FR2254658A1 - - Google Patents
Info
- Publication number
- FR2254658A1 FR2254658A1 FR7440785A FR7440785A FR2254658A1 FR 2254658 A1 FR2254658 A1 FR 2254658A1 FR 7440785 A FR7440785 A FR 7440785A FR 7440785 A FR7440785 A FR 7440785A FR 2254658 A1 FR2254658 A1 FR 2254658A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US424474A US3902977A (en) | 1973-12-13 | 1973-12-13 | Gold plating solutions and method |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2254658A1 true FR2254658A1 (fr) | 1975-07-11 |
FR2254658B1 FR2254658B1 (fr) | 1979-06-15 |
Family
ID=23682749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7440785A Expired FR2254658B1 (fr) | 1973-12-13 | 1974-12-11 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3902977A (fr) |
JP (1) | JPS5092833A (fr) |
CA (1) | CA1048964A (fr) |
CH (1) | CH606503A5 (fr) |
DE (1) | DE2458913A1 (fr) |
FR (1) | FR2254658B1 (fr) |
GB (1) | GB1453386A (fr) |
IT (1) | IT1024416B (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0121492A1 (fr) * | 1983-02-07 | 1984-10-10 | Heinz Emmenegger | Bain galvanique pour le dépôt electrolytique d'alliage or-cuivre-cadmium, procédé d'utilisation de ce bain, article résultant de ce procédé |
EP0149830A2 (fr) * | 1983-12-29 | 1985-07-31 | H. E. Finishing SA | Bain électrolytique pour le dépôt de couches minces d'or pur |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4207149A (en) * | 1974-12-04 | 1980-06-10 | Engelhard Minerals & Chemicals Corporation | Gold electroplating solutions and processes |
US4396471A (en) * | 1981-12-14 | 1983-08-02 | American Chemical & Refining Company, Inc. | Gold plating bath and method using maleic anhydride polymer chelate |
GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
US5942350A (en) * | 1997-03-10 | 1999-08-24 | United Technologies Corporation | Graded metal hardware component for an electrochemical cell |
US6828898B2 (en) * | 2003-04-03 | 2004-12-07 | Cts Corporation | Fuel tank resistor card having improved corrosion resistance |
US20090104463A1 (en) | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
SG127854A1 (en) * | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
JP4945193B2 (ja) | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 硬質金合金めっき液 |
KR100848689B1 (ko) * | 2006-11-01 | 2008-07-28 | 고려대학교 산학협력단 | 다층 나노선 및 이의 형성방법 |
WO2008102580A1 (fr) * | 2007-02-23 | 2008-08-28 | Japan Pure Chemical Co., Ltd. | Solution de placage d'or électrolytique et film d'or produit par cette solution |
CH710184B1 (fr) * | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques. |
WO2012001132A1 (fr) * | 2010-06-30 | 2012-01-05 | Schauenburg Ruhrkunststoff Gmbh | Couches de métal noble/métal pouvant subir des contraintes tribologiques |
EP2588645B1 (fr) | 2010-06-30 | 2018-05-30 | RDM Family Investments LLC | Procédé de dépôt d'une couche nickel-métal |
US20160145756A1 (en) * | 2014-11-21 | 2016-05-26 | Rohm And Haas Electronic Materials Llc | Environmentally friendly gold electroplating compositions and methods |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH286123A (fr) * | 1952-05-08 | 1952-10-15 | Spreter Victor | Bain pour le dépôt par voie galvanique d'alliages d'or. |
NL273924A (fr) * | 1961-01-24 | |||
US3149057A (en) * | 1959-04-27 | 1964-09-15 | Technic | Acid gold plating |
US3149058A (en) * | 1959-12-31 | 1964-09-15 | Technic | Bright gold plating process |
US3666640A (en) * | 1971-04-23 | 1972-05-30 | Sel Rex Corp | Gold plating bath and process |
US3783111A (en) * | 1972-09-11 | 1974-01-01 | Auric Corp | Gold plating bath for barrel plating operations |
-
1973
- 1973-12-13 US US424474A patent/US3902977A/en not_active Expired - Lifetime
-
1974
- 1974-12-10 CA CA74215619A patent/CA1048964A/fr not_active Expired
- 1974-12-11 JP JP49142397A patent/JPS5092833A/ja active Pending
- 1974-12-11 FR FR7440785A patent/FR2254658B1/fr not_active Expired
- 1974-12-11 IT IT54490/74A patent/IT1024416B/it active
- 1974-12-12 DE DE19742458913 patent/DE2458913A1/de not_active Withdrawn
- 1974-12-12 CH CH1654874A patent/CH606503A5/xx not_active IP Right Cessation
- 1974-12-12 GB GB5381574A patent/GB1453386A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0121492A1 (fr) * | 1983-02-07 | 1984-10-10 | Heinz Emmenegger | Bain galvanique pour le dépôt electrolytique d'alliage or-cuivre-cadmium, procédé d'utilisation de ce bain, article résultant de ce procédé |
EP0149830A2 (fr) * | 1983-12-29 | 1985-07-31 | H. E. Finishing SA | Bain électrolytique pour le dépôt de couches minces d'or pur |
EP0149830A3 (en) * | 1983-12-29 | 1986-10-15 | H. E. Finishing Sa | Electrolytic bath for the deposition of thin layers of pure gold |
Also Published As
Publication number | Publication date |
---|---|
CH606503A5 (fr) | 1978-10-31 |
JPS5092833A (fr) | 1975-07-24 |
DE2458913A1 (de) | 1975-06-26 |
FR2254658B1 (fr) | 1979-06-15 |
IT1024416B (it) | 1978-06-20 |
CA1048964A (fr) | 1979-02-20 |
GB1453386A (en) | 1976-10-20 |
US3902977A (en) | 1975-09-02 |
AU7622274A (en) | 1976-06-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |