FR2280976A1 - Procede de fabrication d'un dispositif semi-conducteur - Google Patents
Procede de fabrication d'un dispositif semi-conducteurInfo
- Publication number
- FR2280976A1 FR2280976A1 FR7523541A FR7523541A FR2280976A1 FR 2280976 A1 FR2280976 A1 FR 2280976A1 FR 7523541 A FR7523541 A FR 7523541A FR 7523541 A FR7523541 A FR 7523541A FR 2280976 A1 FR2280976 A1 FR 2280976A1
- Authority
- FR
- France
- Prior art keywords
- temperature
- silicon
- per minute
- manufacturing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 125000004122 cyclic group Chemical group 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US49417874A | 1974-08-02 | 1974-08-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2280976A1 true FR2280976A1 (fr) | 1976-02-27 |
Family
ID=23963371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7523541A Withdrawn FR2280976A1 (fr) | 1974-08-02 | 1975-07-28 | Procede de fabrication d'un dispositif semi-conducteur |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5140757A (cs) |
| BE (1) | BE832064A (cs) |
| DE (1) | DE2533550A1 (cs) |
| FR (1) | FR2280976A1 (cs) |
| IN (1) | IN140598B (cs) |
| IT (1) | IT1039690B (cs) |
| SE (1) | SE7508447L (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0008661A1 (fr) * | 1978-09-08 | 1980-03-19 | International Business Machines Corporation | Procédé de traitement thermique préliminaire de corps semiconducteurs pour en accroitre ulterieurement l'effet de piegeage interne |
-
1975
- 1975-06-24 IN IN1243/CAL/75A patent/IN140598B/en unknown
- 1975-07-02 IT IT25039/75A patent/IT1039690B/it active
- 1975-07-24 SE SE7508447A patent/SE7508447L/ not_active Application Discontinuation
- 1975-07-26 DE DE19752533550 patent/DE2533550A1/de active Pending
- 1975-07-28 FR FR7523541A patent/FR2280976A1/fr not_active Withdrawn
- 1975-08-01 JP JP50094676A patent/JPS5140757A/ja active Pending
- 1975-08-01 BE BE158891A patent/BE832064A/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0008661A1 (fr) * | 1978-09-08 | 1980-03-19 | International Business Machines Corporation | Procédé de traitement thermique préliminaire de corps semiconducteurs pour en accroitre ulterieurement l'effet de piegeage interne |
| FR2435818A1 (fr) * | 1978-09-08 | 1980-04-04 | Ibm France | Procede pour accroitre l'effet de piegeage interne des corps semi-conducteurs |
Also Published As
| Publication number | Publication date |
|---|---|
| BE832064A (fr) | 1975-12-01 |
| IT1039690B (it) | 1979-12-10 |
| JPS5140757A (en) | 1976-04-05 |
| DE2533550A1 (de) | 1976-02-19 |
| IN140598B (cs) | 1976-12-04 |
| SE7508447L (sv) | 1976-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |