FR2119930B1 - - Google Patents
Info
- Publication number
- FR2119930B1 FR2119930B1 FR7140205A FR7140205A FR2119930B1 FR 2119930 B1 FR2119930 B1 FR 2119930B1 FR 7140205 A FR7140205 A FR 7140205A FR 7140205 A FR7140205 A FR 7140205A FR 2119930 B1 FR2119930 B1 FR 2119930B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P14/69215—
-
- H10P14/6329—
-
- H10P95/06—
-
- H10W20/40—
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10325070A | 1970-12-31 | 1970-12-31 | |
| US05/512,781 US3983022A (en) | 1970-12-31 | 1974-10-07 | Process for planarizing a surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2119930A1 FR2119930A1 (enExample) | 1972-08-11 |
| FR2119930B1 true FR2119930B1 (enExample) | 1974-08-19 |
Family
ID=26800239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7140205A Expired FR2119930B1 (enExample) | 1970-12-31 | 1971-11-04 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3983022A (enExample) |
| DE (1) | DE2164838C3 (enExample) |
| FR (1) | FR2119930B1 (enExample) |
| GB (1) | GB1361214A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3804738A (en) * | 1973-06-29 | 1974-04-16 | Ibm | Partial planarization of electrically insulative films by resputtering |
| US4036723A (en) * | 1975-08-21 | 1977-07-19 | International Business Machines Corporation | RF bias sputtering method for producing insulating films free of surface irregularities |
| US4035276A (en) * | 1976-04-29 | 1977-07-12 | Ibm Corporation | Making coplanar layers of thin films |
| NL7701559A (nl) * | 1977-02-15 | 1978-08-17 | Philips Nv | Het maken van schuine hellingen aan metaal- patronen, alsmede substraat voor een geinte- greerde schakeling voorzien van een dergelijk patroon. |
| US4131533A (en) * | 1977-12-30 | 1978-12-26 | International Business Machines Corporation | RF sputtering apparatus having floating anode shield |
| JPS56133884A (en) | 1980-03-24 | 1981-10-20 | Hitachi Ltd | Manufacture of photoelectric transducer |
| US4492717A (en) * | 1981-07-27 | 1985-01-08 | International Business Machines Corporation | Method for forming a planarized integrated circuit |
| JPS5982746A (ja) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | 半導体装置の電極配線方法 |
| US4470874A (en) * | 1983-12-15 | 1984-09-11 | International Business Machines Corporation | Planarization of multi-level interconnected metallization system |
| US4515668A (en) * | 1984-04-25 | 1985-05-07 | Honeywell Inc. | Method of forming a dielectric layer comprising a gettering material |
| US4797375A (en) * | 1984-10-05 | 1989-01-10 | Honeywell Inc. | Fabrication of metal interconnect for semiconductor device |
| JPH0697660B2 (ja) * | 1985-03-23 | 1994-11-30 | 日本電信電話株式会社 | 薄膜形成方法 |
| CA1247464A (en) * | 1985-05-13 | 1988-12-28 | Hiroaki Nakamura | Method for forming a planarized thin film |
| US4690746A (en) * | 1986-02-24 | 1987-09-01 | Genus, Inc. | Interlayer dielectric process |
| US4732658A (en) * | 1986-12-03 | 1988-03-22 | Honeywell Inc. | Planarization of silicon semiconductor devices |
| US4756810A (en) * | 1986-12-04 | 1988-07-12 | Machine Technology, Inc. | Deposition and planarizing methods and apparatus |
| US4874493A (en) * | 1988-03-28 | 1989-10-17 | Microelectronics And Computer Technology Corporation | Method of deposition of metal into cavities on a substrate |
| US5545594A (en) * | 1993-10-26 | 1996-08-13 | Yazaki Meter Co., Ltd. | Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented |
| US5393703A (en) * | 1993-11-12 | 1995-02-28 | Motorola, Inc. | Process for forming a conductive layer for semiconductor devices |
| JP3971213B2 (ja) * | 2002-03-11 | 2007-09-05 | アルプス電気株式会社 | キーボード入力装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL83318C (enExample) * | 1953-02-17 | |||
| US3287612A (en) * | 1963-12-17 | 1966-11-22 | Bell Telephone Labor Inc | Semiconductor contacts and protective coatings for planar devices |
| NL134170C (enExample) * | 1963-12-17 | 1900-01-01 | ||
| US3479269A (en) * | 1967-01-04 | 1969-11-18 | Bell Telephone Labor Inc | Method for sputter etching using a high frequency negative pulse train |
| GB1299452A (en) * | 1969-02-21 | 1972-12-13 | Smiths Industries Ltd | Improvements in or relating to methods of machining |
| US3661761A (en) * | 1969-06-02 | 1972-05-09 | Ibm | Rf sputtering apparatus for promoting resputtering of film during deposition |
| US3661747A (en) * | 1969-08-11 | 1972-05-09 | Bell Telephone Labor Inc | Method for etching thin film materials by direct cathodic back sputtering |
| US3676317A (en) * | 1970-10-23 | 1972-07-11 | Stromberg Datagraphix Inc | Sputter etching process |
-
1971
- 1971-11-04 FR FR7140205A patent/FR2119930B1/fr not_active Expired
- 1971-11-22 GB GB5405971A patent/GB1361214A/en not_active Expired
- 1971-12-27 DE DE2164838A patent/DE2164838C3/de not_active Expired
-
1974
- 1974-10-07 US US05/512,781 patent/US3983022A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB1361214A (en) | 1974-07-24 |
| FR2119930A1 (enExample) | 1972-08-11 |
| DE2164838B2 (de) | 1980-04-24 |
| DE2164838A1 (de) | 1972-07-20 |
| DE2164838C3 (de) | 1980-12-18 |
| US3983022A (en) | 1976-09-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |