FR2382523A1 - Procede d'elimination selective d'un materiau semiconducteur par rapport a un autre materiau semiconducteur, et produit en resultant - Google Patents
Procede d'elimination selective d'un materiau semiconducteur par rapport a un autre materiau semiconducteur, et produit en resultantInfo
- Publication number
- FR2382523A1 FR2382523A1 FR7706202A FR7706202A FR2382523A1 FR 2382523 A1 FR2382523 A1 FR 2382523A1 FR 7706202 A FR7706202 A FR 7706202A FR 7706202 A FR7706202 A FR 7706202A FR 2382523 A1 FR2382523 A1 FR 2382523A1
- Authority
- FR
- France
- Prior art keywords
- substance
- radiation
- electrochemical
- another
- contg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 title abstract 2
- 239000000126 substance Substances 0.000 title 2
- 230000008030 elimination Effects 0.000 title 1
- 238000003379 elimination reaction Methods 0.000 title 1
- 230000001678 irradiating effect Effects 0.000 title 1
- 239000000463 material Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000004090 dissolution Methods 0.000 abstract 1
- 230000002285 radioactive effect Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
- H01L21/30635—Electrolytic etching of AIIIBV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Elimination d'un matériau par rapport à un autre matériau, par décapage électrochimique. La structure comportant les deux matériaux est irradiée par un rayonnement qu'absorbe le matériau à éliminer et qui traverse le matériau à conserver. Application notamment au décapage sélectif de structures comportant des matériaux III-V.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7706202A FR2382523A1 (fr) | 1977-03-03 | 1977-03-03 | Procede d'elimination selective d'un materiau semiconducteur par rapport a un autre materiau semiconducteur, et produit en resultant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7706202A FR2382523A1 (fr) | 1977-03-03 | 1977-03-03 | Procede d'elimination selective d'un materiau semiconducteur par rapport a un autre materiau semiconducteur, et produit en resultant |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2382523A1 true FR2382523A1 (fr) | 1978-09-29 |
FR2382523B1 FR2382523B1 (fr) | 1980-10-24 |
Family
ID=9187492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7706202A Granted FR2382523A1 (fr) | 1977-03-03 | 1977-03-03 | Procede d'elimination selective d'un materiau semiconducteur par rapport a un autre materiau semiconducteur, et produit en resultant |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2382523A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4482442A (en) * | 1981-07-09 | 1984-11-13 | At&T Bell Laboratories | Photoelectrochemical etching of n-type gallium arsenide |
US4622114A (en) * | 1984-12-20 | 1986-11-11 | At&T Bell Laboratories | Process of producing devices with photoelectrochemically produced gratings |
US4689125A (en) * | 1982-09-10 | 1987-08-25 | American Telephone & Telegraph Co., At&T Bell Labs | Fabrication of cleaved semiconductor lasers |
-
1977
- 1977-03-03 FR FR7706202A patent/FR2382523A1/fr active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4482442A (en) * | 1981-07-09 | 1984-11-13 | At&T Bell Laboratories | Photoelectrochemical etching of n-type gallium arsenide |
US4689125A (en) * | 1982-09-10 | 1987-08-25 | American Telephone & Telegraph Co., At&T Bell Labs | Fabrication of cleaved semiconductor lasers |
US4622114A (en) * | 1984-12-20 | 1986-11-11 | At&T Bell Laboratories | Process of producing devices with photoelectrochemically produced gratings |
Also Published As
Publication number | Publication date |
---|---|
FR2382523B1 (fr) | 1980-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |