NL179929C - - Google Patents
Info
- Publication number
- NL179929C NL179929C NLAANVRAGE7608209,A NL179929DA NL179929C NL 179929 C NL179929 C NL 179929C NL 179929D A NL179929D A NL 179929DA NL 179929 C NL179929 C NL 179929C
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2792537X | 1952-11-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL179929C true NL179929C (https=) | 1900-01-01 |
Family
ID=7998471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NLAANVRAGE7608209,A NL179929C (https=) | 1952-11-03 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US2792537A (https=) |
| NL (1) | NL179929C (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2974262A (en) * | 1957-06-11 | 1961-03-07 | Abraham George | Solid state device and method of making same |
| BE620870A (https=) * | 1961-08-04 | 1900-01-01 | ||
| US3018425A (en) * | 1959-09-25 | 1962-01-23 | Westinghouse Electric Corp | Current rectifier assembly |
| US3168687A (en) * | 1959-12-22 | 1965-02-02 | Hughes Aircraft Co | Packaged semiconductor assemblies having exposed electrodes |
| US3134935A (en) * | 1961-09-06 | 1964-05-26 | Schauer Mfg Corp | Semi-conductor device comprising two elongated spaced apart bus electrodes |
| US3320498A (en) * | 1965-01-14 | 1967-05-16 | Elmer C Evans | Diode heat sink and circuit mount |
| US3611059A (en) * | 1970-06-11 | 1971-10-05 | Rca Corp | Transistor assembly |
| DE2258968C2 (de) * | 1972-12-01 | 1974-08-08 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Verfahren zur Herstellung eines abgeschlossenen Kontaktes |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2510588A (en) * | 1950-06-06 | Mounting and connecting device for |
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0
- NL NLAANVRAGE7608209,A patent/NL179929C/xx active
-
1953
- 1953-10-28 US US388851A patent/US2792537A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US2792537A (en) | 1957-05-14 |