FR2179267A1 - Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former - Google Patents
Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex formerInfo
- Publication number
- FR2179267A1 FR2179267A1 FR7312965A FR7312965A FR2179267A1 FR 2179267 A1 FR2179267 A1 FR 2179267A1 FR 7312965 A FR7312965 A FR 7312965A FR 7312965 A FR7312965 A FR 7312965A FR 2179267 A1 FR2179267 A1 FR 2179267A1
- Authority
- FR
- France
- Prior art keywords
- copper
- complex former
- ammonium salt
- alkaline soln
- contg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 2
- 229910052802 copper Inorganic materials 0.000 title 2
- 239000010949 copper Substances 0.000 title 2
- 150000003863 ammonium salts Chemical class 0.000 title 1
- 229910020220 Pb—Sn Inorganic materials 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 230000008929 regeneration Effects 0.000 abstract 1
- 238000011069 regeneration method Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722216269 DE2216269A1 (de) | 1972-04-05 | 1972-04-05 | Verfahren zum aetzen von kupfer und kupferlegierungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2179267A1 true FR2179267A1 (en) | 1973-11-16 |
| FR2179267B3 FR2179267B3 (enExample) | 1976-03-26 |
Family
ID=5841002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7312965A Granted FR2179267A1 (en) | 1972-04-05 | 1973-04-02 | Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE2216269A1 (enExample) |
| FR (1) | FR2179267A1 (enExample) |
| IT (1) | IT980767B (enExample) |
| NL (1) | NL7303601A (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0122963A1 (de) * | 1983-04-13 | 1984-10-31 | Forschungszentrum Jülich Gmbh | Anlage zum Regenerieren einer ammoniakalischen Ätzlösung |
| EP0144742A1 (de) * | 1983-11-08 | 1985-06-19 | Forschungszentrum Jülich Gmbh | Verfahren und Anlage zum Regenerieren einer ammoniakalischen Ätzlösung |
| EP0117068A3 (en) * | 1983-01-20 | 1986-04-16 | The Electricity Council | Method and apparatus for etching copper |
| EP0137123A3 (en) * | 1983-07-07 | 1986-05-07 | Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung | Etching solution containing ammonium sulfate, and process for regenerating it |
| EP0158910A3 (en) * | 1984-04-16 | 1987-10-07 | Lancy International, Inc. | Process for recovering copper from an ammoniacal copper-etching solution, and regeneration of this solution |
| EP0349600A4 (en) * | 1987-12-29 | 1990-04-10 | Macdermid Inc | Copper etching compositions. |
| FR2712607A1 (fr) * | 1993-11-18 | 1995-05-24 | Elochem Aetztechnik Gmbh | Procédé accéléré de rongeage et de séparation des métaux dans les installations de rongeage en milieu ammoniacal. |
| EP0722512A4 (enExample) * | 1993-09-08 | 1996-07-31 | ||
| FR2854905A1 (fr) * | 2003-05-16 | 2004-11-19 | Airbus France | Procede de recuperation du cuivre d'une solution de gravure ammoniacale usee et de regeneration d'un sel d'ammonium |
| RU2622072C1 (ru) * | 2016-01-11 | 2017-06-09 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ФГБОУ ВПО "Пензенский государственный университет") | Способ утилизации отработанного медно-аммиачного раствора |
| CN118186394A (zh) * | 2024-05-16 | 2024-06-14 | 苏州高芯众科半导体有限公司 | Tf液晶面板刻蚀腔铝板清洁再生的方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3348401C2 (en) * | 1983-02-16 | 1993-08-26 | Siemens Ag, 8000 Muenchen, De | Electrolyte regeneration of ammoniacal etching soln. |
| DE3305319A1 (de) * | 1983-02-16 | 1984-08-16 | Siemens AG, 1000 Berlin und 8000 München | Elektrolytisches vollregenerierverfahren einer ammoniakalischen aetzloesung |
-
1972
- 1972-04-05 DE DE19722216269 patent/DE2216269A1/de active Pending
-
1973
- 1973-03-15 NL NL7303601A patent/NL7303601A/xx unknown
- 1973-04-02 FR FR7312965A patent/FR2179267A1/fr active Granted
- 1973-04-05 IT IT6797573A patent/IT980767B/it active
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0117068A3 (en) * | 1983-01-20 | 1986-04-16 | The Electricity Council | Method and apparatus for etching copper |
| EP0122963A1 (de) * | 1983-04-13 | 1984-10-31 | Forschungszentrum Jülich Gmbh | Anlage zum Regenerieren einer ammoniakalischen Ätzlösung |
| EP0137123A3 (en) * | 1983-07-07 | 1986-05-07 | Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung | Etching solution containing ammonium sulfate, and process for regenerating it |
| EP0144742A1 (de) * | 1983-11-08 | 1985-06-19 | Forschungszentrum Jülich Gmbh | Verfahren und Anlage zum Regenerieren einer ammoniakalischen Ätzlösung |
| EP0158910A3 (en) * | 1984-04-16 | 1987-10-07 | Lancy International, Inc. | Process for recovering copper from an ammoniacal copper-etching solution, and regeneration of this solution |
| EP0349600A4 (en) * | 1987-12-29 | 1990-04-10 | Macdermid Inc | Copper etching compositions. |
| EP0722512A4 (enExample) * | 1993-09-08 | 1996-07-31 | ||
| FR2712607A1 (fr) * | 1993-11-18 | 1995-05-24 | Elochem Aetztechnik Gmbh | Procédé accéléré de rongeage et de séparation des métaux dans les installations de rongeage en milieu ammoniacal. |
| FR2854905A1 (fr) * | 2003-05-16 | 2004-11-19 | Airbus France | Procede de recuperation du cuivre d'une solution de gravure ammoniacale usee et de regeneration d'un sel d'ammonium |
| WO2004104269A1 (fr) * | 2003-05-16 | 2004-12-02 | Airbus France | Procede de recuperation du cuivre d'une solution de gravure ammoniacale usee et de regeneration d'un sel d'ammonium |
| RU2622072C1 (ru) * | 2016-01-11 | 2017-06-09 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ФГБОУ ВПО "Пензенский государственный университет") | Способ утилизации отработанного медно-аммиачного раствора |
| CN118186394A (zh) * | 2024-05-16 | 2024-06-14 | 苏州高芯众科半导体有限公司 | Tf液晶面板刻蚀腔铝板清洁再生的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT980767B (it) | 1974-10-10 |
| NL7303601A (enExample) | 1973-10-09 |
| DE2216269A1 (de) | 1973-10-18 |
| FR2179267B3 (enExample) | 1976-03-26 |
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| FR2179267A1 (en) | Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former | |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |