FR2094178A1 - - Google Patents

Info

Publication number
FR2094178A1
FR2094178A1 FR7107883A FR7107883A FR2094178A1 FR 2094178 A1 FR2094178 A1 FR 2094178A1 FR 7107883 A FR7107883 A FR 7107883A FR 7107883 A FR7107883 A FR 7107883A FR 2094178 A1 FR2094178 A1 FR 2094178A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7107883A
Other languages
French (fr)
Other versions
FR2094178B1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2094178A1 publication Critical patent/FR2094178A1/fr
Application granted granted Critical
Publication of FR2094178B1 publication Critical patent/FR2094178B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00Electrical arrangements for controlling or matching impedance
    • H10W44/20Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00Electrical arrangements for controlling or matching impedance
    • H10W44/20Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/226Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/5445Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/541Dispositions of bond wires
    • H10W72/547Dispositions of multiple bond wires
FR7107883A 1970-06-11 1971-03-08 Expired FR2094178B1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4543470A 1970-06-11 1970-06-11

Publications (2)

Publication Number Publication Date
FR2094178A1 true FR2094178A1 (https=) 1972-02-04
FR2094178B1 FR2094178B1 (https=) 1977-01-28

Family

ID=21937850

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7107883A Expired FR2094178B1 (https=) 1970-06-11 1971-03-08

Country Status (10)

Country Link
US (1) US3611059A (https=)
JP (1) JPS5135109B1 (https=)
BE (1) BE763416A (https=)
CA (1) CA920718A (https=)
DE (1) DE2111098A1 (https=)
FR (1) FR2094178B1 (https=)
GB (1) GB1302827A (https=)
MY (1) MY7400059A (https=)
NL (1) NL7101751A (https=)
SE (1) SE377631B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767979A (en) * 1971-03-05 1973-10-23 Communications Transistor Corp Microwave hermetic transistor package
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3828228A (en) * 1973-03-05 1974-08-06 Hewlett Packard Co Microwave transistor package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
US6818477B2 (en) * 2001-11-26 2004-11-16 Powerwave Technologies, Inc. Method of mounting a component in an edge-plated hole formed in a printed circuit board
CN111554463B (zh) * 2020-05-11 2021-09-24 电子科技大学 一种宽频低涡流损耗的人工导体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2791731A (en) * 1957-05-07 Metal rectifier assemblies
NL179929C (https=) * 1952-11-03 1900-01-01 Du Pont
US2984890A (en) * 1956-12-24 1961-05-23 Gahagan Inc Crystal diode rectifier and method of making same
NL234330A (https=) * 1957-12-18
US2987658A (en) * 1958-01-10 1961-06-06 Philco Corp Improved semiconductor diode
US3266137A (en) * 1962-06-07 1966-08-16 Hughes Aircraft Co Metal ball connection to crystals
JPS5115155B2 (https=) * 1972-06-08 1976-05-14

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
SE377631B (https=) 1975-07-14
NL7101751A (https=) 1971-12-14
FR2094178B1 (https=) 1977-01-28
GB1302827A (https=) 1973-01-10
US3611059A (en) 1971-10-05
CA920718A (en) 1973-02-06
DE2111098A1 (de) 1971-12-16
BE763416A (fr) 1971-07-16
MY7400059A (en) 1974-12-31
JPS5135109B1 (https=) 1976-09-30

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Legal Events

Date Code Title Description
ST Notification of lapse