FR2421466B1 - Dispositif permettant de refroidir, sur deux faces, des composants a semiconducteurs - Google Patents

Dispositif permettant de refroidir, sur deux faces, des composants a semiconducteurs

Info

Publication number
FR2421466B1
FR2421466B1 FR7907630A FR7907630A FR2421466B1 FR 2421466 B1 FR2421466 B1 FR 2421466B1 FR 7907630 A FR7907630 A FR 7907630A FR 7907630 A FR7907630 A FR 7907630A FR 2421466 B1 FR2421466 B1 FR 2421466B1
Authority
FR
France
Prior art keywords
cooling
sides
semiconductor components
semiconductor
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7907630A
Other languages
English (en)
Other versions
FR2421466A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2421466A1 publication Critical patent/FR2421466A1/fr
Application granted granted Critical
Publication of FR2421466B1 publication Critical patent/FR2421466B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR7907630A 1978-03-29 1979-03-27 Dispositif permettant de refroidir, sur deux faces, des composants a semiconducteurs Expired FR2421466B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782813529 DE2813529A1 (de) 1978-03-29 1978-03-29 Anordnung zur beidseitigen kuehlung von halbleiterbauelementen

Publications (2)

Publication Number Publication Date
FR2421466A1 FR2421466A1 (fr) 1979-10-26
FR2421466B1 true FR2421466B1 (fr) 1986-03-07

Family

ID=6035660

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7907630A Expired FR2421466B1 (fr) 1978-03-29 1979-03-27 Dispositif permettant de refroidir, sur deux faces, des composants a semiconducteurs

Country Status (4)

Country Link
DE (1) DE2813529A1 (fr)
FR (1) FR2421466B1 (fr)
GB (1) GB2018022B (fr)
IT (1) IT1113244B (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (de) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichterbaueinheit
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
FR2786656B1 (fr) * 1998-11-27 2001-01-26 Alstom Technology Composant electronique de puissance comportant des moyens de refroidissement

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1924011C3 (de) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Stromrichter mit zwei parallelen, durch Abstandsstücke getrennten Schienen
SE340321B (fr) * 1970-03-23 1971-11-15 Asea Ab

Also Published As

Publication number Publication date
IT1113244B (it) 1986-01-20
GB2018022A (en) 1979-10-10
FR2421466A1 (fr) 1979-10-26
DE2813529A1 (de) 1979-10-04
GB2018022B (en) 1982-07-07
IT7921328A0 (it) 1979-03-27

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Legal Events

Date Code Title Description
ST Notification of lapse