FR2053245B1 - - Google Patents

Info

Publication number
FR2053245B1
FR2053245B1 FR707027906A FR7027906A FR2053245B1 FR 2053245 B1 FR2053245 B1 FR 2053245B1 FR 707027906 A FR707027906 A FR 707027906A FR 7027906 A FR7027906 A FR 7027906A FR 2053245 B1 FR2053245 B1 FR 2053245B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR707027906A
Other versions
FR2053245A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2053245A1 publication Critical patent/FR2053245A1/fr
Application granted granted Critical
Publication of FR2053245B1 publication Critical patent/FR2053245B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q41/00—Combinations or associations of metal-working machines not directed to a particular result according to classes B21, B23, or B24
    • B23Q41/06—Features relating to organisation of working of machines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
FR707027906A 1969-07-29 1970-07-29 Expired FR2053245B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84573369A 1969-07-29 1969-07-29

Publications (2)

Publication Number Publication Date
FR2053245A1 FR2053245A1 (fr) 1971-04-16
FR2053245B1 true FR2053245B1 (fr) 1974-03-01

Family

ID=25295970

Family Applications (1)

Application Number Title Priority Date Filing Date
FR707027906A Expired FR2053245B1 (fr) 1969-07-29 1970-07-29

Country Status (5)

Country Link
US (1) US3765763A (fr)
JP (1) JPS5338599B1 (fr)
DE (1) DE2036562C2 (fr)
FR (1) FR2053245B1 (fr)
GB (1) GB1314590A (fr)

Families Citing this family (62)

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US6076652A (en) 1971-04-16 2000-06-20 Texas Instruments Incorporated Assembly line system and apparatus controlling transfer of a workpiece
CA1044379A (fr) * 1974-12-28 1978-12-12 Sony Corporation Dispositif de deplacement de pastilles
JPS5936417B2 (ja) * 1975-11-26 1984-09-04 株式会社デンソー 半導体基板への高周波誘導加熱による拡散装置
US4027246A (en) * 1976-03-26 1977-05-31 International Business Machines Corporation Automated integrated circuit manufacturing system
JPS5619635A (en) * 1979-07-27 1981-02-24 Hitachi Ltd Manufacturing apparatus
JPS5833697B2 (ja) * 1979-12-17 1983-07-21 ヱム・セテツク株式会社 フオトレジストの両面塗布装置
US4299518A (en) * 1980-03-03 1981-11-10 Texas Instruments Incorporated Manufacturing work station
GB2118323B (en) * 1982-01-16 1985-06-26 Nacanco Ltd Application of carrying handles to containers
JPS5978538A (ja) * 1982-10-27 1984-05-07 Toshiba Corp ダイボンダ装置
JPS5998520A (ja) * 1982-11-27 1984-06-06 Toshiba Mach Co Ltd 半導体気相成長装置
US4858102A (en) * 1985-07-19 1989-08-15 El Paso Technologies Company Distributed logic control system and method
US6103055A (en) * 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
GB2194500B (en) * 1986-07-04 1991-01-23 Canon Kk A wafer handling apparatus
DE3702775A1 (de) * 1987-01-30 1988-08-11 Leybold Ag Vorrichtung zum quasi-kontinuierlichen behandeln von substraten
DE3712064A1 (de) * 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung
US4816098A (en) * 1987-07-16 1989-03-28 Texas Instruments Incorporated Apparatus for transferring workpieces
US4818326A (en) * 1987-07-16 1989-04-04 Texas Instruments Incorporated Processing apparatus
US4838984A (en) * 1987-07-16 1989-06-13 Texas Instruments Incorporated Method for etching films of mercury-cadmium-telluride and zinc sulfid
US4832779A (en) * 1987-07-16 1989-05-23 Texas Instruments Incorporated Processing apparatus
US4820377A (en) * 1987-07-16 1989-04-11 Texas Instruments Incorporated Method for cleanup processing chamber and vacuum process module
US4867841A (en) * 1987-07-16 1989-09-19 Texas Instruments Incorporated Method for etch of polysilicon film
US4877757A (en) * 1987-07-16 1989-10-31 Texas Instruments Incorporated Method of sequential cleaning and passivating a GaAs substrate using remote oxygen plasma
US4872938A (en) * 1987-07-16 1989-10-10 Texas Instruments Incorporated Processing apparatus
US4904621A (en) * 1987-07-16 1990-02-27 Texas Instruments Incorporated Remote plasma generation process using a two-stage showerhead
US4832778A (en) * 1987-07-16 1989-05-23 Texas Instruments Inc. Processing apparatus for wafers
US4855016A (en) * 1987-07-16 1989-08-08 Texas Instruments Incorporated Method for etching aluminum film doped with copper
US4832777A (en) * 1987-07-16 1989-05-23 Texas Instruments Incorporated Processing apparatus and method
US4857132A (en) * 1987-07-16 1989-08-15 Texas Instruments Incorporated Processing apparatus for wafers
US4838990A (en) * 1987-07-16 1989-06-13 Texas Instruments Incorporated Method for plasma etching tungsten
US4891488A (en) * 1987-07-16 1990-01-02 Texas Instruments Incorporated Processing apparatus and method
US4855160A (en) * 1987-07-16 1989-08-08 Texas Instruments Incorporated Method for passivating wafer
US4830705A (en) * 1987-07-16 1989-05-16 Texas Instruments Incorporated Method for etch of GaAs
US4822450A (en) * 1987-07-16 1989-04-18 Texas Instruments Incorporated Processing apparatus and method
US4844773A (en) * 1987-07-16 1989-07-04 Texas Instruments Incorporated Process for etching silicon nitride film
US4849067A (en) * 1987-07-16 1989-07-18 Texas Instruments Incorporated Method for etching tungsten
US4828649A (en) * 1987-07-16 1989-05-09 Texas Instruments Incorporated Method for etching an aluminum film doped with silicon
US4842687A (en) * 1987-07-16 1989-06-27 Texas Instruments Incorporated Method for etching tungsten
US4842676A (en) * 1987-07-16 1989-06-27 Texas Instruments Incorporated Process for etch of tungsten
US4830700A (en) * 1987-07-16 1989-05-16 Texas Instruments Incorporated Processing apparatus and method
US4874723A (en) * 1987-07-16 1989-10-17 Texas Instruments Incorporated Selective etching of tungsten by remote and in situ plasma generation
US4837113A (en) * 1987-07-16 1989-06-06 Texas Instruments Incorporated Method for depositing compound from group II-VI
US4863558A (en) * 1987-07-16 1989-09-05 Texas Instruments Incorporated Method for etching tungsten
US4842686A (en) * 1987-07-17 1989-06-27 Texas Instruments Incorporated Wafer processing apparatus and method
DE3735449A1 (de) * 1987-10-20 1989-05-03 Convac Gmbh Fertigungssystem fuer halbleitersubstrate
US4988533A (en) * 1988-05-27 1991-01-29 Texas Instruments Incorporated Method for deposition of silicon oxide on a wafer
JP2598305B2 (ja) * 1988-06-06 1997-04-09 日東電工株式会社 半導体ウエハの処理システム
US5121331A (en) * 1988-09-23 1992-06-09 El Paso Technologies Method and apparatus for tracking a workpiece through a multi-station machine
US4875989A (en) * 1988-12-05 1989-10-24 Texas Instruments Incorporated Wafer processing apparatus
US4941429A (en) * 1988-12-20 1990-07-17 Texas Instruments Incorporated Semiconductor wafer carrier guide tracks
US5089441A (en) * 1990-04-16 1992-02-18 Texas Instruments Incorporated Low-temperature in-situ dry cleaning process for semiconductor wafers
US5403434A (en) * 1994-01-06 1995-04-04 Texas Instruments Incorporated Low-temperature in-situ dry cleaning process for semiconductor wafer
US5563095A (en) * 1994-12-01 1996-10-08 Frey; Jeffrey Method for manufacturing semiconductor devices
US5943230A (en) * 1996-12-19 1999-08-24 Applied Materials, Inc. Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
KR100234539B1 (ko) * 1996-12-24 1999-12-15 윤종용 반도체장치 제조용 식각 장치
JP2974069B2 (ja) * 1997-09-25 1999-11-08 イノテック株式会社 半導体デバイスの製造装置
US20020170673A1 (en) * 2000-04-29 2002-11-21 Tanguay Michael J. System and method of processing composite substrates within a high throughput reactor
JP4004248B2 (ja) * 2000-09-01 2007-11-07 大日本スクリーン製造株式会社 基板処理装置および基板検査方法
US6683006B2 (en) * 2001-06-25 2004-01-27 Tokyo Electron Limited Film forming method and film forming apparatus
DE102007054485B4 (de) * 2007-11-15 2011-12-01 Deutsche Cell Gmbh Siliziumoberflächen-Strukturierungs-Verfahren
KR101861008B1 (ko) * 2016-08-26 2018-05-25 한양대학교 산학협력단 원자층 증착 장비 및 그를 이용한 원자층 증착 방법
KR20200000638A (ko) * 2018-06-25 2020-01-03 주성엔지니어링(주) 기판 처리 장치 및 기판 처리 방법
CN113097104B (zh) * 2021-03-25 2022-08-02 青岛天仁微纳科技有限责任公司 一种方形基片的生产设备及其生产方法

