FR2231038A2 - Photohardenable layer - to form protective passivating layer with semi-conductors - Google Patents

Photohardenable layer - to form protective passivating layer with semi-conductors

Info

Publication number
FR2231038A2
FR2231038A2 FR7417665A FR7417665A FR2231038A2 FR 2231038 A2 FR2231038 A2 FR 2231038A2 FR 7417665 A FR7417665 A FR 7417665A FR 7417665 A FR7417665 A FR 7417665A FR 2231038 A2 FR2231038 A2 FR 2231038A2
Authority
FR
France
Prior art keywords
polymer
layer
connections
semiconductors
exposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7417665A
Other languages
French (fr)
Other versions
FR2231038B2 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732308830 external-priority patent/DE2308830C3/en
Priority claimed from DE2326314A external-priority patent/DE2326314C2/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2231038A2 publication Critical patent/FR2231038A2/en
Application granted granted Critical
Publication of FR2231038B2 publication Critical patent/FR2231038B2/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/145—Organic dielectrics vapour deposited
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

Forming relief structures of polymer stable to high temps by exposing a photosensitive pre-polymer to a negative model, then eliminating the unexposed areas; the pre-polymer being a carbocyclic/heterocyclic cpd. bearing at least 2 gps. capable of polyaddn. or polycondensation and also an organic gp. o or p to the above gps. which contains dimerisable or photopolymerisable links and which is linked via an ester gp. Addn. to the above in that the relief structures are used as a protective passivating layer and the removed unexposed parts are holes used for making connections. Pref. using a polyamide pre-polymer, applied by centrifuge; exposing to ultra-violet light, then developing with alcohol/dimethyl formamide. Partic. for wire connections in semiconductors with soldered micropaved connections with a contact stud over a metal layer in the opening and also micro-beam connections. Also as a dielectric in a condenser. Used with semiconductors. The procedure is simpler than using a polyimide plus a photosensitive layer; improved adhesion and a faster hardening rate is obtd.
FR7417665A 1973-02-22 1974-05-21 Photohardenable layer - to form protective passivating layer with semi-conductors Granted FR2231038A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19732308830 DE2308830C3 (en) 1973-02-22 Process for the production of relief structures
DE2326314A DE2326314C2 (en) 1973-05-23 1973-05-23 Process for the production of relief structures

Publications (2)

Publication Number Publication Date
FR2231038A2 true FR2231038A2 (en) 1974-12-20
FR2231038B2 FR2231038B2 (en) 1977-11-04

Family

ID=34218995

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7417665A Granted FR2231038A2 (en) 1973-02-22 1974-05-21 Photohardenable layer - to form protective passivating layer with semi-conductors

Country Status (1)

Country Link
FR (1) FR2231038A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2408538A1 (en) * 1977-11-11 1979-06-08 Bobst Sa CONTROL DEVICE FOR THE SCROLLING OF A STRIP MATERIAL DELIVERED CONTINUOUSLY TO A MACHINE WORKING ON IT SEQUENTIALLY

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2408538A1 (en) * 1977-11-11 1979-06-08 Bobst Sa CONTROL DEVICE FOR THE SCROLLING OF A STRIP MATERIAL DELIVERED CONTINUOUSLY TO A MACHINE WORKING ON IT SEQUENTIALLY

Also Published As

Publication number Publication date
FR2231038B2 (en) 1977-11-04

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