FR2179267A1 - Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former - Google Patents

Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former

Info

Publication number
FR2179267A1
FR2179267A1 FR7312965A FR7312965A FR2179267A1 FR 2179267 A1 FR2179267 A1 FR 2179267A1 FR 7312965 A FR7312965 A FR 7312965A FR 7312965 A FR7312965 A FR 7312965A FR 2179267 A1 FR2179267 A1 FR 2179267A1
Authority
FR
France
Prior art keywords
copper
complex former
ammonium salt
alkaline soln
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7312965A
Other languages
French (fr)
Other versions
FR2179267B3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HOELLMUELLER MASCHBAU H
Original Assignee
HOELLMUELLER MASCHBAU H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HOELLMUELLER MASCHBAU H filed Critical HOELLMUELLER MASCHBAU H
Publication of FR2179267A1 publication Critical patent/FR2179267A1/en
Application granted granted Critical
Publication of FR2179267B3 publication Critical patent/FR2179267B3/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Cu (alloys) esp. Cu-coated conducting plates are etched with an alkaline soln. contg. an excess of an org. and/or inorg. NH4 salt as solvent for the Cu, and an NH3- contg. cpd. as complex former, regeneration of the etching agent being effected by adding a similar NH4 salt, and a similar complex former. Does not attack Sn, Pb-Sn, Au and Ag etch reserves. Easily regenerated.
FR7312965A 1972-04-05 1973-04-02 Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former Granted FR2179267A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722216269 DE2216269A1 (en) 1972-04-05 1972-04-05 METHOD OF ETCHING COPPER AND COPPER ALLOYS

Publications (2)

Publication Number Publication Date
FR2179267A1 true FR2179267A1 (en) 1973-11-16
FR2179267B3 FR2179267B3 (en) 1976-03-26

Family

ID=5841002

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7312965A Granted FR2179267A1 (en) 1972-04-05 1973-04-02 Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former

Country Status (4)

Country Link
DE (1) DE2216269A1 (en)
FR (1) FR2179267A1 (en)
IT (1) IT980767B (en)
NL (1) NL7303601A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117068A2 (en) * 1983-01-20 1984-08-29 The Electricity Council Method and apparatus for etching copper
EP0122963A1 (en) * 1983-04-13 1984-10-31 Forschungszentrum Jülich Gmbh Apparatus for regenerating an ammoniacal etching solution
EP0137123A2 (en) * 1983-07-07 1985-04-17 Forschungszentrum Jülich Gmbh Etching solution containing ammonium sulfate, and process for regenerating it
EP0144742A1 (en) * 1983-11-08 1985-06-19 Forschungszentrum Jülich Gmbh Process and apparatus for regenerating an ammoniacal etching solution
EP0158910A2 (en) * 1984-04-16 1985-10-23 Lancy International, Inc. Process for recovering copper from an ammoniacal copper-etching solution, and regeneration of this solution
EP0349600A1 (en) * 1987-12-29 1990-01-10 Macdermid Inc Improved copper etchant compositions.
FR2712607A1 (en) * 1993-11-18 1995-05-24 Elochem Aetztechnik Gmbh Accelerated process for the gassing and separation of metals in ammonia gassing facilities.
EP0722512A1 (en) * 1993-09-08 1996-07-24 Phibro Tech, Inc. Copper etchant solution additives
FR2854905A1 (en) * 2003-05-16 2004-11-19 Airbus France The recuperation of copper from a spent ammoniac engraving solution by electrolysis with regeneration of the engraving solution
RU2622072C1 (en) * 2016-01-11 2017-06-09 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ФГБОУ ВПО "Пензенский государственный университет") Method of utilisation of a processed copper-ammonium solution

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3348401C2 (en) * 1983-02-16 1993-08-26 Siemens Ag, 8000 Muenchen, De Electrolyte regeneration of ammoniacal etching soln.
DE3305319A1 (en) * 1983-02-16 1984-08-16 Siemens AG, 1000 Berlin und 8000 München Electrolytic full regeneration process for an ammoniacal etching solution
RU2568225C1 (en) * 2014-06-10 2015-11-10 Акционерное общество "Калужский научно-исследовательский институт телемеханических устройств"(АО "КНИИТМУ") Method of extracting copper (+2) from spent solutions

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0117068A2 (en) * 1983-01-20 1984-08-29 The Electricity Council Method and apparatus for etching copper
EP0117068A3 (en) * 1983-01-20 1986-04-16 The Electricity Council Method and apparatus for etching copper
EP0122963A1 (en) * 1983-04-13 1984-10-31 Forschungszentrum Jülich Gmbh Apparatus for regenerating an ammoniacal etching solution
EP0137123A2 (en) * 1983-07-07 1985-04-17 Forschungszentrum Jülich Gmbh Etching solution containing ammonium sulfate, and process for regenerating it
EP0137123A3 (en) * 1983-07-07 1986-05-07 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Etching solution containing ammonium sulfate, and process for regenerating it
EP0144742A1 (en) * 1983-11-08 1985-06-19 Forschungszentrum Jülich Gmbh Process and apparatus for regenerating an ammoniacal etching solution
EP0158910A2 (en) * 1984-04-16 1985-10-23 Lancy International, Inc. Process for recovering copper from an ammoniacal copper-etching solution, and regeneration of this solution
EP0158910A3 (en) * 1984-04-16 1987-10-07 Lancy International, Inc. Process for recovering copper from an ammoniacal copper-etching solution, and regeneration of this solution
EP0349600A1 (en) * 1987-12-29 1990-01-10 Macdermid Inc Improved copper etchant compositions.
EP0349600A4 (en) * 1987-12-29 1990-04-10 Macdermid Inc Improved copper etchant compositions.
EP0722512A1 (en) * 1993-09-08 1996-07-24 Phibro Tech, Inc. Copper etchant solution additives
EP0722512A4 (en) * 1993-09-08 1996-07-31
FR2712607A1 (en) * 1993-11-18 1995-05-24 Elochem Aetztechnik Gmbh Accelerated process for the gassing and separation of metals in ammonia gassing facilities.
FR2854905A1 (en) * 2003-05-16 2004-11-19 Airbus France The recuperation of copper from a spent ammoniac engraving solution by electrolysis with regeneration of the engraving solution
WO2004104269A1 (en) * 2003-05-16 2004-12-02 Airbus France Method for recovering copper from a used ammoniacal etching solution and for regenerating an ammonium salt
RU2622072C1 (en) * 2016-01-11 2017-06-09 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Пензенский государственный университет" (ФГБОУ ВПО "Пензенский государственный университет") Method of utilisation of a processed copper-ammonium solution

Also Published As

Publication number Publication date
FR2179267B3 (en) 1976-03-26
DE2216269A1 (en) 1973-10-18
NL7303601A (en) 1973-10-09
IT980767B (en) 1974-10-10

Similar Documents

Publication Publication Date Title
FR2179267A1 (en) Etching copper - with alkaline soln contg ammonium salt for dissolving copper, and complex former
CA976766A (en) Method for the selective extraction of metals from aqueous solutions by means of neo-alkyl-hydroxamic acids
DK129949B (en) Method for stabilizing an aqueous bath for electroless deposition of copper, nickel, cobalt, cadmium or tin on surfaces of carriers.
Coffin et al. Influence of pressure on the structural damage in metal forming processes
NL163059B (en) METHOD FOR MANUFACTURING A SEMI-CONDUCTOR DEVICE BOMBATING AN ION-LAYER APPLIED ON A SURFACE OF A SEMI-CONDUCTOR BODY.
CA902931A (en) Copper extraction from ammoniacal solutions
NL156422B (en) POLYALKYLENE FOIL, CONTAINING A METAL COMPOUND.
CA947091A (en) Processes for extracting metal values from solutions
ES416671A1 (en) Gold alloy electroplating bath
AT321052B (en) Alkaline, aqueous bath for the electroless deposition of ductile copper
GB1352867A (en) Tarnish-resistant copper or copper base alloy
CA960872A (en) Method for selectively abstracting nickel from an aqueous ammoniacal solution
FR2189776A1 (en) Regeneration of bleach-fix solns - using mercapto-/seleno-tri-/tetra-azole cpd, for easily filtered silver complex
NL151654B (en) RAZOR WEARING AT LEAST ON THE EDGE A COATING COMPOSED OF A BINARY ALLOY.
ZM6473A1 (en) Articularly copper method of avoiding a supersaturation of electrolyte solutions with one or more of the impurities-arsenic,antimory,bismuth-in the electrolytic refining of non-ferrous metals,p
FR2174816A1 (en) Dissolving copper from substrates - by oxidising copper to cuprous ions using cupric ions
GB1240181A (en) Method of improving the solderability of conducting members
NL161994B (en) PROCESS FOR PREPARING A ZEOLITE-BASED CATALYST WITH LOW ALKALINE METAL.
GB1038256A (en) Regeneration of copper chromite
GB1426643A (en) Copper etching process
NL189200C (en) ALKALINE METAL SALT OF A COMPLEX ANION, AND AN ELECTROLYTE COMPOSITION CONTAINING SUCH SALT.
NL7704959A (en) PROCESS FOR PREPARING Aqueous ALKALINE SOLUTIONS CONTAINING AN ALKINESULPHONATE AS A WETTING AGENT.
FR2286131A2 (en) Benzaldoxime chelating agent for metal extn from aq soln
SU461964A1 (en) The method of obtaining complex alloys
BLICKWEDE et al. A New Metallographic Etchant for Aluminum Bronze and Copper-Beryllium Alloys

Legal Events

Date Code Title Description
ST Notification of lapse