branching transport system
JPS53121365A (en) Transfer apparatus
JPS51124066A (en) Container travelling device at dust transporting stage
BURNEIKA et al. Helicon wave propagation in semiconductors with a complex band structure. I- Dispersion law for helicons in a linear hydrodynamic approximation(Helicon wave dispersion in cold multicomponent plasma of n-type Si and Ge semiconductors in linear hydrodynamic approximation)
JPS522972A (en) Articles conveying system
Sekine et al. A new type of silicon–tin rearrangement involving neighbouring group participation of an α-phosphoryl group

Legal Events

Date Code Title Description
ST Notification of lapse