FR2317770A1 - Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similaires - Google Patents

Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similaires

Info

Publication number
FR2317770A1
FR2317770A1 FR7619343A FR7619343A FR2317770A1 FR 2317770 A1 FR2317770 A1 FR 2317770A1 FR 7619343 A FR7619343 A FR 7619343A FR 7619343 A FR7619343 A FR 7619343A FR 2317770 A1 FR2317770 A1 FR 2317770A1
Authority
FR
France
Prior art keywords
realization
integrated
electronic components
similar type
conductive filaments
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7619343A
Other languages
English (en)
French (fr)
Other versions
FR2317770B1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/667,541 external-priority patent/US4140265A/en
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of FR2317770A1 publication Critical patent/FR2317770A1/fr
Application granted granted Critical
Publication of FR2317770B1 publication Critical patent/FR2317770B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
    • C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
    • C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR7619343A 1975-06-26 1976-06-25 Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similaires Granted FR2317770A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59057275A 1975-06-26 1975-06-26
US05/667,541 US4140265A (en) 1975-06-26 1976-03-16 Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element

Publications (2)

Publication Number Publication Date
FR2317770A1 true FR2317770A1 (fr) 1977-02-04
FR2317770B1 FR2317770B1 (https=) 1978-05-05

Family

ID=27080881

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7619343A Granted FR2317770A1 (fr) 1975-06-26 1976-06-25 Procede et appareil pour connecter des filaments conducteurs a des surfaces de borne pour la realisation de composants electroniques de type integre et similaires

Country Status (10)

Country Link
JP (1) JPS524173A (https=)
AT (1) AT368320B (https=)
AU (1) AU507497B2 (https=)
CA (1) CA1088281A (https=)
CH (1) CH612296A5 (https=)
DE (1) DE2628519C3 (https=)
FR (1) FR2317770A1 (https=)
GB (1) GB1541274A (https=)
IT (1) IT1066563B (https=)
NL (1) NL7606943A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143717A (en) * 1981-03-03 1982-09-06 Nippon Telegr & Teleph Corp <Ntt> Magnetic head for magnetic disk
GB2177639B (en) * 1985-07-08 1988-12-29 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith
DE4218741C2 (de) * 1992-06-06 1994-10-20 Vossloh Schwabe Gmbh Verfahren zum Verdrahten von Anschlußstellen elektrischer Geräte oder Baugruppenelemente
JPH07103897A (ja) * 1993-09-30 1995-04-21 Shimadzu Corp 発光分光分析装置
DE102008048081B4 (de) * 2008-09-19 2015-06-18 Cascade Microtech, Inc. Verfahren zur Prüfung elektronischer Bauelemente einer Wiederholstruktur unter definierten thermischen Bedingungen
DE102020117641A1 (de) 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1127439A (en) * 1964-11-26 1968-09-18 Philips Electronic Associated Improvements in and relating to methods of manufacturing semiconductor devices
US3648354A (en) * 1969-11-17 1972-03-14 Gen Motors Corp Tailless bonder for filamentary wire leads

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1127439A (en) * 1964-11-26 1968-09-18 Philips Electronic Associated Improvements in and relating to methods of manufacturing semiconductor devices
US3648354A (en) * 1969-11-17 1972-03-14 Gen Motors Corp Tailless bonder for filamentary wire leads

Also Published As

Publication number Publication date
IT1066563B (it) 1985-03-12
ATA458876A (de) 1982-01-15
AT368320B (de) 1982-10-11
JPS5750057B2 (https=) 1982-10-25
CH612296A5 (en) 1979-07-13
AU1437076A (en) 1977-12-01
CA1088281A (en) 1980-10-28
DE2628519A1 (de) 1976-12-30
NL7606943A (nl) 1976-12-28
FR2317770B1 (https=) 1978-05-05
DE2628519C3 (de) 1981-06-04
JPS524173A (en) 1977-01-13
DE2628519B2 (de) 1980-10-02
GB1541274A (en) 1979-02-28
AU507497B2 (en) 1980-02-14

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Legal Events

Date Code Title Description
ST Notification of lapse