FR2094178A1 - - Google Patents

Info

Publication number
FR2094178A1
FR2094178A1 FR7107883A FR7107883A FR2094178A1 FR 2094178 A1 FR2094178 A1 FR 2094178A1 FR 7107883 A FR7107883 A FR 7107883A FR 7107883 A FR7107883 A FR 7107883A FR 2094178 A1 FR2094178 A1 FR 2094178A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7107883A
Other versions
FR2094178B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2094178A1 publication Critical patent/FR2094178A1/fr
Application granted granted Critical
Publication of FR2094178B1 publication Critical patent/FR2094178B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
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    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01006—Carbon [C]
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    • H01L2924/01019—Potassium [K]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01039—Yttrium [Y]
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    • H01L2924/01047—Silver [Ag]
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
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    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Microwave Amplifiers (AREA)
FR7107883A 1970-06-11 1971-03-08 Expired FR2094178B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4543470A 1970-06-11 1970-06-11

Publications (2)

Publication Number Publication Date
FR2094178A1 true FR2094178A1 (fr) 1972-02-04
FR2094178B1 FR2094178B1 (fr) 1977-01-28

Family

ID=21937850

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7107883A Expired FR2094178B1 (fr) 1970-06-11 1971-03-08

Country Status (10)

Country Link
US (1) US3611059A (fr)
JP (1) JPS5135109B1 (fr)
BE (1) BE763416A (fr)
CA (1) CA920718A (fr)
DE (1) DE2111098A1 (fr)
FR (1) FR2094178B1 (fr)
GB (1) GB1302827A (fr)
MY (1) MY7400059A (fr)
NL (1) NL7101751A (fr)
SE (1) SE377631B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767979A (en) * 1971-03-05 1973-10-23 Communications Transistor Corp Microwave hermetic transistor package
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3828228A (en) * 1973-03-05 1974-08-06 Hewlett Packard Co Microwave transistor package
JPS5834755Y2 (ja) * 1978-09-18 1983-08-04 富士通株式会社 半導体装置
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
US4276558A (en) * 1979-06-15 1981-06-30 Ford Aerospace & Communications Corp. Hermetically sealed active microwave integrated circuit
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4538170A (en) * 1983-01-03 1985-08-27 General Electric Company Power chip package
US6818477B2 (en) * 2001-11-26 2004-11-16 Powerwave Technologies, Inc. Method of mounting a component in an edge-plated hole formed in a printed circuit board
CN111554463B (zh) * 2020-05-11 2021-09-24 电子科技大学 一种宽频低涡流损耗的人工导体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2791731A (en) * 1957-05-07 Metal rectifier assemblies
NL179929C (fr) * 1952-11-03 1900-01-01 Du Pont
US2984890A (en) * 1956-12-24 1961-05-23 Gahagan Inc Crystal diode rectifier and method of making same
NL234330A (fr) * 1957-12-18
US2987658A (en) * 1958-01-10 1961-06-06 Philco Corp Improved semiconductor diode
US3266137A (en) * 1962-06-07 1966-08-16 Hughes Aircraft Co Metal ball connection to crystals
JPS5115155B2 (fr) * 1972-06-08 1976-05-14

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Also Published As

Publication number Publication date
MY7400059A (en) 1974-12-31
NL7101751A (fr) 1971-12-14
SE377631B (fr) 1975-07-14
CA920718A (en) 1973-02-06
GB1302827A (fr) 1973-01-10
BE763416A (fr) 1971-07-16
JPS5135109B1 (fr) 1976-09-30
US3611059A (en) 1971-10-05
DE2111098A1 (de) 1971-12-16
FR2094178B1 (fr) 1977-01-28

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Legal Events

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ST Notification of lapse