FR2404682A1 - Procede de depot electrolytique notamment de zinc, de cuivre et de nickel-fer, et bains utilises dans ce but, renfermant une polyamine sulfamalkylee - Google Patents

Procede de depot electrolytique notamment de zinc, de cuivre et de nickel-fer, et bains utilises dans ce but, renfermant une polyamine sulfamalkylee

Info

Publication number
FR2404682A1
FR2404682A1 FR7818452A FR7818452A FR2404682A1 FR 2404682 A1 FR2404682 A1 FR 2404682A1 FR 7818452 A FR7818452 A FR 7818452A FR 7818452 A FR7818452 A FR 7818452A FR 2404682 A1 FR2404682 A1 FR 2404682A1
Authority
FR
France
Prior art keywords
sulfamalkylated
polyamine
nickel
zinc
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7818452A
Other languages
English (en)
Other versions
FR2404682B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of FR2404682A1 publication Critical patent/FR2404682A1/fr
Application granted granted Critical
Publication of FR2404682B1 publication Critical patent/FR2404682B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/22—Electroplating: Baths therefor from solutions of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Electrolytes et procédé de dépôt électrolytique de dépôts métalliques brillants. La présente invention concerne une composition de bain de revêtement électrolytique qui renferme une source d'ions zinc, cuivre, nickel et fer ou d'autres ions métalliques, et une polyamine sulfamalkylée qui est un produit réactionnel contenant des unités alkylsulfamates substituées sur l'azote, représentées par les formules générales suivantes :
FR7818452A 1977-10-03 1978-06-20 Procede de depot electrolytique notamment de zinc, de cuivre et de nickel-fer, et bains utilises dans ce but, renfermant une polyamine sulfamalkylee Granted FR2404682A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/839,081 US4134802A (en) 1977-10-03 1977-10-03 Electrolyte and method for electrodepositing bright metal deposits

Publications (2)

Publication Number Publication Date
FR2404682A1 true FR2404682A1 (fr) 1979-04-27
FR2404682B1 FR2404682B1 (fr) 1984-08-03

Family

ID=25278806

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7818452A Granted FR2404682A1 (fr) 1977-10-03 1978-06-20 Procede de depot electrolytique notamment de zinc, de cuivre et de nickel-fer, et bains utilises dans ce but, renfermant une polyamine sulfamalkylee

Country Status (7)

Country Link
US (1) US4134802A (fr)
JP (1) JPS5451933A (fr)
CA (1) CA1133417A (fr)
DE (1) DE2830572C2 (fr)
FR (1) FR2404682A1 (fr)
GB (1) GB2015031B (fr)
NL (1) NL7806765A (fr)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
GB2124637A (en) * 1982-08-03 1984-02-22 Bip Chemicals Ltd Polyethylene terephthalate moulding compositions
FR2534280A1 (fr) * 1982-10-11 1984-04-13 Inst Physikochimia Bain pour l'electrodeposition de revetements d'alliages brillants de nickel et de fer
US4434030A (en) 1982-11-12 1984-02-28 Institute Po Physikochimia Bath for the electrodeposition of bright nickel iron alloy
US5683568A (en) * 1996-03-29 1997-11-04 University Of Tulsa Electroplating bath for nickel-iron alloys and method
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6921467B2 (en) * 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6632292B1 (en) * 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6197181B1 (en) 1998-03-20 2001-03-06 Semitool, Inc. Apparatus and method for electrolytically depositing a metal on a microelectronic workpiece
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7585398B2 (en) * 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
CN1217034C (zh) * 1999-04-13 2005-08-31 塞米用具公司 具有改进的处理流体流的处理腔的工件处理装置
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6368475B1 (en) * 2000-03-21 2002-04-09 Semitool, Inc. Apparatus for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
WO2001090434A2 (fr) * 2000-05-24 2001-11-29 Semitool, Inc. Reglage d'electrodes utilisees dans un reacteur pour le traitement electrochimique d'une piece micro-electronique
WO2002004887A1 (fr) * 2000-07-08 2002-01-17 Semitool, Inc. Procedes et appareil de traitement microelectronique de pieces a usiner au moyen de la metrologie
WO2003018874A2 (fr) 2001-08-31 2003-03-06 Semitool, Inc. Appareil et procedes de traitement electrochimique de pieces microelectroniques
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7025866B2 (en) * 2002-08-21 2006-04-11 Micron Technology, Inc. Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
US7407689B2 (en) * 2003-06-26 2008-08-05 Atotech Deutschland Gmbh Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
JP2005029818A (ja) * 2003-07-09 2005-02-03 Ebara Corp めっき方法
US20050092611A1 (en) * 2003-11-03 2005-05-05 Semitool, Inc. Bath and method for high rate copper deposition
US20080264774A1 (en) * 2007-04-25 2008-10-30 Semitool, Inc. Method for electrochemically depositing metal onto a microelectronic workpiece
MY156690A (en) * 2010-03-18 2016-03-15 Basf Se Composition for metal electroplating comprising leveling agent
CN103160868A (zh) * 2011-12-17 2013-06-19 鞍钢重型机械有限责任公司 一种用于生产含硫活性镍的电解液及其使用方法
US9828686B2 (en) 2012-04-19 2017-11-28 Dipsol Chemicals Co., Ltd. Copper-nickel alloy electroplating bath and plating method
KR102266260B1 (ko) * 2016-06-30 2021-06-16 피피지 인더스트리즈 오하이오 인코포레이티드 개선된 크레이터 제어능을 갖는 전착성 코팅 조성물
CN109548405B (zh) * 2016-06-30 2021-11-16 Ppg工业俄亥俄公司 具有改进的凹坑控制的能电沉积的涂料组合物
PL3478773T3 (pl) * 2016-06-30 2021-12-20 Ppg Industries Ohio, Inc. Elektroosadzalna kompozycja powłokowa z ulepszoną kontrolą wgłębień

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2265878A1 (fr) * 1974-04-01 1975-10-24 Oxy Metal Industries Corp
FR2303871A1 (fr) * 1975-03-11 1976-10-08 Oxy Metal Industries Corp Procede d'obtention de depots electrolytiques de cuivre brillants et bien egalises, et bains utilises dans ce but
FR2307060A1 (fr) * 1975-04-09 1976-11-05 Popescu Francine Zingage galvanique alcalin brillant

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE819404C (de) * 1949-04-17 1951-10-31 Bayer Ag Verfahren zur Herstellung wasserloeslicher, stickstoffhaltiger Kondensationsprodukte
ZA75571B (en) * 1974-04-22 1976-01-28 Oxy Metal Industries Corp Composition for electrodeposition of metal deposits, its method of preparation and uses thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2265878A1 (fr) * 1974-04-01 1975-10-24 Oxy Metal Industries Corp
FR2303871A1 (fr) * 1975-03-11 1976-10-08 Oxy Metal Industries Corp Procede d'obtention de depots electrolytiques de cuivre brillants et bien egalises, et bains utilises dans ce but
FR2307060A1 (fr) * 1975-04-09 1976-11-05 Popescu Francine Zingage galvanique alcalin brillant

Also Published As

Publication number Publication date
FR2404682B1 (fr) 1984-08-03
GB2015031B (en) 1982-07-21
GB2015031A (en) 1979-09-05
NL7806765A (nl) 1979-04-05
DE2830572C2 (de) 1982-11-04
CA1133417A (fr) 1982-10-12
JPS5451933A (en) 1979-04-24
JPS5716198B2 (fr) 1982-04-03
DE2830572A1 (de) 1979-04-12
US4134802A (en) 1979-01-16

Similar Documents

Publication Publication Date Title
FR2404682A1 (fr) Procede de depot electrolytique notamment de zinc, de cuivre et de nickel-fer, et bains utilises dans ce but, renfermant une polyamine sulfamalkylee
US2830014A (en) Electroplating process
US2910413A (en) Brighteners for electroplating baths
FR2406676A1 (fr) Procede pour stabiliser des bains pour depot par galvanoplastie d'etain ou d'alliage d'etain
CN100529195C (zh) 用于镀金的无氰型电解溶液
US2905602A (en) Production of metal electrodeposits
US4144141A (en) Ammonia free palladium deposition using aminoacetic acid
DE1098781B (de) Bad zur Herstellung hochglaenzender galvanischer Metallueberzuege
GB1284677A (en) Improvements in or relating to chromium electro plating
ES8307933A1 (es) Un bano de electrodeposicion.
US4135991A (en) Bath and method for electroplating tin and/or lead
FR2397476A1 (fr) Bain acide destine a la production d'un depot electrolytique brillant de zinc et ses applications
ES8606536A1 (es) Un procedimiento para electrodepositar cinc y una aleacion de cinc que contiene niquel y-o cobalto sobre un sustrato conductor.
US2384300A (en) Electrolytic deposition of zinc
GB1000669A (en) Baths for the production of electrolytic metal coatings
FR2386620A1 (fr) Bains d'electrodeposition cataphoretiques contenant des sels de plomb solubles dans l'eau
US4247372A (en) Silver plating
FR2370802A1 (fr) Bain de metallisation au nickel-palladium pour depot electrolytique et procede de metallisation utilisant un tel bain
US3787297A (en) Zinc plating bath and method
ES476909A1 (es) Un procedimiento para la preparacion de un bano acuoso de galvanizado, no cianurado.
FR2355095A1 (fr) Procede et composition pour le depot electrolytique de nickel, cobalt et alliages de ceux-ci avec le fer
FR2423557A1 (fr) Procede et bains de depot electrolytique de zinc brillant utilisant un polymere de condensation alkyle comme agent de brillantage
FR2393858A1 (fr) Electrodeposition d'un alliage de fer, nickel et/ou cobalt
CN1078505A (zh) 无氰镀铜液及无氰镀铜方法
ES8304224A1 (es) Un procedimiento para la produccion de depositos de metal de paladio sobre un sustrato.

Legal Events

Date Code Title Description
CD Change of name or company name
TP Transmission of property
ST Notification of lapse