FR2295569A1 - Dispositif de saisie d'elements fragiles - Google Patents

Dispositif de saisie d'elements fragiles

Info

Publication number
FR2295569A1
FR2295569A1 FR7536046A FR7536046A FR2295569A1 FR 2295569 A1 FR2295569 A1 FR 2295569A1 FR 7536046 A FR7536046 A FR 7536046A FR 7536046 A FR7536046 A FR 7536046A FR 2295569 A1 FR2295569 A1 FR 2295569A1
Authority
FR
France
Prior art keywords
entry device
fragile elements
elements entry
fragile
entry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7536046A
Other languages
English (en)
French (fr)
Other versions
FR2295569B1 (enExample
Inventor
Dieter K Neff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2295569A1 publication Critical patent/FR2295569A1/fr
Application granted granted Critical
Publication of FR2295569B1 publication Critical patent/FR2295569B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
FR7536046A 1974-12-20 1975-11-17 Dispositif de saisie d'elements fragiles Granted FR2295569A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/534,935 US3973682A (en) 1974-12-20 1974-12-20 Pick up assembly for fragile devices

Publications (2)

Publication Number Publication Date
FR2295569A1 true FR2295569A1 (fr) 1976-07-16
FR2295569B1 FR2295569B1 (enExample) 1978-05-12

Family

ID=24132134

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7536046A Granted FR2295569A1 (fr) 1974-12-20 1975-11-17 Dispositif de saisie d'elements fragiles

Country Status (5)

Country Link
US (1) US3973682A (enExample)
JP (1) JPS5842619B2 (enExample)
DE (1) DE2557074C2 (enExample)
FR (1) FR2295569A1 (enExample)
GB (1) GB1495984A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008379A1 (de) * 1978-08-18 1980-03-05 International Business Machines Corporation Einrichtung für das Aufnehmen/Ablegen und Transportieren von kleinen Werkstücken
EP0071302A1 (en) * 1981-07-29 1983-02-09 Koninklijke Philips Electronics N.V. Method of and device for feeding electric and/or electronic elements to given positions
EP0065604A3 (en) * 1981-05-06 1983-06-01 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
WO1983003183A1 (fr) * 1982-03-08 1983-09-15 Miroslav Tresky Dispositif de montage de composants de circuits electriques et electroniques sur un objet
FR2546024A1 (fr) * 1983-05-13 1984-11-16 Tdk Corp Appareil pour le montage automatique d'elements de circuit du type puce sur des plaquettes a circuits imprimes
EP0140126A1 (de) * 1983-10-07 1985-05-08 Siemens Aktiengesellschaft Verfahren zur Mikropackherstellung
EP0194487A1 (de) * 1985-02-28 1986-09-17 Siemens Aktiengesellschaft Verfahren zur Lagebestimmung eines Objekts in einem automatisierten Fertigungsverfahren und Vorrichtung zur Durchführung des Verfahrens

