GB1232621A - - Google Patents

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Publication number
GB1232621A
GB1232621A GB750768A GB1232621DA GB1232621A GB 1232621 A GB1232621 A GB 1232621A GB 750768 A GB750768 A GB 750768A GB 1232621D A GB1232621D A GB 1232621DA GB 1232621 A GB1232621 A GB 1232621A
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GB
United Kingdom
Prior art keywords
glass
ceramic
conductors
holes
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB750768A
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Publication date
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Publication of GB1232621A publication Critical patent/GB1232621A/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Glass Compositions (AREA)

Abstract

1,232,621. Glass-ceramic-metal structures; compositions. ENGLISH ELECTRIC CO. Ltd. 14 Feb., 1969 [15 Feb., 1968], No. 7507/68. Heading C1M. [Also in Division H1] An electrical component panel comprises a glass-ceramic insulated metal plate 10 for dissipating heat carrying a multilayer printed circuit. Copper plate 10 having holes 20, 21 formed therein in which are fused glass-ceramic compacts 22 carrying copper wires 23 is coated in the regions 10B, 10C with layers of ceramic glass insulation 12, 14. After forming through connections 24 by plating through etched holes in the layers 12, 14, edge connectors 11, voltage supply plane 13 and conductors 15 are formed by screen printing. Following the deposition of ceramic glass layer 16 and the formation of holes therethrough conductors 17 are deposited by screen printing some of the holes passing through the holes in layer 16 to form connections with conductors 15. Integrated circuit chips 19 are finally bonded to pads 15A formed simultaneously with the conductors 15. Section 10A of the metal plate is left uncoated and is clamped to a duct 30 carrying cooling fluid. The insulation layers may be made as separate thin glass sheets which are appropriately drilled and bonded to the substrate and the conductors may be formed by vacuum evaporation or by bonding thin metal foils to the assembly and etching. The chips may be fixed directly to the substrate. Ceramic-glass compositions.-The tubular contacts 22 have a composition SiO 2 68À3%, Li 2 O 9À7%, ZnO 19À4% and P 2 O 5 2À6%. After firing to 1000‹ C. in an atmosphere of nitrogen the assembly is cooled rapidly to 500‹ C., heated at 5‹ C. per min. to 800‹ C. and then cooled to room temperature in nitrogen atmosphere. Insulation layers 12, 14 of composition by weight SiO 2 54À2%, B 2 O 3 5À0%, Li 2 O 9À0%, Na 2 O 5À0%, ZnO 24.4% and P 2 O 5 2À3% are coated in a methylated spirit suspension, fired at a temperature of 950‹ C., held at a temperature of 500‹ C. for one hour, heated at 5‹ C. per min. to 750‹ C. held at this temperature for 1 hour and cooled to room temperature all in a nitrogen atmosphere. The insulating layer 16 having a composition by weight of SiO 2 36À4%, B 2 O 3 18À8%, Na 2 O 12À5%, K 2 O 6À3% and BaO 26À0% is screen printed, heated to 500‹ C. in air and then heated to 750‹ C. in nitrogen for 15 minutes.
GB750768A 1968-02-15 1968-02-15 Expired GB1232621A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB750768 1968-02-15

Publications (1)

Publication Number Publication Date
GB1232621A true GB1232621A (en) 1971-05-19

Family

ID=9834448

Family Applications (1)

Application Number Title Priority Date Filing Date
GB750768A Expired GB1232621A (en) 1968-02-15 1968-02-15

Country Status (4)

Country Link
DE (1) DE1907567A1 (en)
FR (1) FR2001970A1 (en)
GB (1) GB1232621A (en)
NL (1) NL6902359A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4687540A (en) * 1985-12-20 1987-08-18 Olin Corporation Method of manufacturing glass capacitors and resulting product
US4696851A (en) * 1985-03-25 1987-09-29 Olin Corporation Hybrid and multi-layer circuitry
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
US4725333A (en) * 1985-12-20 1988-02-16 Olin Corporation Metal-glass laminate and process for producing same
US4821151A (en) * 1985-12-20 1989-04-11 Olin Corporation Hermetically sealed package
US4840654A (en) * 1985-03-04 1989-06-20 Olin Corporation Method for making multi-layer and pin grid arrays

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor
GB2111312A (en) * 1981-11-04 1983-06-29 Philips Electronic Associated Substrates for electrical circuits
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
US4840654A (en) * 1985-03-04 1989-06-20 Olin Corporation Method for making multi-layer and pin grid arrays
US4696851A (en) * 1985-03-25 1987-09-29 Olin Corporation Hybrid and multi-layer circuitry
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
US4687540A (en) * 1985-12-20 1987-08-18 Olin Corporation Method of manufacturing glass capacitors and resulting product
US4725333A (en) * 1985-12-20 1988-02-16 Olin Corporation Metal-glass laminate and process for producing same
US4821151A (en) * 1985-12-20 1989-04-11 Olin Corporation Hermetically sealed package

Also Published As

Publication number Publication date
FR2001970A1 (en) 1969-10-03
DE1907567A1 (en) 1969-09-18
NL6902359A (en) 1969-08-19

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees