FR2303444A1 - Procede pour l'elaboration photolithographique des pistes resistives dans les circuits hybrides - Google Patents

Procede pour l'elaboration photolithographique des pistes resistives dans les circuits hybrides

Info

Publication number
FR2303444A1
FR2303444A1 FR7605954A FR7605954A FR2303444A1 FR 2303444 A1 FR2303444 A1 FR 2303444A1 FR 7605954 A FR7605954 A FR 7605954A FR 7605954 A FR7605954 A FR 7605954A FR 2303444 A1 FR2303444 A1 FR 2303444A1
Authority
FR
France
Prior art keywords
elaboration
photolithographic
hybrid circuits
resistive tracks
resistive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7605954A
Other languages
English (en)
Other versions
FR2303444B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2303444A1 publication Critical patent/FR2303444A1/fr
Application granted granted Critical
Publication of FR2303444B1 publication Critical patent/FR2303444B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR7605954A 1975-03-05 1976-03-03 Procede pour l'elaboration photolithographique des pistes resistives dans les circuits hybrides Granted FR2303444A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH275775A CH613556A5 (en) 1975-03-05 1975-03-05 Process for photolithographic patterning of resistor tracks in hybrid circuits

Publications (2)

Publication Number Publication Date
FR2303444A1 true FR2303444A1 (fr) 1976-10-01
FR2303444B1 FR2303444B1 (fr) 1980-01-25

Family

ID=4240925

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7605954A Granted FR2303444A1 (fr) 1975-03-05 1976-03-03 Procede pour l'elaboration photolithographique des pistes resistives dans les circuits hybrides

Country Status (6)

Country Link
CH (1) CH613556A5 (fr)
DE (1) DE2512860C2 (fr)
DK (1) DK91576A (fr)
FR (1) FR2303444A1 (fr)
GB (1) GB1535995A (fr)
SE (1) SE417657B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2532472A1 (fr) * 1982-08-31 1984-03-02 Lignes Telegraph Telephon Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708832A1 (de) * 1987-03-18 1988-09-29 Siemens Ag Nasschemische strukturierung von hafniumborid-schichten
FR2648232B1 (fr) 1989-06-09 1991-09-27 Erg Procede et dispositif de mesure in situ des caracteristiques de gonflement d'un sol

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457148A (en) * 1964-10-19 1969-07-22 Bell Telephone Labor Inc Process for preparation of stabilized metal film resistors
CH576739A5 (fr) * 1972-08-25 1976-06-15 Ciba Geigy Ag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2532472A1 (fr) * 1982-08-31 1984-03-02 Lignes Telegraph Telephon Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions

Also Published As

Publication number Publication date
DE2512860A1 (de) 1976-09-23
FR2303444B1 (fr) 1980-01-25
CH613556A5 (en) 1979-09-28
GB1535995A (en) 1978-12-13
SE417657B (sv) 1981-03-30
DE2512860C2 (de) 1986-06-19
DK91576A (da) 1976-09-06
SE7602098L (sv) 1976-09-06

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse