GB1541274A - Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an element - Google Patents

Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an element

Info

Publication number
GB1541274A
GB1541274A GB25711/76A GB2571176A GB1541274A GB 1541274 A GB1541274 A GB 1541274A GB 25711/76 A GB25711/76 A GB 25711/76A GB 2571176 A GB2571176 A GB 2571176A GB 1541274 A GB1541274 A GB 1541274A
Authority
GB
United Kingdom
Prior art keywords
conductor
connecting point
predetermined terminal
continuous conductive
conductive filaments
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25711/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/667,541 external-priority patent/US4140265A/en
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of GB1541274A publication Critical patent/GB1541274A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
    • C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
    • C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB25711/76A 1975-06-26 1976-06-21 Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an element Expired GB1541274A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59057275A 1975-06-26 1975-06-26
US05/667,541 US4140265A (en) 1975-06-26 1976-03-16 Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element

Publications (1)

Publication Number Publication Date
GB1541274A true GB1541274A (en) 1979-02-28

Family

ID=27080881

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25711/76A Expired GB1541274A (en) 1975-06-26 1976-06-21 Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an element

Country Status (10)

Country Link
JP (1) JPS524173A (https=)
AT (1) AT368320B (https=)
AU (1) AU507497B2 (https=)
CA (1) CA1088281A (https=)
CH (1) CH612296A5 (https=)
DE (1) DE2628519C3 (https=)
FR (1) FR2317770A1 (https=)
GB (1) GB1541274A (https=)
IT (1) IT1066563B (https=)
NL (1) NL7606943A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177639A (en) * 1985-07-08 1987-01-28 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor therewith

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143717A (en) * 1981-03-03 1982-09-06 Nippon Telegr & Teleph Corp <Ntt> Magnetic head for magnetic disk
DE4218741C2 (de) * 1992-06-06 1994-10-20 Vossloh Schwabe Gmbh Verfahren zum Verdrahten von Anschlußstellen elektrischer Geräte oder Baugruppenelemente
JPH07103897A (ja) * 1993-09-30 1995-04-21 Shimadzu Corp 発光分光分析装置
DE102008048081B4 (de) * 2008-09-19 2015-06-18 Cascade Microtech, Inc. Verfahren zur Prüfung elektronischer Bauelemente einer Wiederholstruktur unter definierten thermischen Bedingungen
DE102020117641A1 (de) 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3648354A (en) * 1969-11-17 1972-03-14 Gen Motors Corp Tailless bonder for filamentary wire leads

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177639A (en) * 1985-07-08 1987-01-28 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor therewith

Also Published As

Publication number Publication date
IT1066563B (it) 1985-03-12
ATA458876A (de) 1982-01-15
FR2317770A1 (fr) 1977-02-04
AT368320B (de) 1982-10-11
JPS5750057B2 (https=) 1982-10-25
CH612296A5 (en) 1979-07-13
AU1437076A (en) 1977-12-01
CA1088281A (en) 1980-10-28
DE2628519A1 (de) 1976-12-30
NL7606943A (nl) 1976-12-28
FR2317770B1 (https=) 1978-05-05
DE2628519C3 (de) 1981-06-04
JPS524173A (en) 1977-01-13
DE2628519B2 (de) 1980-10-02
AU507497B2 (en) 1980-02-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee