FR2417236A1 - Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads - Google Patents
Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leadsInfo
- Publication number
- FR2417236A1 FR2417236A1 FR7903065A FR7903065A FR2417236A1 FR 2417236 A1 FR2417236 A1 FR 2417236A1 FR 7903065 A FR7903065 A FR 7903065A FR 7903065 A FR7903065 A FR 7903065A FR 2417236 A1 FR2417236 A1 FR 2417236A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- circuit board
- conducting layer
- components
- component leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
Abstract
The printed circuit board assembly system incorporates an improved method of fixing the terminal wires of the electronic components onto the board. The panel phenomena in the soldered section of the component wires is avoided. This method achieves more compact wiring and improves component density. The conducting area on the printed circuit board is not drilled. There are preset holes (4) which are formed by drilling through the insulating layer (12) so that one end of the holes concerned (14) will be sealed off by the conducting layer. The dia. of the hole is smaller than that of the component leads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7903065A FR2417236A1 (en) | 1979-02-07 | 1979-02-07 | Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7903065A FR2417236A1 (en) | 1979-02-07 | 1979-02-07 | Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2417236A1 true FR2417236A1 (en) | 1979-09-07 |
Family
ID=9221679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7903065A Withdrawn FR2417236A1 (en) | 1979-02-07 | 1979-02-07 | Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2417236A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989003165A1 (en) * | 1987-10-05 | 1989-04-06 | Cray Research, Inc. | Wire/disk board-to-board interconnect device |
US4859188A (en) * | 1987-10-05 | 1989-08-22 | Cray Research, Inc. | Wire/disk board-to-board interconnect device |
-
1979
- 1979-02-07 FR FR7903065A patent/FR2417236A1/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989003165A1 (en) * | 1987-10-05 | 1989-04-06 | Cray Research, Inc. | Wire/disk board-to-board interconnect device |
US4859188A (en) * | 1987-10-05 | 1989-08-22 | Cray Research, Inc. | Wire/disk board-to-board interconnect device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |