FR2001970A1 - - Google Patents

Info

Publication number
FR2001970A1
FR2001970A1 FR6903687A FR6903687A FR2001970A1 FR 2001970 A1 FR2001970 A1 FR 2001970A1 FR 6903687 A FR6903687 A FR 6903687A FR 6903687 A FR6903687 A FR 6903687A FR 2001970 A1 FR2001970 A1 FR 2001970A1
Authority
FR
France
Prior art keywords
glass
ceramic
conductors
holes
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6903687A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
English Electric Co Ltd
Original Assignee
English Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by English Electric Co Ltd filed Critical English Electric Co Ltd
Publication of FR2001970A1 publication Critical patent/FR2001970A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W70/6875—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H10W40/10—
    • H10W40/47—
    • H10W70/611—
    • H10W70/635—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Glass Compositions (AREA)
FR6903687A 1968-02-15 1969-02-14 Withdrawn FR2001970A1 (esLanguage)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB750768 1968-02-15

Publications (1)

Publication Number Publication Date
FR2001970A1 true FR2001970A1 (esLanguage) 1969-10-03

Family

ID=9834448

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6903687A Withdrawn FR2001970A1 (esLanguage) 1968-02-15 1969-02-14

Country Status (4)

Country Link
DE (1) DE1907567A1 (esLanguage)
FR (1) FR2001970A1 (esLanguage)
GB (1) GB1232621A (esLanguage)
NL (1) NL6902359A (esLanguage)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2111312A (en) * 1981-11-04 1983-06-29 Philips Electronic Associated Substrates for electrical circuits
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4570337A (en) * 1982-04-19 1986-02-18 Olin Corporation Method of assembling a chip carrier
EP0139029A1 (en) * 1983-10-19 1985-05-02 Olin Corporation Improved semiconductor package
US4862323A (en) * 1984-04-12 1989-08-29 Olin Corporation Chip carrier
US4853491A (en) * 1984-10-03 1989-08-01 Olin Corporation Chip carrier
US4712161A (en) * 1985-03-25 1987-12-08 Olin Corporation Hybrid and multi-layer circuitry
US4840654A (en) * 1985-03-04 1989-06-20 Olin Corporation Method for making multi-layer and pin grid arrays
US4696851A (en) * 1985-03-25 1987-09-29 Olin Corporation Hybrid and multi-layer circuitry
US4687540A (en) * 1985-12-20 1987-08-18 Olin Corporation Method of manufacturing glass capacitors and resulting product
US4821151A (en) * 1985-12-20 1989-04-11 Olin Corporation Hermetically sealed package
US4725333A (en) * 1985-12-20 1988-02-16 Olin Corporation Metal-glass laminate and process for producing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4074342A (en) * 1974-12-20 1978-02-14 International Business Machines Corporation Electrical package for lsi devices and assembly process therefor

Also Published As

Publication number Publication date
DE1907567A1 (de) 1969-09-18
GB1232621A (esLanguage) 1971-05-19
NL6902359A (esLanguage) 1969-08-19

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Legal Events

Date Code Title Description
ST Notification of lapse