FR2293500B1 - - Google Patents

Info

Publication number
FR2293500B1
FR2293500B1 FR7536819A FR7536819A FR2293500B1 FR 2293500 B1 FR2293500 B1 FR 2293500B1 FR 7536819 A FR7536819 A FR 7536819A FR 7536819 A FR7536819 A FR 7536819A FR 2293500 B1 FR2293500 B1 FR 2293500B1
Authority
FR
France
Prior art keywords
plating
substrates
alkali metal
electrolyte
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7536819A
Other languages
English (en)
French (fr)
Other versions
FR2293500A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts UK Holdings Ltd
Original Assignee
Engelhard Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Industries Ltd filed Critical Engelhard Industries Ltd
Publication of FR2293500A1 publication Critical patent/FR2293500A1/fr
Application granted granted Critical
Publication of FR2293500B1 publication Critical patent/FR2293500B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/013Manufacture or treatment of die-attach connectors
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • H10W72/07336Soldering or alloying

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
FR7536819A 1974-12-04 1975-12-02 Perfectionnements a la fabrication de dispositifs semi-conducteurs Granted FR2293500A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB52520/74A GB1506380A (en) 1974-12-04 1974-12-04 Gold plating electrolyte and method of electrodepositing gold in the production of semiconductor devices

Publications (2)

Publication Number Publication Date
FR2293500A1 FR2293500A1 (fr) 1976-07-02
FR2293500B1 true FR2293500B1 (https=) 1980-08-01

Family

ID=10464233

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7536819A Granted FR2293500A1 (fr) 1974-12-04 1975-12-02 Perfectionnements a la fabrication de dispositifs semi-conducteurs

Country Status (14)

Country Link
JP (1) JPS5198639A (https=)
AT (1) ATA908275A (https=)
BE (1) BE836293A (https=)
CH (1) CH606505A5 (https=)
DE (1) DE2554583A1 (https=)
DK (1) DK545375A (https=)
ES (1) ES443389A1 (https=)
FR (1) FR2293500A1 (https=)
GB (1) GB1506380A (https=)
HK (1) HK73378A (https=)
IT (1) IT1052476B (https=)
MY (1) MY7900005A (https=)
NL (1) NL7513699A (https=)
SE (1) SE7513620L (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4465564A (en) * 1983-06-27 1984-08-14 American Chemical & Refining Company, Inc. Gold plating bath containing tartrate and carbonate salts

Also Published As

Publication number Publication date
ATA908275A (de) 1978-10-15
GB1506380A (en) 1978-04-05
HK73378A (en) 1978-12-22
ES443389A1 (es) 1977-05-01
BE836293A (fr) 1976-06-04
DK545375A (da) 1976-06-05
NL7513699A (nl) 1976-06-09
CH606505A5 (https=) 1978-10-31
DE2554583A1 (de) 1976-06-10
IT1052476B (it) 1981-06-20
JPS5198639A (en) 1976-08-31
FR2293500A1 (fr) 1976-07-02
AU8674075A (en) 1977-05-26
MY7900005A (en) 1979-12-31
SE7513620L (sv) 1976-06-08

Similar Documents

Publication Publication Date Title
US4880464A (en) Electroless gold plating solution
GB1370387A (en) Electrochemical solutions and process
DE69524011T2 (de) Verfahren zum Auffrischen von stromlosen Gold-Plattierungsbädern
GB1228693A (https=)
GB1453386A (en) Gold plating solutions and method
FR2293500B1 (https=)
SE8002598L (sv) Silver- och silver/guld-pleteringsbad
JPS59143084A (ja) 改良金硫化物めつき浴
US5320667A (en) Combination of aqueous baths for electroless gold deposition
US3506462A (en) Electroless gold plating solutions
ES8304617A1 (es) Un metodo de electrodeposito de paladio metalico o de aleaciones de paladio sobre un sustrato.
GB1525828A (en) Silver plating method and bath
GB1051383A (https=)
GB1304424A (https=)
US4207149A (en) Gold electroplating solutions and processes
US2783194A (en) Iodate-containing plating baths
EP0251302A3 (de) Alkalisches aussenstromloses Kupferbad
JPS62174384A (ja) 無電解金めつき液
GB1506496A (en) Gold plating baths
US3879269A (en) Methods for high current density gold electroplating
JPH01239856A (ja) 半導体集積回路用電子部品の金めっき法
GB1375611A (https=)
GB759222A (en) An electrolytic process for smoothing and polishing surfaces of gold alloys
JP2954214B2 (ja) 金めっき導体の製造方法
JPH04350172A (ja) 無電解金めっき液

Legal Events

Date Code Title Description
ST Notification of lapse