FR2389690A1 - - Google Patents
Info
- Publication number
- FR2389690A1 FR2389690A1 FR7813598A FR7813598A FR2389690A1 FR 2389690 A1 FR2389690 A1 FR 2389690A1 FR 7813598 A FR7813598 A FR 7813598A FR 7813598 A FR7813598 A FR 7813598A FR 2389690 A1 FR2389690 A1 FR 2389690A1
- Authority
- FR
- France
- Prior art keywords
- gold
- electroplating
- complex
- nitrosulfite
- goldsmith
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 abstract 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229910001020 Au alloy Inorganic materials 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- GGADWZFELTZMFF-UHFFFAOYSA-N [N+](=O)([O-])S(O)(O)=O Chemical compound [N+](=O)([O-])S(O)(O)=O GGADWZFELTZMFF-UHFFFAOYSA-N 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 229910052785 arsenic Inorganic materials 0.000 abstract 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- 229910052793 cadmium Inorganic materials 0.000 abstract 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- 239000003353 gold alloy Substances 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 abstract 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 abstract 1
- 229910052753 mercury Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- -1 platinum group metals Chemical class 0.000 abstract 1
- 229910052711 selenium Inorganic materials 0.000 abstract 1
- 239000011669 selenium Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052714 tellurium Inorganic materials 0.000 abstract 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052716 thallium Inorganic materials 0.000 abstract 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
L'invention concerne un procédé de dépôt électrolytique d'or. L'électrolyte d'électrodéposition d'un alliage d'or de l'invention comprend une solution aqueuse d'un complexe de nitrosulfite/or et un ou plusieurs métaux choisis parmi le cuivre, le nickel, le zinc, le cobalt, l'argent, les métaux du groupe du platine, le cadmium, le plomb, le mercure, l'arsenic, l'étain, le sélénium, le tellure, le manganèse, l'indium, l'antimoine, le fer, le bismuth et le thallium, sous forme d'un composé ou d'un complexe. L'invention est utilisée pour réaliser certains effets par dépôt électrolytique d'or sur des substrats tels qu'un article d'orfèvrerie ou des montures de lunettes métalliques.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1845077A GB1603632A (en) | 1977-05-03 | 1977-05-03 | Electroplating of gold alloy |
GB1331678 | 1978-04-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2389690A1 true FR2389690A1 (fr) | 1978-12-01 |
Family
ID=26249705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7813598A Pending FR2389690A1 (fr) | 1977-05-03 | 1978-05-03 |
Country Status (6)
Country | Link |
---|---|
US (1) | US4199416A (fr) |
CH (1) | CH612217A5 (fr) |
DE (1) | DE2819537A1 (fr) |
FR (1) | FR2389690A1 (fr) |
IT (1) | IT1109483B (fr) |
NL (1) | NL7804728A (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4366035A (en) * | 1979-04-24 | 1982-12-28 | Engelhard Corporation | Electrodeposition of gold alloys |
US4435253A (en) | 1983-01-28 | 1984-03-06 | Omi International Corporation | Gold sulphite electroplating solutions and methods |
DE3319772A1 (de) * | 1983-05-27 | 1984-11-29 | Schering AG, 1000 Berlin und 4709 Bergkamen | Bad fuer die galvanische abscheidung von goldlegierungen |
US4717459A (en) * | 1985-05-30 | 1988-01-05 | Shinko Electric Industries Co., Ltd. | Electrolytic gold plating solution |
US6150262A (en) * | 1996-03-27 | 2000-11-21 | Texas Instruments Incorporated | Silver-gold wire for wire bonding |
EP1013799A1 (fr) * | 1998-12-23 | 2000-06-28 | Half Tone Ltd. | Solution et procédé pour le dépôt électrolytique d'or et d'alliages d'or |
DE10110743A1 (de) * | 2001-02-28 | 2002-09-05 | Wieland Dental & Technik Gmbh | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
US20050092616A1 (en) * | 2003-11-03 | 2005-05-05 | Semitool, Inc. | Baths, methods, and tools for superconformal deposition of conductive materials other than copper |
US7615255B2 (en) * | 2005-09-07 | 2009-11-10 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
US7507321B2 (en) * | 2006-01-06 | 2009-03-24 | Solopower, Inc. | Efficient gallium thin film electroplating methods and chemistries |
US7892413B2 (en) * | 2006-09-27 | 2011-02-22 | Solopower, Inc. | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
US8066865B2 (en) * | 2008-05-19 | 2011-11-29 | Solopower, Inc. | Electroplating methods and chemistries for deposition of group IIIA-group via thin films |
US20090009281A1 (en) * | 2007-07-06 | 2009-01-08 | Cyntec Company | Fuse element and manufacturing method thereof |
US8425753B2 (en) * | 2008-05-19 | 2013-04-23 | Solopower, Inc. | Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films |
ITFI20120208A1 (it) * | 2012-10-12 | 2014-04-13 | Bluclad S R L | Soluzione per l'elettrodeposizione di una lega di oro e la lega da essa derivante. |
US11674235B2 (en) * | 2018-04-11 | 2023-06-13 | Hutchinson Technology Incorporated | Plating method to reduce or eliminate voids in solder applied without flux |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3981782A (en) * | 1972-07-28 | 1976-09-21 | Johnson Matthey & Co., Limited | Electroplating of gold and gold compounds therefor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2090049A (en) * | 1935-10-17 | 1937-08-17 | Du Pont | Cadmium plating |
US2469727A (en) * | 1944-03-30 | 1949-05-10 | Du Pont | Electrodeposition of nickel |
US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
-
1978
- 1978-05-02 US US05/902,113 patent/US4199416A/en not_active Expired - Lifetime
- 1978-05-03 IT IT22998/78A patent/IT1109483B/it active
- 1978-05-03 CH CH483578A patent/CH612217A5/xx not_active IP Right Cessation
- 1978-05-03 NL NL7804728A patent/NL7804728A/xx not_active Application Discontinuation
- 1978-05-03 DE DE19782819537 patent/DE2819537A1/de not_active Withdrawn
- 1978-05-03 FR FR7813598A patent/FR2389690A1/fr active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3981782A (en) * | 1972-07-28 | 1976-09-21 | Johnson Matthey & Co., Limited | Electroplating of gold and gold compounds therefor |
Also Published As
Publication number | Publication date |
---|---|
NL7804728A (nl) | 1978-11-07 |
IT7822998A0 (it) | 1978-05-03 |
US4199416A (en) | 1980-04-22 |
IT1109483B (it) | 1985-12-16 |
DE2819537A1 (de) | 1978-11-09 |
CH612217A5 (fr) | 1979-07-13 |
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