FR2001970A1 - - Google Patents
Info
- Publication number
- FR2001970A1 FR2001970A1 FR6903687A FR6903687A FR2001970A1 FR 2001970 A1 FR2001970 A1 FR 2001970A1 FR 6903687 A FR6903687 A FR 6903687A FR 6903687 A FR6903687 A FR 6903687A FR 2001970 A1 FR2001970 A1 FR 2001970A1
- Authority
- FR
- France
- Prior art keywords
- glass
- ceramic
- conductors
- holes
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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GB750768 | 1968-02-15 |
Publications (1)
Publication Number | Publication Date |
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FR2001970A1 true FR2001970A1 (fr) | 1969-10-03 |
Family
ID=9834448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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FR6903687A Withdrawn FR2001970A1 (fr) | 1968-02-15 | 1969-02-14 |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1907567A1 (fr) |
FR (1) | FR2001970A1 (fr) |
GB (1) | GB1232621A (fr) |
NL (1) | NL6902359A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4074342A (en) * | 1974-12-20 | 1978-02-14 | International Business Machines Corporation | Electrical package for lsi devices and assembly process therefor |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2111312A (en) * | 1981-11-04 | 1983-06-29 | Philips Electronic Associated | Substrates for electrical circuits |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
EP0139029A1 (fr) * | 1983-10-19 | 1985-05-02 | Olin Corporation | Empaquetage pour semi-conducteur |
US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
US4840654A (en) * | 1985-03-04 | 1989-06-20 | Olin Corporation | Method for making multi-layer and pin grid arrays |
US4712161A (en) * | 1985-03-25 | 1987-12-08 | Olin Corporation | Hybrid and multi-layer circuitry |
US4696851A (en) * | 1985-03-25 | 1987-09-29 | Olin Corporation | Hybrid and multi-layer circuitry |
US4687540A (en) * | 1985-12-20 | 1987-08-18 | Olin Corporation | Method of manufacturing glass capacitors and resulting product |
US4821151A (en) * | 1985-12-20 | 1989-04-11 | Olin Corporation | Hermetically sealed package |
US4725333A (en) * | 1985-12-20 | 1988-02-16 | Olin Corporation | Metal-glass laminate and process for producing same |
-
1968
- 1968-02-15 GB GB750768A patent/GB1232621A/en not_active Expired
-
1969
- 1969-02-14 DE DE19691907567 patent/DE1907567A1/de active Pending
- 1969-02-14 NL NL6902359A patent/NL6902359A/xx unknown
- 1969-02-14 FR FR6903687A patent/FR2001970A1/fr not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4074342A (en) * | 1974-12-20 | 1978-02-14 | International Business Machines Corporation | Electrical package for lsi devices and assembly process therefor |
Also Published As
Publication number | Publication date |
---|---|
NL6902359A (fr) | 1969-08-19 |
GB1232621A (fr) | 1971-05-19 |
DE1907567A1 (de) | 1969-09-18 |
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