FR2353656B1 - - Google Patents
Info
- Publication number
- FR2353656B1 FR2353656B1 FR7716583A FR7716583A FR2353656B1 FR 2353656 B1 FR2353656 B1 FR 2353656B1 FR 7716583 A FR7716583 A FR 7716583A FR 7716583 A FR7716583 A FR 7716583A FR 2353656 B1 FR2353656 B1 FR 2353656B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH707176A CH615464A5 (en) | 1976-06-01 | 1976-06-01 | Special compositions and particular additives for gold electrolysis baths and their use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2353656A1 FR2353656A1 (fr) | 1977-12-30 |
| FR2353656B1 true FR2353656B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1980-10-24 |
Family
ID=4319470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7716583A Granted FR2353656A1 (fr) | 1976-06-01 | 1977-05-31 | Composition d'addition pour bains electrolytiques de placage d'or et d'alliages d'or et son utilisation pour ameliorer ceux-ci |
Country Status (3)
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH622829A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1977-08-29 | 1981-04-30 | Systemes Traitements Surfaces | |
| US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
| DE3472115D1 (en) * | 1983-02-07 | 1988-07-21 | Heinz Emmenegger | Galvanic bath for the electroplating of a gold-copper-cadmium alloy, process for using it and article resulting from the process |
| DE3319772A1 (de) * | 1983-05-27 | 1984-11-29 | Schering AG, 1000 Berlin und 4709 Bergkamen | Bad fuer die galvanische abscheidung von goldlegierungen |
| DE3328067A1 (de) * | 1983-08-03 | 1985-02-21 | Siemens AG, 1000 Berlin und 8000 München | Bad und verfahren zum galvanischen abscheiden von edelmetall- und edelmetallhaltigen dispersionsueberzuegen |
| ATE86313T1 (de) * | 1987-08-21 | 1993-03-15 | Engelhard Ltd | Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung. |
| DE3805627A1 (de) † | 1988-02-24 | 1989-09-07 | Wieland Edelmetalle | Goldbad |
| GB2225026A (en) * | 1988-11-22 | 1990-05-23 | American Chem & Refining Co | Electroless gold plating composition |
| DE10110743A1 (de) * | 2001-02-28 | 2002-09-05 | Wieland Dental & Technik Gmbh | Bad zur galvanischen Abscheidung von Gold und Goldlegierungen sowie dessen Verwendung |
| JP4719822B2 (ja) * | 2008-06-11 | 2011-07-06 | 日本高純度化学株式会社 | 電解金めっき液及びそれを用いて得られた金皮膜 |
| JP2014139348A (ja) * | 2008-08-25 | 2014-07-31 | Electroplating Eng Of Japan Co | 硬質金系めっき液 |
| JP5513784B2 (ja) * | 2008-08-25 | 2014-06-04 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 硬質金系めっき液 |
| DE102011056318B3 (de) * | 2011-12-13 | 2013-04-18 | Doduco Gmbh | Elektrolytisches Bad zum Abscheiden einer Goldkupferlegierung |
| CN102517614B (zh) * | 2011-12-20 | 2014-11-19 | 安徽华东光电技术研究所 | 一种在铝硅合金上电镀金的镀液配方及其电镀方法 |
| CN103741180B (zh) * | 2014-01-10 | 2015-11-25 | 哈尔滨工业大学 | 无氰光亮电镀金添加剂及其应用 |
| US20160145756A1 (en) * | 2014-11-21 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Environmentally friendly gold electroplating compositions and methods |
| EP3604626A1 (en) | 2018-08-03 | 2020-02-05 | COVENTYA S.p.A. | Electroplating bath for depositing a black alloy, method for the electrochemical deposition of a black alloy on a substrate, a black alloy and an article coated with such black alloy |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH286122A (fr) * | 1952-04-28 | 1952-10-15 | Spreter Victor | Procédé pour le dépôt de revêtements en or ou en alliages d'or par voie galvanique. |
| US3833488A (en) * | 1971-08-20 | 1974-09-03 | Auric Corp | Gold electroplating baths and process |
| US3776822A (en) * | 1972-03-27 | 1973-12-04 | Engelhard Min & Chem | Gold plating electrolyte |
-
1976
- 1976-06-01 CH CH707176A patent/CH615464A5/fr not_active IP Right Cessation
-
1977
- 1977-05-26 DE DE19772723910 patent/DE2723910C2/de not_active Expired
- 1977-05-31 FR FR7716583A patent/FR2353656A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE2723910C2 (de) | 1984-03-01 |
| CH615464A5 (en) | 1980-01-31 |
| FR2353656A1 (fr) | 1977-12-30 |
| DE2723910A1 (de) | 1977-12-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |