FR2034731A1 - - Google Patents

Info

Publication number
FR2034731A1
FR2034731A1 FR7008093A FR7008093A FR2034731A1 FR 2034731 A1 FR2034731 A1 FR 2034731A1 FR 7008093 A FR7008093 A FR 7008093A FR 7008093 A FR7008093 A FR 7008093A FR 2034731 A1 FR2034731 A1 FR 2034731A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7008093A
Other languages
French (fr)
Other versions
FR2034731B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2034731A1 publication Critical patent/FR2034731A1/fr
Application granted granted Critical
Publication of FR2034731B1 publication Critical patent/FR2034731B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • H10P50/644—Anisotropic liquid etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/052—Strain gauge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
FR7008093A 1969-03-07 1970-03-06 Expired FR2034731B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB02226/69A GB1211499A (en) 1969-03-07 1969-03-07 A method of manufacturing semiconductor devices

Publications (2)

Publication Number Publication Date
FR2034731A1 true FR2034731A1 (enExample) 1970-12-11
FR2034731B1 FR2034731B1 (enExample) 1975-09-26

Family

ID=10000667

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7008093A Expired FR2034731B1 (enExample) 1969-03-07 1970-03-06

Country Status (4)

Country Link
JP (1) JPS4834454B1 (enExample)
DE (1) DE2010448A1 (enExample)
FR (1) FR2034731B1 (enExample)
GB (1) GB1211499A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4203128A (en) 1976-11-08 1980-05-13 Wisconsin Alumni Research Foundation Electrostatically deformable thin silicon membranes
US4238275A (en) * 1978-12-29 1980-12-09 International Business Machines Corporation Pyrocatechol-amine-water solution for the determination of defects
IT1212404B (it) * 1979-02-22 1989-11-22 Rca Corp Metodo comportante un singolo attacco per la formazione di un mesa presentante una parete a piu'gradini.
US4234361A (en) 1979-07-05 1980-11-18 Wisconsin Alumni Research Foundation Process for producing an electrostatically deformable thin silicon membranes utilizing a two-stage diffusion step to form an etchant resistant layer
US4498229A (en) * 1982-10-04 1985-02-12 Becton, Dickinson And Company Piezoresistive transducer
US4605919A (en) * 1982-10-04 1986-08-12 Becton, Dickinson And Company Piezoresistive transducer
JPS59136977A (ja) * 1983-01-26 1984-08-06 Hitachi Ltd 圧力感知半導体装置とその製造法
GB2145875B (en) * 1983-08-12 1986-11-26 Standard Telephones Cables Ltd Infra-red-detector
GB2146697B (en) * 1983-09-17 1986-11-05 Stc Plc Flexible hinge device
GB2209245A (en) * 1987-08-28 1989-05-04 Gen Electric Co Plc Method of producing a three-dimensional structure
JPH04342129A (ja) * 1991-05-17 1992-11-27 Sony Corp 層間絶縁膜の平坦化方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1273319A (fr) * 1960-01-04 1961-10-06 Pacific Semiconductors Procédé de traitement de la surface de corps semi-conducteurs
US3099591A (en) * 1958-12-15 1963-07-30 Shockley William Semiconductive device
FR1472688A (fr) * 1965-03-31 1967-03-10 Westinghouse Electric Corp Circuits intégrés à semi-conducteurs et procédé de fabrication correspondant
FR1483890A (fr) * 1965-04-26 1967-06-09 Siemens Ag Procédé de fabrication de circuits à semi-conducteurs

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099591A (en) * 1958-12-15 1963-07-30 Shockley William Semiconductive device
FR1273319A (fr) * 1960-01-04 1961-10-06 Pacific Semiconductors Procédé de traitement de la surface de corps semi-conducteurs
FR1472688A (fr) * 1965-03-31 1967-03-10 Westinghouse Electric Corp Circuits intégrés à semi-conducteurs et procédé de fabrication correspondant
FR1483890A (fr) * 1965-04-26 1967-06-09 Siemens Ag Procédé de fabrication de circuits à semi-conducteurs

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
REVUE AMERICAINE JOURNAL OF THE ELECTROCHEMICAL SOCIETY VOL. 114, NO. 9, SEPTEMBRE 1967, PAGES 965-970: "A WATER-AMINE COMPLEXING AGENT SYSTEM FOR ETCHING SILICON" R.M.FINNE ET AL. *
REVUE AMERICAINE JOURNAL OF THE ELECTROCHEMICAL SOCIETY, VOL. 116, NO. 9, SEPTEMBRE 1969, PAGES 1325-1326, "ETHYLENE DIAMINE-CATECHOL-WATER MIXTURE SHOWS PREFERENTIAL ETCHING OF P-N JUNCTION" DE J.C.GREENWOOD *

Also Published As

Publication number Publication date
FR2034731B1 (enExample) 1975-09-26
DE2010448A1 (enExample) 1970-09-24
JPS4834454B1 (enExample) 1973-10-22
GB1211499A (en) 1970-11-04

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Legal Events

Date Code Title Description
ST Notification of lapse