JPS5491178A - Mounting method of semiconductor device - Google Patents

Mounting method of semiconductor device

Info

Publication number
JPS5491178A
JPS5491178A JP16068777A JP16068777A JPS5491178A JP S5491178 A JPS5491178 A JP S5491178A JP 16068777 A JP16068777 A JP 16068777A JP 16068777 A JP16068777 A JP 16068777A JP S5491178 A JPS5491178 A JP S5491178A
Authority
JP
Japan
Prior art keywords
resin
polybutadiene
substrate
semiconductor device
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16068777A
Other languages
Japanese (ja)
Other versions
JPS5726414B2 (en
Inventor
Shiro Takeda
Yuji Nagai
Minoru Nakajima
Kunihiko Hayashi
Koji Serizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16068777A priority Critical patent/JPS5491178A/en
Priority to US05/971,658 priority patent/US4326238A/en
Publication of JPS5491178A publication Critical patent/JPS5491178A/en
Publication of JPS5726414B2 publication Critical patent/JPS5726414B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To make humidity and heat-proof efficiency and heat radiation efficiency superior and make it easy to remove a mounted device from a substrate, by applying and drying and solidifhying polybutadiene-system resin which includes a specific % of inorganic metal compound after filling up the gap between the semiconductor device and the substrate with resin.
CONSTITUTION: After filling up the gap between a semiconductor device and a circuit substrate with polybutadiene-system resin, for example, 1,2-polybutadiene, cycliccis-1,4-polybutadiene, etc., including 0 to 70 weight % of powder of inorganic metal compound such as α-aluminum, MgO, SiC and mica which have a high thermal conductivity is applied to a part or the whole of the device and is dried and solidified or hardened. In case that this resin has a comparatively low melting point, organic peroxides are used as bridging meterials to harden this resin; and in case that this resin has a high melting point, acrylic-acid ester is used as thermosetting materials to hardened this resin thermally. As a result, humidity and heat-proof efficfiency and heat radiation efficiency are improved, and the device can be removed from the substrate easily.
COPYRIGHT: (C)1979,JPO&Japio
JP16068777A 1977-12-28 1977-12-28 Mounting method of semiconductor device Granted JPS5491178A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP16068777A JPS5491178A (en) 1977-12-28 1977-12-28 Mounting method of semiconductor device
US05/971,658 US4326238A (en) 1977-12-28 1978-12-21 Electronic circuit packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16068777A JPS5491178A (en) 1977-12-28 1977-12-28 Mounting method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5491178A true JPS5491178A (en) 1979-07-19
JPS5726414B2 JPS5726414B2 (en) 1982-06-04

Family

ID=15720286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16068777A Granted JPS5491178A (en) 1977-12-28 1977-12-28 Mounting method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5491178A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59206507A (en) * 1983-05-11 1984-11-22 中田　賢従 Fence apparatus for preventing wind, snow and wave
JPS61183508A (en) * 1985-02-08 1986-08-16 東京製綱株式会社 Snow preventing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931747A (en) * 1972-05-31 1974-03-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4931747A (en) * 1972-05-31 1974-03-22

Also Published As

Publication number Publication date
JPS5726414B2 (en) 1982-06-04

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