FR2088302A1 - - Google Patents
Info
- Publication number
- FR2088302A1 FR2088302A1 FR7115623A FR7115623A FR2088302A1 FR 2088302 A1 FR2088302 A1 FR 2088302A1 FR 7115623 A FR7115623 A FR 7115623A FR 7115623 A FR7115623 A FR 7115623A FR 2088302 A1 FR2088302 A1 FR 2088302A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02233—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of the semiconductor substrate or a semiconductor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3413770A | 1970-05-04 | 1970-05-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2088302A1 true FR2088302A1 (de) | 1972-01-07 |
FR2088302B1 FR2088302B1 (de) | 1976-12-03 |
Family
ID=21874544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7115623A Expired FR2088302B1 (de) | 1970-05-04 | 1971-04-30 |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS4913909B1 (de) |
BE (1) | BE766651A (de) |
CA (1) | CA921617A (de) |
DE (1) | DE2120832C3 (de) |
FR (1) | FR2088302B1 (de) |
GB (1) | GB1299811A (de) |
MY (1) | MY7400018A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2337941A1 (fr) * | 1976-01-12 | 1977-08-05 | Rca Corp | Procede de fabrication d'un oxyde hybride |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5739058B2 (de) * | 1973-05-07 | 1982-08-19 | ||
JPS5299538U (de) * | 1976-01-26 | 1977-07-27 | ||
DE3005384C2 (de) * | 1979-02-15 | 1994-10-27 | Texas Instruments Inc | Verfahren zum Herstellen einer monolithischen integrierten Halbleiterschaltung |
JPS6118348U (ja) * | 1984-07-04 | 1986-02-03 | シャープ株式会社 | 石油燃焼器具 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1913718A1 (de) * | 1968-03-20 | 1969-10-09 | Rca Corp | Verfahren zur Herstellung eines Halbleiterbauelements |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL109817C (de) * | 1955-12-02 | |||
BE562973A (de) * | 1956-12-06 | 1900-01-01 |
-
1970
- 1970-12-26 JP JP45125074A patent/JPS4913909B1/ja active Pending
-
1971
- 1971-03-30 CA CA109180A patent/CA921617A/en not_active Expired
- 1971-04-28 DE DE2120832A patent/DE2120832C3/de not_active Expired
- 1971-04-28 GB GB01810/71A patent/GB1299811A/en not_active Expired
- 1971-04-30 FR FR7115623A patent/FR2088302B1/fr not_active Expired
- 1971-05-03 BE BE766651A patent/BE766651A/xx unknown
-
1974
- 1974-12-30 MY MY18/74A patent/MY7400018A/xx unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1913718A1 (de) * | 1968-03-20 | 1969-10-09 | Rca Corp | Verfahren zur Herstellung eines Halbleiterbauelements |
Non-Patent Citations (3)
Title |
---|
(REVUE AMERICAINE"JOURNAL OF THE ELECTROCHEMICAL SOCIETY",VOLUME 118,NO 1,JANVIER 1971."USE OF HCL GETTERING IN SILICON DEVICE PROCESSING"P.H.ROBINSON ET AL.PAGES 141-143.) * |
HCL GETTERING IN SILICON DEVICE PROCESSING"P.H.ROBINSON ET AL.PAGES 141-143.) * |
REVUE AMERICAINE"JOURNAL OF THE ELECTROCHEMICAL SOCIETY",VOLUME 118,NO 1,JANVIER 1971."USE OF * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2337941A1 (fr) * | 1976-01-12 | 1977-08-05 | Rca Corp | Procede de fabrication d'un oxyde hybride |
Also Published As
Publication number | Publication date |
---|---|
DE2120832B2 (de) | 1978-11-30 |
DE2120832A1 (de) | 1971-11-25 |
BE766651A (fr) | 1971-10-01 |
FR2088302B1 (de) | 1976-12-03 |
MY7400018A (en) | 1974-12-31 |
CA921617A (en) | 1973-02-20 |
DE2120832C3 (de) | 1982-06-03 |
JPS4913909B1 (de) | 1974-04-03 |
GB1299811A (en) | 1972-12-13 |