FR2080789A1 - - Google Patents

Info

Publication number
FR2080789A1
FR2080789A1 FR7106688A FR7106688A FR2080789A1 FR 2080789 A1 FR2080789 A1 FR 2080789A1 FR 7106688 A FR7106688 A FR 7106688A FR 7106688 A FR7106688 A FR 7106688A FR 2080789 A1 FR2080789 A1 FR 2080789A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7106688A
Other languages
French (fr)
Other versions
FR2080789B1 (OSRAM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2080789A1 publication Critical patent/FR2080789A1/fr
Application granted granted Critical
Publication of FR2080789B1 publication Critical patent/FR2080789B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P72/7402—
    • H10P72/0444—
    • H10W72/077—
    • H10W72/701—
    • H10P72/7416—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion
FR7106688A 1970-02-26 1971-02-26 Expired FR2080789B1 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1437670A 1970-02-26 1970-02-26

Publications (2)

Publication Number Publication Date
FR2080789A1 true FR2080789A1 (OSRAM) 1971-11-19
FR2080789B1 FR2080789B1 (OSRAM) 1977-06-17

Family

ID=21765106

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7106688A Expired FR2080789B1 (OSRAM) 1970-02-26 1971-02-26

Country Status (9)

Country Link
US (1) US3706409A (OSRAM)
JP (1) JPS545262B1 (OSRAM)
BE (1) BE763365A (OSRAM)
DE (1) DE2108850C2 (OSRAM)
FR (1) FR2080789B1 (OSRAM)
GB (1) GB1349183A (OSRAM)
IE (1) IE34943B1 (OSRAM)
NL (1) NL172606C (OSRAM)
SE (2) SE389225B (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
DE2436600A1 (de) * 1974-07-30 1976-02-19 Semikron Gleichrichterbau Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen
US4140265A (en) * 1975-06-26 1979-02-20 Kollmorgen Technologies Corporation Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
DE3621796A1 (de) * 1986-06-30 1988-01-07 Siemens Ag Verfahren zur verbesserung der nebensprechdaempfung bei einer optisch-elektronischen sensoranordnung
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
SG52223A1 (en) * 1992-01-08 1998-09-28 Murata Manufacturing Co Component supply method
DE4426809A1 (de) * 1994-07-28 1996-02-08 Siemens Ag Verfahren zum Bestücken eines Trägers mit Chips, insbesondere zum Herstellen von Sensoren zur Luftmassenmessung
KR0141952B1 (ko) * 1994-12-19 1998-06-01 문정환 반도체 패키지 및 그 제조방법
JP3772954B2 (ja) * 1999-10-15 2006-05-10 株式会社村田製作所 チップ状部品の取扱方法
US7576656B2 (en) * 2005-09-15 2009-08-18 Alien Technology Corporation Apparatuses and methods for high speed bonding

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762954A (en) * 1950-09-09 1956-09-11 Sylvania Electric Prod Method for assembling transistors
US3014447A (en) * 1956-06-08 1961-12-26 Sylvania Electric Prod Soldering machine and method
DE1163977B (de) * 1962-05-15 1964-02-27 Intermetall Sperrfreier Kontakt an einer Zone des Halbleiterkoerpers eines Halbleiterbauelementes
US3180551A (en) * 1963-03-27 1965-04-27 Kenneth L Richard Machine for soldering coils

Also Published As

Publication number Publication date
DE2108850C2 (de) 1983-11-24
NL172606B (nl) 1983-04-18
FR2080789B1 (OSRAM) 1977-06-17
DE2108850A1 (de) 1971-09-09
JPS545262B1 (OSRAM) 1979-03-15
IE34943L (en) 1971-08-26
NL7102435A (OSRAM) 1971-08-30
US3706409A (en) 1972-12-19
SE372138B (OSRAM) 1974-12-09
BE763365A (fr) 1971-07-16
GB1349183A (en) 1974-03-27
IE34943B1 (en) 1975-10-01
SE389225B (sv) 1976-10-25
NL172606C (nl) 1983-09-16

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Legal Events

Date Code Title Description
ST Notification of lapse