GB2018022B - Arrangement for cooling both sides of semi-conductor components - Google Patents

Arrangement for cooling both sides of semi-conductor components

Info

Publication number
GB2018022B
GB2018022B GB7910648A GB7910648A GB2018022B GB 2018022 B GB2018022 B GB 2018022B GB 7910648 A GB7910648 A GB 7910648A GB 7910648 A GB7910648 A GB 7910648A GB 2018022 B GB2018022 B GB 2018022B
Authority
GB
United Kingdom
Prior art keywords
semi
cooling
arrangement
sides
conductor components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7910648A
Other versions
GB2018022A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB2018022A publication Critical patent/GB2018022A/en
Application granted granted Critical
Publication of GB2018022B publication Critical patent/GB2018022B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB7910648A 1978-03-29 1979-03-27 Arrangement for cooling both sides of semi-conductor components Expired GB2018022B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782813529 DE2813529A1 (en) 1978-03-29 1978-03-29 ARRANGEMENT FOR BOTH SIDE COOLING OF SEMICONDUCTOR COMPONENTS

Publications (2)

Publication Number Publication Date
GB2018022A GB2018022A (en) 1979-10-10
GB2018022B true GB2018022B (en) 1982-07-07

Family

ID=6035660

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7910648A Expired GB2018022B (en) 1978-03-29 1979-03-27 Arrangement for cooling both sides of semi-conductor components

Country Status (4)

Country Link
DE (1) DE2813529A1 (en)
FR (1) FR2421466B1 (en)
GB (1) GB2018022B (en)
IT (1) IT1113244B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (en) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg SEMICONDUCTOR RECTIFIER UNIT
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
FR2786656B1 (en) * 1998-11-27 2001-01-26 Alstom Technology ELECTRONIC POWER COMPONENT CONTAINING COOLING MEANS

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1924011C3 (en) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Converter with two parallel rails separated by spacers
SE340321B (en) * 1970-03-23 1971-11-15 Asea Ab

Also Published As

Publication number Publication date
DE2813529A1 (en) 1979-10-04
IT1113244B (en) 1986-01-20
FR2421466B1 (en) 1986-03-07
GB2018022A (en) 1979-10-10
IT7921328A0 (en) 1979-03-27
FR2421466A1 (en) 1979-10-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee