GB2018022A - Arrangement for cooling both sides of semiconductor components - Google Patents

Arrangement for cooling both sides of semiconductor components

Info

Publication number
GB2018022A
GB2018022A GB7910648A GB7910648A GB2018022A GB 2018022 A GB2018022 A GB 2018022A GB 7910648 A GB7910648 A GB 7910648A GB 7910648 A GB7910648 A GB 7910648A GB 2018022 A GB2018022 A GB 2018022A
Authority
GB
United Kingdom
Prior art keywords
cooling
semiconductor components
bar
compensating bodies
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7910648A
Other versions
GB2018022B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB2018022A publication Critical patent/GB2018022A/en
Application granted granted Critical
Publication of GB2018022B publication Critical patent/GB2018022B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An arrangement for cooling more than one semiconductor component (3, 4, 5) having a plate- or disc-shaped housing and electrodes (25, 26; 27, 28; and 29, 30) on opposite faces thereof, comprises two cooling bars (1, 2) between which the components are clamped. In order to compensate for differences in thickness of the semiconductor components (3, 4, 5), at least one of the cooling bars (1) is provided with cooled compensating bodies (12, 13, 14) which can be moved in openings in the bar in the direction of the semiconductor components. These compensating bodies are thermally and electrically connected to the cooling bar (1) by a sliding fit or a screw connection. The compensating bodies (12, 13, 14) are provided with annular grooves (18, Fig. 3) or with radial bores which communicate with a cooling fluid channel 6. The second cooling bar (2) may be provided with non adjustable inserts similar in construction to the compensating bodies (12, 13, 14). <IMAGE>
GB7910648A 1978-03-29 1979-03-27 Arrangement for cooling both sides of semi-conductor components Expired GB2018022B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782813529 DE2813529A1 (en) 1978-03-29 1978-03-29 ARRANGEMENT FOR BOTH SIDE COOLING OF SEMICONDUCTOR COMPONENTS

Publications (2)

Publication Number Publication Date
GB2018022A true GB2018022A (en) 1979-10-10
GB2018022B GB2018022B (en) 1982-07-07

Family

ID=6035660

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7910648A Expired GB2018022B (en) 1978-03-29 1979-03-27 Arrangement for cooling both sides of semi-conductor components

Country Status (4)

Country Link
DE (1) DE2813529A1 (en)
FR (1) FR2421466B1 (en)
GB (1) GB2018022B (en)
IT (1) IT1113244B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989010630A1 (en) * 1988-04-18 1989-11-02 Unisys Corporation Low stress liquid cooling assembly
EP0376478A2 (en) * 1988-12-29 1990-07-04 York International Corporation System for mounting and cooling power semiconductor devices
US6344686B1 (en) * 1998-11-27 2002-02-05 Alstom Holdings Power electronic component including cooling means

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3143336A1 (en) * 1981-10-31 1983-05-19 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg SEMICONDUCTOR RECTIFIER UNIT
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips
US5050036A (en) * 1989-10-24 1991-09-17 Amdahl Corporation Liquid cooled integrated circuit assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1924011C3 (en) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Converter with two parallel rails separated by spacers
SE340321B (en) * 1970-03-23 1971-11-15 Asea Ab

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989010630A1 (en) * 1988-04-18 1989-11-02 Unisys Corporation Low stress liquid cooling assembly
EP0376478A2 (en) * 1988-12-29 1990-07-04 York International Corporation System for mounting and cooling power semiconductor devices
EP0376478A3 (en) * 1988-12-29 1991-01-30 York International Corporation System for mounting and cooling power semiconductor devices
AU614888B2 (en) * 1988-12-29 1991-09-12 York International Corporation System for mounting and cooling power semiconductor devices
US6344686B1 (en) * 1998-11-27 2002-02-05 Alstom Holdings Power electronic component including cooling means

Also Published As

Publication number Publication date
IT1113244B (en) 1986-01-20
FR2421466A1 (en) 1979-10-26
DE2813529A1 (en) 1979-10-04
GB2018022B (en) 1982-07-07
FR2421466B1 (en) 1986-03-07
IT7921328A0 (en) 1979-03-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee