FR2202958A1 - Depositing nickel on semiconductors - by thermal decompsn. of nickel carbonyl - Google Patents

Depositing nickel on semiconductors - by thermal decompsn. of nickel carbonyl

Info

Publication number
FR2202958A1
FR2202958A1 FR7236143A FR7236143A FR2202958A1 FR 2202958 A1 FR2202958 A1 FR 2202958A1 FR 7236143 A FR7236143 A FR 7236143A FR 7236143 A FR7236143 A FR 7236143A FR 2202958 A1 FR2202958 A1 FR 2202958A1
Authority
FR
France
Prior art keywords
nickel
semiconductors
carbonyl
depositing
decompsn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7236143A
Other languages
English (en)
French (fr)
Other versions
FR2202958B1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ni
Original Assignee
Ni
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ni filed Critical Ni
Priority to FR7236143A priority Critical patent/FR2202958A1/fr
Publication of FR2202958A1 publication Critical patent/FR2202958A1/fr
Application granted granted Critical
Publication of FR2202958B1 publication Critical patent/FR2202958B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/16—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal carbonyl compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
FR7236143A 1972-10-12 1972-10-12 Depositing nickel on semiconductors - by thermal decompsn. of nickel carbonyl Granted FR2202958A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7236143A FR2202958A1 (en) 1972-10-12 1972-10-12 Depositing nickel on semiconductors - by thermal decompsn. of nickel carbonyl

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7236143A FR2202958A1 (en) 1972-10-12 1972-10-12 Depositing nickel on semiconductors - by thermal decompsn. of nickel carbonyl

Publications (2)

Publication Number Publication Date
FR2202958A1 true FR2202958A1 (en) 1974-05-10
FR2202958B1 FR2202958B1 (https=) 1977-01-14

Family

ID=9105538

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7236143A Granted FR2202958A1 (en) 1972-10-12 1972-10-12 Depositing nickel on semiconductors - by thermal decompsn. of nickel carbonyl

Country Status (1)

Country Link
FR (1) FR2202958A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109599478A (zh) * 2018-11-29 2019-04-09 太原理工大学 一种界面包覆优化碲基复合材料热电性能的方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109599478A (zh) * 2018-11-29 2019-04-09 太原理工大学 一种界面包覆优化碲基复合材料热电性能的方法
CN109599478B (zh) * 2018-11-29 2023-01-06 太原理工大学 一种界面包覆优化碲基复合材料热电性能的方法

Also Published As

Publication number Publication date
FR2202958B1 (https=) 1977-01-14

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Legal Events

Date Code Title Description
ST Notification of lapse