IT1113244B - DEVICE FOR BILATERALLY COOLING SEMICONDUCTOR COMPONENTS - Google Patents

DEVICE FOR BILATERALLY COOLING SEMICONDUCTOR COMPONENTS

Info

Publication number
IT1113244B
IT1113244B IT7921328A IT2132879A IT1113244B IT 1113244 B IT1113244 B IT 1113244B IT 7921328 A IT7921328 A IT 7921328A IT 2132879 A IT2132879 A IT 2132879A IT 1113244 B IT1113244 B IT 1113244B
Authority
IT
Italy
Prior art keywords
bilaterally
semiconductor components
cooling semiconductor
cooling
components
Prior art date
Application number
IT7921328A
Other languages
Italian (it)
Other versions
IT7921328A0 (en
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of IT7921328A0 publication Critical patent/IT7921328A0/en
Application granted granted Critical
Publication of IT1113244B publication Critical patent/IT1113244B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT7921328A 1978-03-29 1979-03-27 DEVICE FOR BILATERALLY COOLING SEMICONDUCTOR COMPONENTS IT1113244B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782813529 DE2813529A1 (en) 1978-03-29 1978-03-29 ARRANGEMENT FOR BOTH SIDE COOLING OF SEMICONDUCTOR COMPONENTS

Publications (2)

Publication Number Publication Date
IT7921328A0 IT7921328A0 (en) 1979-03-27
IT1113244B true IT1113244B (en) 1986-01-20

Family

ID=6035660

Family Applications (1)

Application Number Title Priority Date Filing Date
IT7921328A IT1113244B (en) 1978-03-29 1979-03-27 DEVICE FOR BILATERALLY COOLING SEMICONDUCTOR COMPONENTS

Country Status (4)

Country Link
DE (1) DE2813529A1 (en)
FR (1) FR2421466B1 (en)
GB (1) GB2018022B (en)
IT (1) IT1113244B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (en) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg SEMICONDUCTOR RECTIFIER UNIT
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
US4809134A (en) * 1988-04-18 1989-02-28 Unisys Corporation Low stress liquid cooling assembly
US4965658A (en) * 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly
FR2786656B1 (en) * 1998-11-27 2001-01-26 Alstom Technology ELECTRONIC POWER COMPONENT CONTAINING COOLING MEANS

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1924011C3 (en) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Converter with two parallel rails separated by spacers
SE340321B (en) * 1970-03-23 1971-11-15 Asea Ab

Also Published As

Publication number Publication date
FR2421466A1 (en) 1979-10-26
IT7921328A0 (en) 1979-03-27
GB2018022B (en) 1982-07-07
DE2813529A1 (en) 1979-10-04
GB2018022A (en) 1979-10-10
FR2421466B1 (en) 1986-03-07

Similar Documents

Publication Publication Date Title
DE2965795D1 (en) Cooling structure for a semiconductor module
DE2965896D1 (en) Fluid cooled semiconductor device
BR7900229A (en) SEMICONDUCTOR DEVICE
IT1194477B (en) SEMICONDUCTOR LASER DEVICE
IT1131636B (en) SEMICONDUCTOR LASER DEVICE
SE8105257L (en) SEMICONDUCTOR DEVICE
SE7900083L (en) SEMICONDUCTOR DEVICE
DK546480A (en) DEFINING DEVICE FOR A COOLING EVAPER
NL7902239A (en) COOLING DEVICE.
GB2031644B (en) Semiconductor laser device
JPS5539697A (en) Semiconductor light device
DE2963342D1 (en) Semiconductor laser device
BE879196A (en) SEMICONDUCTOR DEVICE
DK525979A (en) Semiconductor LADNNGSOVERFOERINGSANORDNING
SE7902980L (en) SEMICONDUCTOR DEVICE
IT1141373B (en) SEMICONDUCTOR DEVICE
DE3022122A1 (en) SEMICONDUCTOR DEVICE
SE8106377L (en) SEMICONDUCTOR DEVICE
IT1113244B (en) DEVICE FOR BILATERALLY COOLING SEMICONDUCTOR COMPONENTS
KR840005919A (en) Semiconductor device
AT369059B (en) WASHING DEVICE FOR CHIPS
DE3337995A1 (en) COOLING DEVICE
SE7901535L (en) SEMICONDUCTOR DEVICE
IT1109773B (en) COOLING DEVICE FOR BRAMME
BR7904692A (en) SEMICONDUCTOR DEVICE