FR2133692A1 - - Google Patents

Info

Publication number
FR2133692A1
FR2133692A1 FR7213006A FR7213006A FR2133692A1 FR 2133692 A1 FR2133692 A1 FR 2133692A1 FR 7213006 A FR7213006 A FR 7213006A FR 7213006 A FR7213006 A FR 7213006A FR 2133692 A1 FR2133692 A1 FR 2133692A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7213006A
Other languages
French (fr)
Other versions
FR2133692B1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2133692A1 publication Critical patent/FR2133692A1/fr
Application granted granted Critical
Publication of FR2133692B1 publication Critical patent/FR2133692B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76205Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/67Complementary BJTs
    • H10D84/673Vertical complementary BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/87Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of PN-junction gate FETs

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
FR7213006A 1971-04-14 1972-04-13 Expired FR2133692B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7105000A NL7105000A (enrdf_load_stackoverflow) 1971-04-14 1971-04-14

Publications (2)

Publication Number Publication Date
FR2133692A1 true FR2133692A1 (enrdf_load_stackoverflow) 1972-12-01
FR2133692B1 FR2133692B1 (enrdf_load_stackoverflow) 1977-08-19

Family

ID=19812915

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7213006A Expired FR2133692B1 (enrdf_load_stackoverflow) 1971-04-14 1972-04-13

Country Status (11)

Country Link
AU (1) AU470407B2 (enrdf_load_stackoverflow)
BE (1) BE782012A (enrdf_load_stackoverflow)
BR (1) BR7202251D0 (enrdf_load_stackoverflow)
CH (1) CH539952A (enrdf_load_stackoverflow)
DE (1) DE2216642C3 (enrdf_load_stackoverflow)
ES (1) ES401687A1 (enrdf_load_stackoverflow)
FR (1) FR2133692B1 (enrdf_load_stackoverflow)
GB (1) GB1387021A (enrdf_load_stackoverflow)
IT (1) IT951314B (enrdf_load_stackoverflow)
NL (1) NL7105000A (enrdf_load_stackoverflow)
SE (1) SE383582B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL161301C (nl) * 1972-12-29 1980-01-15 Philips Nv Halfgeleiderinrichting en werkwijze voor de vervaar- diging daarvan.
JPS5534619U (enrdf_load_stackoverflow) * 1978-08-25 1980-03-06

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2030578A6 (fr) * 1967-12-05 1970-11-13 Sony Corp Procédé de fabrication de circuits semi-conducteurs intégrés et circuits ainsi obtenus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2030578A6 (fr) * 1967-12-05 1970-11-13 Sony Corp Procédé de fabrication de circuits semi-conducteurs intégrés et circuits ainsi obtenus

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
(REVUE US:"ELECTRONICS",VOL.44,NO5,1 MARS 1971"ISOLATION METHOD SHRINKS BIPOLAR CELLS FOR FAST, DENSEMEMORIES" *
D.PELTZER ET B.HERNDON,PAGES 53-55.) *
DENSEMEMORIES" *
REVUE US:"ELECTRONICS",VOL.44,NO5,1 MARS 1971"ISOLATION METHOD SHRINKS BIPOLAR CELLS FOR FAST, *

Also Published As

Publication number Publication date
BR7202251D0 (pt) 1973-06-07
AU470407B2 (en) 1973-10-18
FR2133692B1 (enrdf_load_stackoverflow) 1977-08-19
CH539952A (de) 1973-07-31
SE383582B (sv) 1976-03-15
DE2216642C3 (de) 1979-12-13
NL7105000A (enrdf_load_stackoverflow) 1972-10-17
DE2216642A1 (de) 1972-10-19
ES401687A1 (es) 1975-03-16
GB1387021A (en) 1975-03-12
BE782012A (fr) 1972-10-13
IT951314B (it) 1973-06-30
AU4093672A (en) 1973-10-18
DE2216642B2 (de) 1979-04-12

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