FR2377949A1 - Emballage pour disques semi-conducteurs - Google Patents

Emballage pour disques semi-conducteurs

Info

Publication number
FR2377949A1
FR2377949A1 FR7801611A FR7801611A FR2377949A1 FR 2377949 A1 FR2377949 A1 FR 2377949A1 FR 7801611 A FR7801611 A FR 7801611A FR 7801611 A FR7801611 A FR 7801611A FR 2377949 A1 FR2377949 A1 FR 2377949A1
Authority
FR
France
Prior art keywords
discs
cones
disks
packaging
lower element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7801611A
Other languages
English (en)
Other versions
FR2377949B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Wacker Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Siltronic AG filed Critical Wacker Siltronic AG
Publication of FR2377949A1 publication Critical patent/FR2377949A1/fr
Application granted granted Critical
Publication of FR2377949B1 publication Critical patent/FR2377949B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B65D25/107—Grooves, ribs, or the like, situated on opposed walls and between which the articles are located

Abstract

Claie empilable pour emballage de disques semi-conducteurs, comprenant un élement inférieur recevant les disques et un couvercle correspondant. Cette claie en matière plastique inerte vis-à-vis des disques fabriquée par emboutissage et l'élément inférieur comporte sur ses deux grands côtés verticaux des nervures de guidage des bisques et dans le fond des nervures de stabilisation, la partie inférieure des grands côtés étant pliée vers l'intérieur et comportant dans les surfaces de transition des protubérances servant de points d'appui aux disques et le couvercle à parois latérales verticales est muni à l'intérieur de deux rangées longitudinales de cônes de retenue à surface de base jointive, chaque disque étant maintenu sur sa circonférence entre deux cônes de chaque rangée.
FR7801611A 1977-01-21 1978-01-20 Emballage pour disques semi-conducteurs Granted FR2377949A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2702464A DE2702464C2 (de) 1977-01-21 1977-01-21 Verpackung von Halbleiterscheiben

Publications (2)

Publication Number Publication Date
FR2377949A1 true FR2377949A1 (fr) 1978-08-18
FR2377949B1 FR2377949B1 (fr) 1981-01-09

Family

ID=5999240

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7801611A Granted FR2377949A1 (fr) 1977-01-21 1978-01-20 Emballage pour disques semi-conducteurs

Country Status (9)

Country Link
US (1) US4160504A (fr)
JP (1) JPS5392661A (fr)
BE (1) BE863111A (fr)
DE (1) DE2702464C2 (fr)
DK (1) DK10378A (fr)
FR (1) FR2377949A1 (fr)
GB (1) GB1586526A (fr)
IT (1) IT1102016B (fr)
NL (1) NL7714275A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0159416A2 (fr) * 1984-04-12 1985-10-30 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Empaquetage pour plaques à semi-conducteurs
WO1996039711A1 (fr) * 1995-06-06 1996-12-12 Fluoroware, Inc. Dispositif de calage pour emballage d'expedition de plaquettes semi-conductrices

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59199477A (ja) * 1983-04-25 1984-11-12 住友電気工業株式会社 ウエハ−ボツクス
US4520925A (en) * 1983-08-09 1985-06-04 Empak Inc. Package
US4557382A (en) * 1983-08-17 1985-12-10 Empak Inc. Disk package
US4668484A (en) * 1984-02-13 1987-05-26 Elliott David J Transport containers for semiconductor wafers
USRE33361E (en) * 1984-06-07 1990-10-02 Substrate and media carrier
US4588086A (en) * 1984-06-07 1986-05-13 Coe Thomas U Substrate and media carrier
US4669612A (en) * 1985-02-20 1987-06-02 Empak Inc. Disk processing cassette
US4793488A (en) * 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
JPH0278246A (ja) * 1988-09-14 1990-03-19 Kakizaki Seisakusho:Kk 薄板処理用バスケット
US5046615A (en) * 1989-04-03 1991-09-10 Fluoroware, Inc. Disk shipper
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5273159A (en) * 1992-05-26 1993-12-28 Empak, Inc. Wafer suspension box
US5348151A (en) * 1993-12-20 1994-09-20 Empak, Inc. Low profile disk carrier
TW296361B (fr) * 1995-06-26 1997-01-21 Kakizaki Seisakusho Kk
USD378873S (en) * 1995-10-13 1997-04-22 Empak, Inc. 300 mm microenvironment pod with door on side
USD387903S (en) * 1995-10-13 1997-12-23 Empak, Inc. Shipping container
USD383898S (en) * 1995-10-13 1997-09-23 Empak, Inc. Combination shipping and transport cassette
US5709065A (en) * 1996-07-31 1998-01-20 Empak, Inc. Desiccant substrate package
US5921397A (en) * 1996-12-10 1999-07-13 Empak, Inc. Disk cassette
US6070730A (en) * 1997-06-18 2000-06-06 Fluoroware, Inc. Disk container
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
TW522448B (en) * 2001-10-22 2003-03-01 Advanced Semiconductor Eng Semiconductor wafer carrying apparatus
US7252199B2 (en) * 2004-03-26 2007-08-07 Entegris, Inc. Disk cassette system
WO2006011609A1 (fr) * 2004-07-30 2006-02-02 Showa Denko K.K. Boitier de disque magnetique
JP2006062704A (ja) * 2004-08-26 2006-03-09 Miraial Kk 薄板支持容器
US7967146B2 (en) * 2007-08-08 2011-06-28 E.Pak International, Inc. Container
JP4999808B2 (ja) * 2008-09-29 2012-08-15 東京エレクトロン株式会社 基板処理装置
JP5473691B2 (ja) * 2010-03-16 2014-04-16 株式会社ディスコ 収容カセット
DE102015217208A1 (de) * 2015-09-09 2017-03-09 Bayerische Motoren Werke Aktiengesellschaft Stapelvorrichtung zum Stapeln von Lack- und Montagestopfen
WO2023049117A1 (fr) * 2021-09-22 2023-03-30 Entegris, Inc. Support de traitement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164478A (en) * 1961-12-15 1965-01-05 Poster Packaging Inc Doughnut package
US3212907A (en) * 1962-03-27 1965-10-19 Plastic Packaging Products Ltd Food package and tray
US3322267A (en) * 1964-06-12 1967-05-30 Pantasote Company Of New York Multiple-cavity cookie container
US3223234A (en) * 1965-02-01 1965-12-14 Pantasota Company End support for fragile tubular articles
US3467242A (en) * 1968-03-04 1969-09-16 Dale E De Rousse Storage unit for wafer-like articles
US3534862A (en) * 1968-09-13 1970-10-20 Rca Corp Semiconductor wafer transporting jig
US3923156A (en) * 1974-04-29 1975-12-02 Fluoroware Inc Wafer basket
US3961877A (en) * 1974-09-11 1976-06-08 Fluoroware, Inc. Reinforced wafer basket
US3980226A (en) * 1975-05-05 1976-09-14 Franz Charles F Evacuateable bag
US4043451A (en) * 1976-03-18 1977-08-23 Fluoroware, Inc. Shipping container for silicone semiconductor wafers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0159416A2 (fr) * 1984-04-12 1985-10-30 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Empaquetage pour plaques à semi-conducteurs
EP0159416A3 (fr) * 1984-04-12 1988-07-27 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Empaquetage pour plaques à semi-conducteurs
WO1996039711A1 (fr) * 1995-06-06 1996-12-12 Fluoroware, Inc. Dispositif de calage pour emballage d'expedition de plaquettes semi-conductrices

Also Published As

Publication number Publication date
DK10378A (da) 1978-07-22
NL7714275A (nl) 1978-07-25
IT1102016B (it) 1985-10-07
DE2702464C2 (de) 1981-10-15
BE863111A (fr) 1978-07-20
FR2377949B1 (fr) 1981-01-09
US4160504A (en) 1979-07-10
IT7847702A0 (it) 1978-01-19
JPS559822B2 (fr) 1980-03-12
GB1586526A (en) 1981-03-18
DE2702464A1 (de) 1978-07-27
JPS5392661A (en) 1978-08-14

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Legal Events

Date Code Title Description
ST Notification of lapse