FR2188304B1 - - Google Patents
Info
- Publication number
- FR2188304B1 FR2188304B1 FR7221657A FR7221657A FR2188304B1 FR 2188304 B1 FR2188304 B1 FR 2188304B1 FR 7221657 A FR7221657 A FR 7221657A FR 7221657 A FR7221657 A FR 7221657A FR 2188304 B1 FR2188304 B1 FR 2188304B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7221657A FR2188304B1 (https=) | 1972-06-15 | 1972-06-15 | |
| GB2725073A GB1440627A (en) | 1972-06-15 | 1973-06-07 | Method for manufacturing integrated circuits |
| US05/368,460 US3930305A (en) | 1972-06-15 | 1973-06-08 | Method for manufacturing integrated circuits |
| IT68758/73A IT986462B (it) | 1972-06-15 | 1973-06-14 | Procedimento per la realizzazione dei contatti elettrici per circui ti integpati |
| NLAANVRAGE7308278,A NL182107C (nl) | 1972-06-15 | 1973-06-14 | Werkwijze voor het vervaardigen van een geintegreerde schakeling met een uit twee patronen van laagvormige gebieden van geleidend materiaal samengesteld verbindingspatroon. |
| DE2330645A DE2330645C3 (de) | 1972-06-15 | 1973-06-15 | Verfahren zum Kontaktieren von integrierten Schaltungen |
| JP48067673A JPS588143B2 (ja) | 1972-06-15 | 1973-06-15 | シユウセキカイロ ノ セイゾウホウ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7221657A FR2188304B1 (https=) | 1972-06-15 | 1972-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2188304A1 FR2188304A1 (https=) | 1974-01-18 |
| FR2188304B1 true FR2188304B1 (https=) | 1977-07-22 |
Family
ID=9100271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7221657A Expired FR2188304B1 (https=) | 1972-06-15 | 1972-06-15 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3930305A (https=) |
| JP (1) | JPS588143B2 (https=) |
| DE (1) | DE2330645C3 (https=) |
| FR (1) | FR2188304B1 (https=) |
| GB (1) | GB1440627A (https=) |
| IT (1) | IT986462B (https=) |
| NL (1) | NL182107C (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4328263A (en) | 1979-07-31 | 1982-05-04 | Fujitsu Limited | Method of manufacturing semiconductor devices using lift-off technique |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3828812A1 (de) * | 1988-08-25 | 1990-03-08 | Fraunhofer Ges Forschung | Dreidimensionale integrierte schaltung und verfahren zu deren herstellung |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3274453A (en) * | 1961-02-20 | 1966-09-20 | Philco Corp | Semiconductor integrated structures and methods for the fabrication thereof |
| US3341753A (en) * | 1964-10-21 | 1967-09-12 | Texas Instruments Inc | Metallic contacts for semiconductor devices |
| US3667005A (en) * | 1966-06-30 | 1972-05-30 | Texas Instruments Inc | Ohmic contacts for semiconductors devices |
| NL153374B (nl) * | 1966-10-05 | 1977-05-16 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting voorzien van een oxydelaag en halfgeleiderinrichting vervaardigd volgens de werkwijze. |
| US3434020A (en) * | 1966-12-30 | 1969-03-18 | Texas Instruments Inc | Ohmic contacts consisting of a first level of molybdenum-gold mixture of gold and vanadium and a second level of molybdenum-gold |
| NL158024B (nl) * | 1967-05-13 | 1978-09-15 | Philips Nv | Werkwijze ter vervaardiging van een halfgeleiderinrichting en halfgeleiderinrichting verkregen door toepassing van de werkwijze. |
| US3495324A (en) * | 1967-11-13 | 1970-02-17 | Sperry Rand Corp | Ohmic contact for planar devices |
| US3642528A (en) * | 1968-06-05 | 1972-02-15 | Matsushita Electronics Corp | Semiconductor device and method of making same |
| US3641661A (en) * | 1968-06-25 | 1972-02-15 | Texas Instruments Inc | Method of fabricating integrated circuit arrays |
| US3700508A (en) * | 1970-06-25 | 1972-10-24 | Gen Instrument Corp | Fabrication of integrated microcircuit devices |
| JPS4851595A (https=) * | 1971-10-29 | 1973-07-19 |
-
1972
- 1972-06-15 FR FR7221657A patent/FR2188304B1/fr not_active Expired
-
1973
- 1973-06-07 GB GB2725073A patent/GB1440627A/en not_active Expired
- 1973-06-08 US US05/368,460 patent/US3930305A/en not_active Expired - Lifetime
- 1973-06-14 IT IT68758/73A patent/IT986462B/it active
- 1973-06-14 NL NLAANVRAGE7308278,A patent/NL182107C/xx not_active IP Right Cessation
- 1973-06-15 JP JP48067673A patent/JPS588143B2/ja not_active Expired
- 1973-06-15 DE DE2330645A patent/DE2330645C3/de not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4328263A (en) | 1979-07-31 | 1982-05-04 | Fujitsu Limited | Method of manufacturing semiconductor devices using lift-off technique |
Also Published As
| Publication number | Publication date |
|---|---|
| NL182107B (nl) | 1987-08-03 |
| GB1440627A (en) | 1976-06-23 |
| DE2330645B2 (de) | 1976-11-18 |
| FR2188304A1 (https=) | 1974-01-18 |
| NL7308278A (https=) | 1973-12-18 |
| NL182107C (nl) | 1988-01-04 |
| DE2330645A1 (de) | 1974-01-24 |
| JPS4952589A (https=) | 1974-05-22 |
| DE2330645C3 (de) | 1982-07-08 |
| JPS588143B2 (ja) | 1983-02-14 |
| US3930305A (en) | 1976-01-06 |
| IT986462B (it) | 1975-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |