FR2305026B1 - - Google Patents

Info

Publication number
FR2305026B1
FR2305026B1 FR7607440A FR7607440A FR2305026B1 FR 2305026 B1 FR2305026 B1 FR 2305026B1 FR 7607440 A FR7607440 A FR 7607440A FR 7607440 A FR7607440 A FR 7607440A FR 2305026 B1 FR2305026 B1 FR 2305026B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7607440A
Other languages
French (fr)
Other versions
FR2305026A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of FR2305026A1 publication Critical patent/FR2305026A1/fr
Application granted granted Critical
Publication of FR2305026B1 publication Critical patent/FR2305026B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
FR7607440A 1975-03-17 1976-03-16 Module de circuit integre avec dissipateur de chaleur a surface libre d'enrobage, exposee a travers le fond du module Granted FR2305026A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US558643A US3930114A (en) 1975-03-17 1975-03-17 Integrated circuit package utilizing novel heat sink structure

Publications (2)

Publication Number Publication Date
FR2305026A1 FR2305026A1 (fr) 1976-10-15
FR2305026B1 true FR2305026B1 (https=) 1982-04-30

Family

ID=24230359

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7607440A Granted FR2305026A1 (fr) 1975-03-17 1976-03-16 Module de circuit integre avec dissipateur de chaleur a surface libre d'enrobage, exposee a travers le fond du module

Country Status (7)

Country Link
US (1) US3930114A (https=)
JP (1) JPS5842624B2 (https=)
BR (1) BR7601510A (https=)
CA (1) CA1040747A (https=)
DE (1) DE2611531A1 (https=)
FR (1) FR2305026A1 (https=)
GB (1) GB1538556A (https=)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
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JPS53132975A (en) * 1977-04-26 1978-11-20 Toshiba Corp Semiconductor device
JPS5425381A (en) * 1977-07-27 1979-02-26 Matsushita Electric Ind Co Ltd Home-use electric appliance
US4137546A (en) * 1977-10-14 1979-01-30 Plessey Incorporated Stamped lead frame for semiconductor packages
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
US4195193A (en) * 1979-02-23 1980-03-25 Amp Incorporated Lead frame and chip carrier housing
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier
US4258411A (en) * 1979-05-21 1981-03-24 Bell Telephone Laboratories, Incorporated Electronic device packaging arrangement
FR2487580A1 (fr) * 1980-07-22 1982-01-29 Thomson Csf Mat Tel Dispositif semiconducteur a enrobage isolant comportant un dissipateur de chaleur apparent, et son procede de fabrication
DE3039440C2 (de) * 1980-10-18 1984-02-16 ANT Nachrichtentechnik GmbH, 7150 Backnang Anordnung zur Aufnahme von elektrischen und/oder elektronischen Bauelementen
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
FR2498377A1 (fr) * 1981-01-16 1982-07-23 Thomson Csf Mat Tel Procede de fabrication de dispositifs semiconducteurs sur bande metallique
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
CA1195782A (en) * 1981-07-06 1985-10-22 Mikio Nishikawa Lead frame for plastic encapsulated semiconductor device
EP0104231A4 (en) * 1982-04-05 1985-10-30 Motorola Inc SELF-ALIGNING HEAT SPREADING ARRANGEMENT.
JPS5979417A (ja) * 1982-10-28 1984-05-08 Sony Corp 磁気ヘツド装置
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads
US4617708A (en) * 1982-12-23 1986-10-21 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads, and methods of fabricating same
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
IT1213140B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato per assemblaggio di superficie.
DE3684184D1 (de) * 1985-06-20 1992-04-16 Toshiba Kawasaki Kk Verkapselte halbleiteranordnung.
US4751611A (en) * 1986-07-24 1988-06-14 Hitachi Chemical Co., Ltd. Semiconductor package structure
US4868349A (en) * 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
JPH0732215B2 (ja) * 1988-10-25 1995-04-10 三菱電機株式会社 半導体装置
US4916506A (en) * 1988-11-18 1990-04-10 Sprague Electric Company Integrated-circuit lead-frame package with low-resistance ground-lead and heat-sink means
US5015803A (en) * 1989-05-31 1991-05-14 Olin Corporation Thermal performance package for integrated circuit chip
US5334872A (en) * 1990-01-29 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad
US5065281A (en) * 1990-02-12 1991-11-12 Rogers Corporation Molded integrated circuit package incorporating heat sink
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
EP0468379B1 (en) * 1990-07-21 1999-11-17 Mitsui Chemicals, Inc. Semiconductor device having a package
IT1247649B (it) * 1990-10-31 1994-12-28 Sgs Thomson Microelectronics Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo
US5139973A (en) * 1990-12-17 1992-08-18 Allegro Microsystems, Inc. Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet
IT1246743B (it) * 1990-12-28 1994-11-26 Sgs Thomson Microelectronics Stampo per la fabbricazione di contenitori in plastica, per circuiti integrati,con dissipatore termico incorporato.
US5403784A (en) * 1991-09-03 1995-04-04 Microelectronics And Computer Technology Corporation Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template
US5200809A (en) * 1991-09-27 1993-04-06 Vlsi Technology, Inc. Exposed die-attach heatsink package
JPH05190721A (ja) * 1992-01-08 1993-07-30 Fujitsu Ltd 半導体装置及びその製造方法
US5263245A (en) * 1992-01-27 1993-11-23 International Business Machines Corporation Method of making an electronic package with enhanced heat sinking
US5378924A (en) * 1992-09-10 1995-01-03 Vlsi Technology, Inc. Apparatus for thermally coupling a heat sink to a lead frame
US5608267A (en) * 1992-09-17 1997-03-04 Olin Corporation Molded plastic semiconductor package including heat spreader
US5289344A (en) * 1992-10-08 1994-02-22 Allegro Microsystems Inc. Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means
KR940016724A (ko) * 1992-12-03 1994-07-23 빈센트 비. 인그라시아 표면 실장형 집적 회로 파워 패키지용 리드 프레임 어셈블리
DE9300865U1 (de) * 1993-01-22 1994-05-26 Siemens AG, 80333 München Einstückiges Kunststoffteil, insbesondere Spritzgießteil
US5394607A (en) * 1993-05-20 1995-03-07 Texas Instruments Incorporated Method of providing low cost heat sink
US5420752A (en) * 1993-08-18 1995-05-30 Lsi Logic Corporation GPT system for encapsulating an integrated circuit package
US5441684A (en) * 1993-09-24 1995-08-15 Vlsi Technology, Inc. Method of forming molded plastic packages with integrated heat sinks
US5444909A (en) * 1993-12-29 1995-08-29 Intel Corporation Method of making a drop-in heat sink
US5609889A (en) * 1995-05-26 1997-03-11 Hestia Technologies, Inc. Apparatus for encapsulating electronic packages
JP3435271B2 (ja) * 1995-11-30 2003-08-11 三菱電機株式会社 半導体装置
US5825623A (en) * 1995-12-08 1998-10-20 Vlsi Technology, Inc. Packaging assemblies for encapsulated integrated circuit devices
JPH09199645A (ja) * 1996-01-17 1997-07-31 Mitsubishi Electric Corp 半導体装置および半導体モジュール
US5672547A (en) * 1996-01-31 1997-09-30 Industrial Technology Research Institute Method for bonding a heat sink to a die paddle
US5872395A (en) * 1996-09-16 1999-02-16 International Packaging And Assembly Corporation Bent tip method for preventing vertical motion of heat spreaders during injection molding of IC packages
US5859387A (en) * 1996-11-29 1999-01-12 Allegro Microsystems, Inc. Semiconductor device leadframe die attach pad having a raised bond pad
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
JP2924854B2 (ja) * 1997-05-20 1999-07-26 日本電気株式会社 半導体装置、その製造方法
US5869883A (en) * 1997-09-26 1999-02-09 Stanley Wang, President Pantronix Corp. Packaging of semiconductor circuit in pre-molded plastic package
US6198163B1 (en) 1999-10-18 2001-03-06 Amkor Technology, Inc. Thin leadframe-type semiconductor package having heat sink with recess and exposed surface
US6678121B2 (en) 2000-06-27 2004-01-13 Seagate Technology Llc Fiber reinforced laminate actuator arm for disc drives
US7220615B2 (en) 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US6396130B1 (en) 2001-09-14 2002-05-28 Amkor Technology, Inc. Semiconductor package having multiple dies with independently biased back surfaces
EP1318544A1 (en) * 2001-12-06 2003-06-11 STMicroelectronics S.r.l. Method for manufacturing semiconductor device packages
US20030112710A1 (en) * 2001-12-18 2003-06-19 Eidson John C. Reducing thermal drift in electronic components
US7190060B1 (en) 2002-01-09 2007-03-13 Bridge Semiconductor Corporation Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same
US6936495B1 (en) 2002-01-09 2005-08-30 Bridge Semiconductor Corporation Method of making an optoelectronic semiconductor package device
US6989295B1 (en) 2002-01-09 2006-01-24 Bridge Semiconductor Corporation Method of making a semiconductor package device that includes an insulative housing with first and second housing portions
US6891276B1 (en) 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US7375415B2 (en) * 2005-06-30 2008-05-20 Sandisk Corporation Die package with asymmetric leadframe connection
JP4634498B2 (ja) * 2008-11-28 2011-02-16 三菱電機株式会社 電力用半導体モジュール
CN104009008A (zh) 2013-02-27 2014-08-27 飞思卡尔半导体公司 具有集成散热器的半导体器件
CN104576565A (zh) 2013-10-18 2015-04-29 飞思卡尔半导体公司 具有散热体的半导体器件及其组装方法
US9385060B1 (en) 2014-07-25 2016-07-05 Altera Corporation Integrated circuit package with enhanced thermal conduction
US9355945B1 (en) 2015-09-02 2016-05-31 Freescale Semiconductor, Inc. Semiconductor device with heat-dissipating lead frame
DE112016005528T5 (de) 2015-12-04 2018-08-30 Rohm Co., Ltd. Leistungsmodulvorrichtung, Kühlstruktur und elektrisches Fahrzeug oder elektrisches Hybridfahrzeug
JP7169771B2 (ja) * 2018-05-25 2022-11-11 Koa株式会社 抵抗器
CN118020395A (zh) * 2021-08-18 2024-05-10 特斯拉公司 具有插入器组件的电子组件
US20230245942A1 (en) * 2022-01-31 2023-08-03 Texas Instruments Incorporated Semiconductor device package with integral heat slug

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US3444309A (en) * 1967-12-26 1969-05-13 Motorola Inc Unitized assembly plastic encapsulation providing outwardly facing nonplastic surfaces
NL6903229A (https=) * 1969-03-01 1970-09-03
FR2116353B1 (https=) * 1970-10-19 1976-04-16 Ates Componenti Elettron
US3729573A (en) * 1971-01-25 1973-04-24 Motorola Inc Plastic encapsulation of semiconductor devices
US3767839A (en) * 1971-06-04 1973-10-23 Wells Plastics Of California I Plastic micro-electronic packages
US3839660A (en) * 1973-02-05 1974-10-01 Gen Motors Corp Power semiconductor device package

Also Published As

Publication number Publication date
GB1538556A (en) 1979-01-24
JPS51114068A (en) 1976-10-07
CA1040747A (en) 1978-10-17
BR7601510A (pt) 1976-09-14
FR2305026A1 (fr) 1976-10-15
DE2611531A1 (de) 1976-09-30
US3930114A (en) 1975-12-30
JPS5842624B2 (ja) 1983-09-21

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Legal Events

Date Code Title Description
ST Notification of lapse