CH613556A5 - Process for photolithographic patterning of resistor tracks in hybrid circuits - Google Patents

Process for photolithographic patterning of resistor tracks in hybrid circuits

Info

Publication number
CH613556A5
CH613556A5 CH275775A CH275775A CH613556A5 CH 613556 A5 CH613556 A5 CH 613556A5 CH 275775 A CH275775 A CH 275775A CH 275775 A CH275775 A CH 275775A CH 613556 A5 CH613556 A5 CH 613556A5
Authority
CH
Switzerland
Prior art keywords
hybrid circuits
photolithographic patterning
resistor tracks
tracks
resistor
Prior art date
Application number
CH275775A
Other languages
English (en)
Inventor
Gianni Berner
Leo Schweri
Philippe Noel
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH275775A priority Critical patent/CH613556A5/xx
Priority to DE19752512860 priority patent/DE2512860C2/de
Priority to SE7602098A priority patent/SE417657B/xx
Priority to FR7605954A priority patent/FR2303444A1/fr
Priority to DK91576A priority patent/DK91576A/da
Priority to GB855876A priority patent/GB1535995A/en
Publication of CH613556A5 publication Critical patent/CH613556A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Semiconductor Integrated Circuits (AREA)
CH275775A 1975-03-05 1975-03-05 Process for photolithographic patterning of resistor tracks in hybrid circuits CH613556A5 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH275775A CH613556A5 (en) 1975-03-05 1975-03-05 Process for photolithographic patterning of resistor tracks in hybrid circuits
DE19752512860 DE2512860C2 (de) 1975-03-05 1975-03-24 Verfahren zum fotolithografischen Strukturieren von Widerstandsbahnen in Hybridschaltungen
SE7602098A SE417657B (sv) 1975-03-05 1976-02-23 Forfarande vid fotolitografisk strukturering av motstandsbanor
FR7605954A FR2303444A1 (fr) 1975-03-05 1976-03-03 Procede pour l'elaboration photolithographique des pistes resistives dans les circuits hybrides
DK91576A DK91576A (da) 1975-03-05 1976-03-03 Fremgangsmade til fotolitografisk strukturering af modstandsbaner i hybridkredslob
GB855876A GB1535995A (en) 1975-03-05 1976-03-03 Photolithographic production of resistance elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH275775A CH613556A5 (en) 1975-03-05 1975-03-05 Process for photolithographic patterning of resistor tracks in hybrid circuits

Publications (1)

Publication Number Publication Date
CH613556A5 true CH613556A5 (en) 1979-09-28

Family

ID=4240925

Family Applications (1)

Application Number Title Priority Date Filing Date
CH275775A CH613556A5 (en) 1975-03-05 1975-03-05 Process for photolithographic patterning of resistor tracks in hybrid circuits

Country Status (6)

Country Link
CH (1) CH613556A5 (fr)
DE (1) DE2512860C2 (fr)
DK (1) DK91576A (fr)
FR (1) FR2303444A1 (fr)
GB (1) GB1535995A (fr)
SE (1) SE417657B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2532472B1 (fr) * 1982-08-31 1985-12-20 Lignes Telegraph Telephon Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions
DE3708832A1 (de) * 1987-03-18 1988-09-29 Siemens Ag Nasschemische strukturierung von hafniumborid-schichten
FR2648232B1 (fr) 1989-06-09 1991-09-27 Erg Procede et dispositif de mesure in situ des caracteristiques de gonflement d'un sol

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457148A (en) * 1964-10-19 1969-07-22 Bell Telephone Labor Inc Process for preparation of stabilized metal film resistors
CH576739A5 (fr) * 1972-08-25 1976-06-15 Ciba Geigy Ag

Also Published As

Publication number Publication date
SE7602098L (sv) 1976-09-06
SE417657B (sv) 1981-03-30
DE2512860A1 (de) 1976-09-23
DK91576A (da) 1976-09-06
DE2512860C2 (de) 1986-06-19
GB1535995A (en) 1978-12-13
FR2303444A1 (fr) 1976-10-01
FR2303444B1 (fr) 1980-01-25

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Legal Events

Date Code Title Description
PUE Assignment

Owner name: CONTRAVES AG

PL Patent ceased