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US436627A (en) * 1890-09-16 Jalbert
US2884113A (en) * 1959-04-28 converse iii
US1967889A (en) * 1930-08-05 1934-07-24 Keller Dorian Colorfilm Corp Machine for developing goffered moving picture films
US2251232A (en) * 1938-11-07 1941-07-29 Houston Corp Method and apparatus for developing film
GB570385A (en) * 1942-11-18 1945-07-04 Standard Telephones Cables Ltd Method of making selenium elements
US2805898A (en) * 1955-01-18 1957-09-10 Jr Edward A Willis Fluid current conveyor for fragile articles
US3307162A (en) * 1961-10-30 1967-02-28 Electro Nuclear Systems Corp Magnetic article encoding apparatus
FR1379093A (fr) * 1963-10-11 1964-11-20 Ensemble constitué par une table de cadrage et un appareil de développement photographique
GB1147924A (en) * 1965-05-27 1969-04-10 Ibm Improvements in machines for assembling articles on substrates
GB1202361A (en) * 1966-05-12 1970-08-19 David Theodore Nelson Williams Improvements in or relating to a programme-controlled machine tool installation
US3306420A (en) * 1966-02-07 1967-02-28 Homann Maytag G M B H Fa Conveyor apparatus
CH463394A (fr) * 1966-08-24 1968-09-30 Bouladon Gabriel Transporteur pneumatique
US3335839A (en) * 1966-09-26 1967-08-15 Udylite Corp Conveying machine
US3538270A (en) * 1967-01-23 1970-11-03 Werner W Buechner Photographic program timer

Also Published As

Publication number Publication date
DE2036562A1 (de) 1971-02-11
US3765763A (en) 1973-10-16
DE2036562C2 (de) 1986-11-27
GB1314590A (en) 1973-04-26
FR2053245A1 (fr) 1971-04-16
JPS5338599B1 (fr) 1978-10-16

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