AU507497B2 - Coupling continuous conductive filaments toan element - Google Patents

Coupling continuous conductive filaments toan element

Info

Publication number
AU507497B2
AU507497B2 AU14370/76A AU1437076A AU507497B2 AU 507497 B2 AU507497 B2 AU 507497B2 AU 14370/76 A AU14370/76 A AU 14370/76A AU 1437076 A AU1437076 A AU 1437076A AU 507497 B2 AU507497 B2 AU 507497B2
Authority
AU
Australia
Prior art keywords
toan
continuous conductive
conductive filaments
coupling continuous
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU14370/76A
Other languages
English (en)
Other versions
AU1437076A (en
Inventor
R Morino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/667,541 external-priority patent/US4140265A/en
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of AU1437076A publication Critical patent/AU1437076A/en
Application granted granted Critical
Publication of AU507497B2 publication Critical patent/AU507497B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
    • C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
    • C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU14370/76A 1975-06-26 1976-05-27 Coupling continuous conductive filaments toan element Expired AU507497B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US59057275A 1975-06-26 1975-06-26
USUS590,572 1975-06-26
US05/667,541 US4140265A (en) 1975-06-26 1976-03-16 Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element
USUS667,541 1976-03-16

Publications (2)

Publication Number Publication Date
AU1437076A AU1437076A (en) 1977-12-01
AU507497B2 true AU507497B2 (en) 1980-02-14

Family

ID=27080881

Family Applications (1)

Application Number Title Priority Date Filing Date
AU14370/76A Expired AU507497B2 (en) 1975-06-26 1976-05-27 Coupling continuous conductive filaments toan element

Country Status (10)

Country Link
JP (1) JPS524173A (https=)
AT (1) AT368320B (https=)
AU (1) AU507497B2 (https=)
CA (1) CA1088281A (https=)
CH (1) CH612296A5 (https=)
DE (1) DE2628519C3 (https=)
FR (1) FR2317770A1 (https=)
GB (1) GB1541274A (https=)
IT (1) IT1066563B (https=)
NL (1) NL7606943A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU666731B2 (en) * 1992-06-06 1996-02-22 Vossloh Schwabe Gmbh Process for wiring connections of electrical appliances or component elements

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143717A (en) * 1981-03-03 1982-09-06 Nippon Telegr & Teleph Corp <Ntt> Magnetic head for magnetic disk
GB2177639B (en) * 1985-07-08 1988-12-29 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith
JPH07103897A (ja) * 1993-09-30 1995-04-21 Shimadzu Corp 発光分光分析装置
DE102008048081B4 (de) * 2008-09-19 2015-06-18 Cascade Microtech, Inc. Verfahren zur Prüfung elektronischer Bauelemente einer Wiederholstruktur unter definierten thermischen Bedingungen
DE102020117641A1 (de) 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3648354A (en) * 1969-11-17 1972-03-14 Gen Motors Corp Tailless bonder for filamentary wire leads

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU666731B2 (en) * 1992-06-06 1996-02-22 Vossloh Schwabe Gmbh Process for wiring connections of electrical appliances or component elements
SG82522A1 (en) * 1992-06-06 2001-08-21 Vossloh Schwabe Gmbh Technique for wiring connections of electrical apparatus or a module of circuit elements

Also Published As

Publication number Publication date
IT1066563B (it) 1985-03-12
ATA458876A (de) 1982-01-15
FR2317770A1 (fr) 1977-02-04
AT368320B (de) 1982-10-11
JPS5750057B2 (https=) 1982-10-25
CH612296A5 (en) 1979-07-13
AU1437076A (en) 1977-12-01
CA1088281A (en) 1980-10-28
DE2628519A1 (de) 1976-12-30
NL7606943A (nl) 1976-12-28
FR2317770B1 (https=) 1978-05-05
DE2628519C3 (de) 1981-06-04
JPS524173A (en) 1977-01-13
DE2628519B2 (de) 1980-10-02
GB1541274A (en) 1979-02-28

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