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425073U (enExample) * 1977-07-21 1979-02-19
JPH0217479Y2 (enExample) * 1981-03-18 1990-05-16
US4749329A (en) * 1982-12-06 1988-06-07 Motorola, Inc. Die pick mechanism for automatic assembly of semiconductor devices
JPS6089938A (ja) * 1983-10-24 1985-05-20 Rohm Co Ltd 半導体チツプの試験分類法
US4703965A (en) * 1986-02-25 1987-11-03 Micro Component Technology, Inc. Integrated circuit placement device vacuum head
GB8702618D0 (en) * 1987-02-05 1987-03-11 Dynapert Precima Ltd Suction pick-up apparatus
GB8714175D0 (en) * 1987-06-17 1987-07-22 Dynapert Precima Ltd Suction pick-up apparatus
US4875279A (en) * 1987-08-21 1989-10-24 E. I. Du Pont De Nemours And Company Die attach pickup tools
US4850780A (en) * 1987-09-28 1989-07-25 Kulicke And Soffa Industries Inc. Pre-peel die ejector apparatus
US4990051A (en) * 1987-09-28 1991-02-05 Kulicke And Soffa Industries, Inc. Pre-peel die ejector apparatus
JP2530013B2 (ja) * 1988-11-18 1996-09-04 富士通株式会社 半導体装置の製造方法
CA2031776A1 (en) * 1989-12-08 1991-06-09 Masanori Nishiguchi Pickup method and the pickup apparatus for chip-type part
DE10121578C2 (de) * 2001-05-03 2003-04-10 Infineon Technologies Ag Verfahren und Bestückungssystem zum Bestücken eines Substrats mit elektronischen Bauteilen
US6592325B2 (en) * 2001-06-25 2003-07-15 Industrial Technology Research Institute Air-suspended die sorter
US6772509B2 (en) * 2002-01-28 2004-08-10 Motorola, Inc. Method of separating and handling a thin semiconductor die on a wafer
JP4673546B2 (ja) * 2002-10-25 2011-04-20 ハイデルベルガー ドルツクマシーネン アクチエンゲゼルシヤフト 跳上げ式吸い口
US20070048120A1 (en) * 2005-08-15 2007-03-01 Texas Instruments Incorporated Vacuum shroud for a die attach tool
US20090148258A1 (en) * 2007-12-07 2009-06-11 Chi Wah Cheng Pick and place apparatus incorporating debris removal device
US8801352B2 (en) * 2011-08-11 2014-08-12 International Business Machines Corporation Pick and place tape release for thin semiconductor dies
JP5934514B2 (ja) * 2012-02-16 2016-06-15 セキ工業株式会社 真空吸着ヘッドを有する物品供給装置
CN104670892B (zh) * 2013-11-29 2017-02-08 鸿富锦精密工业（深圳）有限公司 取放料装置
CN105583841B (zh) * 2014-10-20 2018-01-23 富鼎电子科技(嘉善)有限公司 定位治具
KR102545230B1 (ko) * 2016-11-02 2023-06-19 삼성전자주식회사 피커 어셈블리 및 이를 구비하는 추출장치
US10099387B2 (en) * 2017-01-24 2018-10-16 Jabil Inc. Apparatus, system and method for providing a vacuum ejector for an end effector
US10493638B1 (en) * 2018-09-11 2019-12-03 Jabil Inc. Apparatus, system and method for providing a vacuum ejector for an end effector
JP2018129324A (ja) * 2017-02-06 2018-08-16 株式会社東芝 ピックアップ装置
US11084175B2 (en) * 2018-12-13 2021-08-10 Amazon Technologies, Inc. End-of-arm tool having concentric suction cups, and related systems and methods
US11911894B2 (en) * 2019-05-09 2024-02-27 Intelligrated Headquarters, Llc Method and system for manipulating articles
CN110422416A (zh) * 2019-07-04 2019-11-08 宁波市鄞州特尔斐电子有限公司 一种集成电路及其撕膜方法和撕膜排板设备
CN110429048A (zh) * 2019-07-04 2019-11-08 宁波市鄞州特尔斐电子有限公司 一种集成电路撕膜机的载板上料装置
CN110589417B (zh) * 2019-09-17 2020-12-01 日照丰华脚手架有限公司 一种圆管自动化上料设备
CN113594079B (zh) * 2020-04-30 2024-01-16 先进科技新加坡有限公司 用于将电子元件从粘性载体分离的顶出器单元
CN112367827B (zh) * 2020-12-03 2021-10-22 赣州深奥电子有限公司 一种smt贴片机吸附装置
TWI799111B (zh) * 2022-01-26 2023-04-11 東佑達自動化科技股份有限公司 自動化生產線送料裝置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3720309A (en) * 1971-12-07 1973-03-13 Teledyne Inc Method and apparatus for sorting semiconductor dice
US3847284A (en) * 1973-05-11 1974-11-12 Teledyne Inc Magnetic tape die sorting system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2932281A (en) * 1958-06-25 1960-04-12 North American Aviation Inc Double-acting actuator means
JPS436858Y1 (enExample) * 1967-01-10 1968-03-27
US3567043A (en) * 1968-08-05 1971-03-02 Sun Chemical Corp Transfer assembly for use with container printing machines
US3785507A (en) * 1968-12-19 1974-01-15 Teledyne Inc Die sorting system
US3870164A (en) * 1972-07-12 1975-03-11 Harold A Haase Work transfer device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3720309A (en) * 1971-12-07 1973-03-13 Teledyne Inc Method and apparatus for sorting semiconductor dice
US3847284A (en) * 1973-05-11 1974-11-12 Teledyne Inc Magnetic tape die sorting system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "IBM TECHNICAL DISCLOSURE BULLETIN" VOL. 16, SEPTEMBRE 1973 "ACCURATE CHIP PLACEMENT ON A SUBSTRATE" W.R. DEBOSKEY ET AL, PAGE 1154 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008379A1 (de) * 1978-08-18 1980-03-05 International Business Machines Corporation Einrichtung für das Aufnehmen/Ablegen und Transportieren von kleinen Werkstücken
EP0065604A3 (en) * 1981-05-06 1983-06-01 Universal Instruments Corporation Leadless chip placement machine for printed circuit boards
EP0071302A1 (en) * 1981-07-29 1983-02-09 Koninklijke Philips Electronics N.V. Method of and device for feeding electric and/or electronic elements to given positions
WO1983003183A1 (fr) * 1982-03-08 1983-09-15 Miroslav Tresky Dispositif de montage de composants de circuits electriques et electroniques sur un objet
FR2546024A1 (fr) * 1983-05-13 1984-11-16 Tdk Corp Appareil pour le montage automatique d'elements de circuit du type puce sur des plaquettes a circuits imprimes
EP0140126A1 (de) * 1983-10-07 1985-05-08 Siemens Aktiengesellschaft Verfahren zur Mikropackherstellung
EP0194487A1 (de) * 1985-02-28 1986-09-17 Siemens Aktiengesellschaft Verfahren zur Lagebestimmung eines Objekts in einem automatisierten Fertigungsverfahren und Vorrichtung zur Durchführung des Verfahrens

Also Published As

Publication number Publication date
JPS5178172A (enExample) 1976-07-07
US3973682A (en) 1976-08-10
DE2557074A1 (de) 1976-06-24
DE2557074C2 (de) 1984-05-24
GB1495984A (en) 1977-12-21
JPS5842619B2 (ja) 1983-09-21
FR2295569B1 (enExample) 1978-05-12

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Legal Events

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