FR2186732A1 - - Google Patents

Info

Publication number
FR2186732A1
FR2186732A1 FR7315257A FR7315257A FR2186732A1 FR 2186732 A1 FR2186732 A1 FR 2186732A1 FR 7315257 A FR7315257 A FR 7315257A FR 7315257 A FR7315257 A FR 7315257A FR 2186732 A1 FR2186732 A1 FR 2186732A1
Authority
FR
France
Prior art keywords
microcircuit
bonded
novolac
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7315257A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2186732A1 publication Critical patent/FR2186732A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W76/157—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/354—
    • H10W74/00—

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR7315257A 1972-05-31 1973-04-19 Withdrawn FR2186732A1 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25816772A 1972-05-31 1972-05-31

Publications (1)

Publication Number Publication Date
FR2186732A1 true FR2186732A1 (cg-RX-API-DMAC10.html) 1974-01-11

Family

ID=22979383

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7315257A Withdrawn FR2186732A1 (cg-RX-API-DMAC10.html) 1972-05-31 1973-04-19

Country Status (5)

Country Link
JP (1) JPS521738B2 (cg-RX-API-DMAC10.html)
DE (1) DE2315714A1 (cg-RX-API-DMAC10.html)
FR (1) FR2186732A1 (cg-RX-API-DMAC10.html)
GB (1) GB1419163A (cg-RX-API-DMAC10.html)
IT (1) IT981202B (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584842B2 (ja) * 1975-01-06 1983-01-28 日本電信電話株式会社 機械「ろ」波器用変換子の製造方法
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5491178A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS5491180A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS54121673A (en) * 1978-03-15 1979-09-20 Hitachi Ltd Insulator coating material and semiconductor device using the said material
JPS5582125A (en) * 1978-12-19 1980-06-20 Dainippon Toryo Co Ltd Preparation of resin particle
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Also Published As

Publication number Publication date
JPS4931747A (cg-RX-API-DMAC10.html) 1974-03-22
IT981202B (it) 1974-10-10
JPS521738B2 (cg-RX-API-DMAC10.html) 1977-01-18
GB1419163A (en) 1975-12-24
DE2315714A1 (de) 1973-12-20

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Legal Events

Date Code Title Description
ST Notification of lapse